المؤلفون: Crema, Eduardo, Ribeiro, Lara Beatriz Prata, Adad, Sheila Jorge, Ectchebehere, Renata Margarida, Martins Júnior, Aiodair, Silva, Alex Augusto

المصدر: Revista da Sociedade Brasileira de Medicina Tropical. February 2007 40(1)

مصطلحات موضوعية: Chagas disease, Gallbladder, Cholelithiasis, Neuron count

وصف الملف: text/html

URL الوصول: http://old.scielo.br/scielo.php?script=sci_arttext&pid=S0037-86822007000100003

المؤلفون: Rack, Martin, Raskin, Jean-Pierre, Sun, X., Van der Plas, G., Absil, P., Beyne, E., 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

المساهمون: UCL - SST/ICTM/ELEN - Pôle en ingénierie électrique

Relation: boreal:208803; http://hdl.handle.net/2078.1/208803

الاتاحة: http://hdl.handle.net/2078.1/208803
https://doi.org/10.1109/ectc.2016.227

المؤلفون: L F Coffin, S S Manson, G R Halford, H M Hirshberg, Vaynman, Chmt-Ieee, Ectc, H D Solomon, L F Coffin Jr, Fracture, Chapman, Hall, L F London, Coffin, D Frear, D Grivas, M Mccormack, D Tribula, J W, D Morris Jr, L Quan, J W Morris Jr, R Berriche, S Vaynman, M E Fine, D A Jeannotte

المساهمون: The Pennsylvania State University CiteSeerX Archives

المصدر: http://proceedings.asmedigitalcollection.asme.org/data/Journals/JEPAE4/26122/190_1.pdf.

وصف الملف: application/pdf

Relation: http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.1089.3095; http://proceedings.asmedigitalcollection.asme.org/data/Journals/JEPAE4/26122/190_1.pdf

الاتاحة: http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.1089.3095
http://proceedings.asmedigitalcollection.asme.org/data/Journals/JEPAE4/26122/190_1.pdf

المؤلفون: Zhao, Peng, Li, Hong Yu, Lim, Yu Dian, Seit, Wen Wei, Guidoni, Luca, Tan, Chuan Seng

المساهمون: School of Electrical and Electronic Engineering, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

مصطلحات موضوعية: Engineering::Electrical and electronic engineering::Electronic packaging, Grounding Plane, Heterogenous Integration

Relation: NRF2020-NRF-ANR037 HIT; Zhao, P., Li, H. Y., Lim, Y. D., Seit, W. W., Guidoni, L. & Tan, C. S. (2022). The integration of grounding plane into tsv integrated ion trap for efficient thermal management in large scale quantum computing device. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 137-142. https://dx.doi.org/10.1109/ECTC51906.2022.00032; https://hdl.handle.net/10356/166181; 2-s2.0-85134705077; 137; 142

الاتاحة: https://hdl.handle.net/10356/166181
https://doi.org/10.1109/ECTC51906.2022.00032

المؤلفون: Peng Zhao, Hong Yu Li, Yu Dian Lim, Wen Wei Seit, Luca Guidoni, Chuan Seng Tan

المساهمون: School of Electrical and Electronic Engineering, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

مصطلحات موضوعية: Grounding Plane, Heterogenous Integration, Electrical and electronic engineering::Electronic packaging [Engineering]

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::282c41b0a3645547d9b878c05cc7fedc
https://hdl.handle.net/10356/166181

المؤلفون: Lin, Ye, Apriyana, Anak Agung Alit, Hong, Yu Li, Tan, Chuan Seng

المساهمون: School of Electrical and Electronic Engineering, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

مصطلحات موضوعية: Engineering::Electrical and electronic engineering::Semiconductors, Through-silicon Vias, MIM Capacitors

وصف الملف: application/pdf

Relation: A1783c0004; Lin, Y., Apriyana, A. A. A., Hong, Y. L., & Tan, C. S. (2020). Three-dimensional capacitor embedded in fully Cu-filled through-silicon via and its thermo-mechanical reliability for power delivery applications. 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 393-398. doi:10.1109/ECTC32862.2020.00070; https://hdl.handle.net/10356/144083; 393; 398

