المؤلفون: Hu, Kuifeng, Weng, Haixiao, Beetner, Daryl G., Pommerenke, David, Drewniak, James L.

المصدر: Electrical and Computer Engineering Faculty Research & Creative Works

مصطلحات موضوعية: Chip Scale Packages, Electric Power Transmission, Electromagnetic Compatibility, Electromagnetic Pulse, Integrated Circuits, Packaging, Printed Circuit Boards, Signal Interference, Timing Circuits, Displacement Currents, Distributed Modeling, Inductive Interference, Interconnect Power, Power Delivery Network, TEM-Cell Measurements, Transverse Electromagnetic Cell, Transverse Electromagnetic Cell (TEM), Electric Power Transmission Networks, Electromagnetic Inductive Interference, Electromagnetic Interference (EMI), Interconnect Power Systems, Transverse Electromagnetic Cell Emissions, Electrical and Computer Engineering

Relation: https://scholarsmine.mst.edu/ele_comeng_facwork/2378; https://doi.org/10.1109/TEMC.2011.2118214

الاتاحة: https://scholarsmine.mst.edu/ele_comeng_facwork/2378
https://doi.org/10.1109/TEMC.2011.2118214