المؤلفون: Jonathan Edward Barth

المصدر: The New England Quarterly. 87:490-525

مصطلحات موضوعية: History, Battle, Literature and Literary Theory, Sovereignty, Monarchy, media_common.quotation_subject, Law, Sociology, Ancient history, Colonialism, Independence, media_common

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5cf0edb0ac464e00deb538fa8afbd9d1
https://doi.org/10.1162/tneq_a_00396

المؤلفون: Shan Hu, Richard Hill, Vidya Kaushik, Alexey Vert, Uzma Rana, Richard Gaylord, Saikumar Vivekanand, PapaRao Satyavolu, Edward Barth, Joshua Herman, Tommaso Orzali, Tom Dyer

المصدر: 2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).

مصطلحات موضوعية: chemistry.chemical_compound, Materials science, Fabrication, Silicon, chemistry, Metallurgy, chemistry.chemical_element, Wafer, Edge (geometry), Contamination, Epitaxy, Bevel, Indium gallium arsenide

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3f910fa2993fc133147e23d13d7f9cca
https://doi.org/10.1109/asmc.2015.7164420

المؤلفون: Shawn G. Gibbs, Melissa Hoffman, Craig S. Davidson, Edward Barth, Pasquale V. Scarpino, Andrew WagnerA. Wagner, Christopher F. Green

المصدر: Journal of Environmental Engineering and Science. 5:75-79

مصطلحات موضوعية: Chlorine dioxide, Environmental Engineering, biology, Environmental remediation, Disinfectant, Stachybotrys chartarum, Contamination, biology.organism_classification, Pulp and paper industry, chemistry.chemical_compound, chemistry, Sodium hydroxide, Sodium hypochlorite, Environmental Chemistry, Aerosolization, General Environmental Science

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0b7503a06bde6af03014d2eb9baba97e
https://doi.org/10.1139/s05-037

المؤلفون: Jason Gill, Vincent J. McGahay, Yanfeng Wang, Alexander J. Swinton, Richard A. Wachnik, Edward Barth, R. Rosenberg, X.-H. Liu, H. S. Rathore, Paul S. McLaughlin, J.F. McGrath, Brett H. Engel, Michael Lane, G. Goth, Terry A. Spooner, William F. Landers, Conal E. Murray, Ping-Chuan Wang, Timothy M. Shaw, C. Barile, James R. Lloyd, T. H. Ivers, John M. Aitken, G. A. Biery, James J. Demarest, R. Goldblatt, Charles R. Davis, R. G. Filippi, L. Nicholson

المصدر: 2004 IEEE International Reliability Physics Symposium. Proceedings.

مصطلحات موضوعية: Stress (mechanics), Reliability (semiconductor), Materials science, Yield (engineering), chemistry, Electronic engineering, Copper interconnect, Low-k dielectric, chemistry.chemical_element, Dielectric, Atmospheric temperature range, Composite material, Copper

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::942a3df374b515e5dcd81e19921190cb
https://doi.org/10.1109/relphy.2004.1315302

المؤلفون: William F. Landers, D.K. Manger, Henry A. Nye, Sampath Purushothaman, Ronald D. Goldblatt, Naftali E. Lustig, Andrew H. Simon, Sandra G. Malhotra, Erdem Kaltalioglu, S Das, M. Stetter, Soon-Cheon Seo, Chenming Hu, J.B. Connolly, Timothy J. Dalton, John A. Fitzsimmons, Charles R. Davis, Birendra N. Agarwala, John E. Heidenreich, Andy Cowley, Daniel C. Edelstein, M.B. Anand, Spooner Terry A, Alina Deutsch, Vincent J. McGahay, H. Rathore, P.A. Emmi, Richard A. Wachnik, Mahadevaiyer Krishnan, P. Jones, Timothy M. Shaw, Stephan A. Cohen, J.G. Ryan, G. A. Biery, Z.G. Chen, Edward Barth, C.G. Faltermeier, J. L. Hedrick, Junjun Liu, C. DeWan, J.P. Hummel, B.E. Kastenmeier, Eric G. Liniger, R. Mih

المصدر: Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407).

مصطلحات موضوعية: Materials science, Passivation, business.industry, Copper interconnect, chemistry.chemical_element, Low-k dielectric, Dielectric, Fluorosilicate glass, Copper, Reliability (semiconductor), chemistry, Electronic engineering, Optoelectronics, Node (circuits), business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f502d66db4977250b7a53f4d4d4abd29
https://doi.org/10.1109/iitc.2000.854342

المؤلفون: Ian D. Melville, Henry A. Nye, Edward Barth, Paul S. McLaughlin, John A. Fitzsimmons, X. Chen, Vincent J. McGahay, T. H. Ivers, G. A. Biery, D.K. Manger, T.C. Chen, A. McDonald, E.N. Levine, Spooner Terry A, Ronald D. Goldblatt, S.E. Greco, C. DeWan

المصدر: Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407).

مصطلحات موضوعية: Materials science, business.industry, Electrical engineering, Copper interconnect, Silicon on insulator, chemistry.chemical_element, Fluorosilicate glass, Copper, Reliability (semiconductor), chemistry, CMOS, Hardware_INTEGRATEDCIRCUITS, Optoelectronics, Node (circuits), Static random-access memory, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2a0970f1f15214c5bdd917df14396507
https://doi.org/10.1109/iitc.2000.854330

المؤلفون: Sanjit K. Das, Jia Lee, Glenn A. Biery, Ronald D. Goldblatt, John A. Fitzsimmons, Wei-Tsu Tseng, Edward Barth

المصدر: MRS Proceedings. 732

مصطلحات موضوعية: chemistry.chemical_compound, Materials science, chemistry, Silicon nitride, Chemical-mechanical planarization, Silicon carbide, Interconnect technology, Nanotechnology, Hard mask

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bc4aa96b62ffd38cce1e5a216382b474
https://doi.org/10.1557/proc-732-i1.7