المؤلفون: Eslam Rezaei (11918748), Kaveh Abbasi (11918751), Reza Pourhamid (11918754)

مصطلحات موضوعية: Materials Engineering not elsewhere classified, Engineering not elsewhere classified, ECAE process, fatigue crack growth rate, ultra-fine grains, copper, mechanical properties

Relation: https://figshare.com/articles/journal_contribution/sj-docx-2-pie-10_1177_09544089211067082_-_Supplemental_material_for_Effects_of_ECAE_process_on_the_fatigue_crack_growth_rate_of_copper_metal/18017028

الاتاحة: https://doi.org/10.25384/sage.18017028.v1

المؤلفون: Eslam Rezaei (11918748), Kaveh Abbasi (11918751), Reza Pourhamid (11918754)

مصطلحات موضوعية: Materials Engineering not elsewhere classified, Engineering not elsewhere classified, ECAE process, fatigue crack growth rate, ultra-fine grains, copper, mechanical properties

Relation: https://figshare.com/articles/journal_contribution/sj-docx-1-pie-10_1177_09544089211067082_-_Supplemental_material_for_Effects_of_ECAE_process_on_the_fatigue_crack_growth_rate_of_copper_metal/18017025

الاتاحة: https://doi.org/10.25384/sage.18017025.v1

المؤلفون: Hideaki YAMADA, Shigeharu KAMADO, Yo KOJIMA, Yu YOSHIDA, 吉田 雄, 小島 陽, 山田 英明, 鎌土 重晴

المصدر: 軽金属 / Journal of Japan Institute of Light Metals. 2001, 51(10):556

المؤلفون: Hideaki YAMADA, Shigeharu KAMADO, Yo KOJIMA, Yu YOSHIDA, 吉田 雄, 小島 陽, 山田 英明, 鎌土 重晴

المصدر: 軽金属 / Journal of Japan Institute of Light Metals. 2001, 51(10):551

المؤلفون: Lawrence CISAR, Shigeharu KAMADO, Yo KOJIMA, Yu YOSHIDA, 吉田 雄, 小島 陽, 鎌土 重晴

المصدر: 軽金属 / Journal of Japan Institute of Light Metals. 2002, 52(11):559

المؤلفون: Matteo Codecasa, Francesca Passaretti, Carlo Fanciulli, P. Tomeš, S. Ceresara, Anke Weidenkaff

المصدر: Journal of electronic materials 40 (2011): 557–560. doi:10.1007/s11664-010-1450-7
info:cnr-pdr/source/autori:S. Ceresara, M. Codecasa, F. Passaretti, P. Tomeš, A. Weidenkaff, C. Fanciulli/titolo:Thermoelectric Properties of In Situ Formed Bi0.85Sb0.15%2FBi-Rich Particles Composite/doi:10.1007%2Fs11664-010-1450-7/rivista:Journal of electronic materials/anno:2011/pagina_da:557/pagina_a:560/intervallo_pagine:557–560/volume:40

مصطلحات موضوعية: Materials science, Equal channel angular extrusion, Metallurgy, Bi-Sb thermoelectric alloy, in situ composite, ECAE process, cryogenic thermoelectric generator, Solidus, Atmospheric temperature range, Condensed Matter Physics, Thermoelectric materials, Electronic, Optical and Magnetic Materials, Thermoelectric generator, Seebeck coefficient, Thermoelectric effect, Materials Chemistry, Grain boundary, Electrical and Electronic Engineering, Composite material, BI-SB ALLOYS

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::790989bd4ea01f199ea9621f87d209dd
https://doi.org/10.1007/s11664-010-1450-7

المؤلفون: Nagasekhar, AV, Yoon, SC, Tick-Hon, Y, Kim, HS

المساهمون: 신소재공학과, 10056225, Kim, HS

مصطلحات موضوعية: Equal channel angular pressing, Equal channel angular extrusion, Severe plastic deformation, Finite element modelling, Strain homogeneity, Peak load, FINE GRAINED MATERIALS, DEFORMATION-BEHAVIOR, PLASTIC-DEFORMATION, BILLET DEFORMATION, ECAE PROCESS, TOOL-ANGLES, EXTRUSION, SIMULATION, FLOW, HOMOGENEITY, 3D, DIE, POWDER

Relation: COMPUTATIONAL MATERIALS SCIENCE; 46; 347; 351; SCI급, SCOPUS 등재논문; SCIE; Materials Science, Multidisciplinary; Materials Science; 2009-OAK-0000019946; https://oasis.postech.ac.kr/handle/2014.oak/27551; 10188; COMPUTATIONAL MATERIALS SCIENCE, v.46, no.2, pp.347 - 351; 000269599200013; 2-s2.0-67651119976

الاتاحة: https://oasis.postech.ac.kr/handle/2014.oak/27551
https://doi.org/10.1016/J.COMMATSCI.2009.03.018

المؤلفون: Kwak, EJ, Bok, CH, Seo, MH, Kim, TS, Kim, HS

المساهمون: 신소재공학과, 10056225, Kim, HS

مصطلحات موضوعية: ELEVATED-TEMPERATURES, PLASTIC-DEFORMATION, FVM SIMULATION, ECAE PROCESS, MG ALLOYS, EXTRUSION, BEHAVIOR, magnesium, equal channel angular pressing, severe plastic deformation, grain refinement, processing temperature, instrumented indentation

Relation: MATERIALS TRANSACTIONS; 49; 1006; 1010; SCI급, SCOPUS 등재논문; SCI; Materials Science, Multidisciplinary; Metallurgy & Metallurgical Engineering; Materials Science; 2008-OAK-0000017255; https://oasis.postech.ac.kr/handle/2014.oak/28724; 8611; MATERIALS TRANSACTIONS, v.49, no.5, pp.1006 - 1010; 000256950400024; 2-s2.0-46749105272

الاتاحة: https://oasis.postech.ac.kr/handle/2014.oak/28724
https://doi.org/10.2320/matertrans.MC200725

المؤلفون: Im, Y.T., Lee, J.H, Son, I.H., Chon, S.H., Park, J.K.

مصطلحات موضوعية: ECAE process, Design guideline, Uniform strain distribution

الاتاحة: http://hdl.handle.net/10203/10495
https://doi.org/10.1016/j.jmatprotec.2007.03.055