المؤلفون: Meng, Dehai, Zhang, Changming, Yang, Fan, Duan, Feixiang

المصدر: Materials (1996-1944); Jan2025, Vol. 18 Issue 2, p221, 19p

مصطلحات موضوعية: FATIGUE life, FATIGUE cracks, FINITE element method, STRUCTURAL optimization, ALLOY analysis, TITANIUM alloys

المؤلفون: Zhu, Xiandong, Xie, Shangjing, Chen, Jiawei, Lu, Qiaohong, Wang, Xiaowu, Duan, Feixiang, Xu, Sinian, Zhang, Yan, Huang, Hongjian, Wang, Yongqiang, Wang, Hongwei, Chen, Bicheng, Huang, Huanjie

المصدر: International Journal of Endocrinology; 10/7/2023, p1-11, 11p

مصطلحات موضوعية: TREATMENT of diabetic neuropathies, ISLANDS of Langerhans transplantation, STATISTICS, SILDENAFIL, ANIMAL experimentation, ONE-way analysis of variance, IMMUNOHISTOCHEMISTRY, CELLULAR signal transduction, TREATMENT effectiveness, T-test (Statistics), CELL survival, RESEARCH funding, DESCRIPTIVE statistics, COMBINED modality therapy, DATA analysis software, DATA analysis, BIOLOGICAL assay, MICE, PHARMACODYNAMICS

المؤلفون: Zhu, Xiandong, Duan, Feixiang, Zhang, Yan, Wang, Xiaowu, Wang, Yongqiang, Chen, Jiawei, Zhang, Lanyu, Wu, Minmin, Pan, Zhuo, Chen, Bicheng

المساهمون: National Natural Science Foundation of China

المصدر: International Immunopharmacology ; volume 111, page 109165 ; ISSN 1567-5769

الاتاحة: http://dx.doi.org/10.1016/j.intimp.2022.109165
https://api.elsevier.com/content/article/PII:S156757692200649X?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S156757692200649X?httpAccept=text/plain

المؤلفون: Duan, Feixiang, Wang, Xiaowu, Wang, Hongwei, Wang, Yongqiang, Zhang, Yan, Chen, Jiawei, Zhu, Xiandong, Chen, Bicheng

المصدر: International Immunopharmacology ; volume 108, page 108777 ; ISSN 1567-5769

الاتاحة: http://dx.doi.org/10.1016/j.intimp.2022.108777
https://api.elsevier.com/content/article/PII:S1567576922002612?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S1567576922002612?httpAccept=text/plain

المؤلفون: Ni, Xiaobing, Ge, Mengke, Tao, Yongjin, Sun, Wendi, Duan, Feixiang, Bai, Xuefei, Xu, Qi, Chen, Song, Kang, Yi

المصدر: Circuits and Systems II: Express Briefs, IEEE Transactions on; August 2023, Vol. 70 Issue: 8 p3054-3058, 5p