الاتاحة: https://hdl.handle.net/10356/144083
https://doi.org/10.1109/ECTC32862.2020.00070

المؤلفون: Chuan Seng Tan, Anak Agung Alit Apriyana, Ye Lin, Hongyu Li

المساهمون: School of Electrical and Electronic Engineering, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

مصطلحات موضوعية: 010302 applied physics, Materials science, Through-silicon via, business.industry, Electrical and electronic engineering::Semiconductors [Engineering], Bandwidth (signal processing), Three-dimensional integrated circuit, 02 engineering and technology, 021001 nanoscience & nanotechnology, Decoupling capacitor, 01 natural sciences, Capacitance, law.invention, Capacitor, Transmission electron microscopy, law, 0103 physical sciences, Through-silicon Vias, MIM Capacitors, Optoelectronics, 0210 nano-technology, business, Electrical impedance

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8cfce92d608811f66dee5c9b2bcd308d
https://hdl.handle.net/10356/144083

المؤلفون: Lin, Ye, Tan, Chuan Seng

المساهمون: School of Electrical and Electronic Engineering, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

مصطلحات موضوعية: Engineering::Electrical and electronic engineering::Semiconductors, 3D IC, TSV

وصف الملف: application/pdf

Relation: A1783c0004; Lin, Y., & Tan, C. S. (2018). Dielectric quality of 3D capacitor embedded in through-silicon via (TSV). Proceedings of the 2018 IEEE 68th Electronic Components and Technology Conference, 1158-1163. doi:10.1109/ECTC.2018.00178; https://hdl.handle.net/10356/142081; 2-s2.0-85051969929; 1158; 1163

الاتاحة: https://hdl.handle.net/10356/142081
https://doi.org/10.1109/ECTC.2018.00178

المؤلفون: Chuan Seng Tan, Ye Lin

المساهمون: School of Electrical and Electronic Engineering, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: 010302 applied physics, Materials science, Fabrication, Dielectric strength, Through-silicon via, business.industry, Electrical and electronic engineering::Semiconductors [Engineering], TSV, 02 engineering and technology, Dielectric, 021001 nanoscience & nanotechnology, 01 natural sciences, Capacitance, law.invention, Capacitor, law, Sputtering, 0103 physical sciences, Electrode, Optoelectronics, 3D IC, 0210 nano-technology, business

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::76763358cdd9b3214c7c493c9db6d567
https://doi.org/10.1109/ectc.2018.00178

المؤلفون: Tan, Chuan Seng, Razzaq, A., Wee, K. H., Li, K. H., Yu, H., Chua, S. L.

المساهمون: School of Electrical and Electronic Engineering, IEEE Electronic Components and Technology Conference (ECTC) (64th : 2014)

مصطلحات موضوعية: DRNTU::Engineering::Electrical and electronic engineering::Electronic systems

وصف الملف: 8 p.; application/pdf

Relation: Chua, S.L., Razzaq, A., Wee, K.H., Li, K.H., Yu, H., & Tan, C.S. (2014). TSV-less 3D stacking of MEMS and CMOS via low temperature Al-Au direct bonding with simultaneous formation of hermetic seal. IEEE Electronic Components and Technology Conference (ECTC) (64th : 2014), 324 - 331.; https://hdl.handle.net/10356/103614; http://hdl.handle.net/10220/24544

الاتاحة: https://hdl.handle.net/10356/103614
http://hdl.handle.net/10220/24544
https://doi.org/10.1109/ECTC.2014.6897306

المؤلفون: Chuan Seng Tan, King Ho Holden Li, K. H. Wee, Arsalan Razzaq, Hao Yu, S. L. Chua

المساهمون: School of Electrical and Electronic Engineering, IEEE Electronic Components and Technology Conference (ECTC) (64th : 2014)

مصطلحات موضوعية: Microelectromechanical systems, Wire bonding, Materials science, business.industry, Electrical engineering, Silicon on insulator, Direct bonding, Hermetic seal, law.invention, CMOS, Engineering::Electrical and electronic engineering::Electronic systems [DRNTU], law, Microsystem, Deep reactive-ion etching, Optoelectronics, business

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3484fea0a4b3e7f0a9b183499c2dfd4e
https://hdl.handle.net/10356/103614