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1Conference
المؤلفون: Chiarella, T., Matagne, P., Mertens, H., Hosseini, M., Zhou, X., Eyben, P., Arimura, H., Gupta, A., Richard, O., Drijbooms, C., Caluwaerts, R., Horiguchi, N., Mitard, J.
المصدر: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
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2Academic Journal
المؤلفون: Magnarin, L., Agati, M., Belmonte, A., Subhechha, S., Rassoul, N., Drijbooms, C., Dekkers, H., Celano, U.
المصدر: ISSN: 1946-1550.
مصطلحات موضوعية: ddc:620, Engineering & allied operations, info:eu-repo/classification/ddc/620
Relation: Proceedings of the 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA); info:eu-repo/semantics/altIdentifier/isbn/978-1-66549-815-9; info:eu-repo/semantics/altIdentifier/issn/1946-1550; https://publikationen.bibliothek.kit.edu/1000152535
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3Academic Journal
المؤلفون: Celano U., Gomez A., Piedimonte P., Neumayer S., Collins L., Popovici M., Florent K., McMitchell S. R. C., Favia P., Drijbooms C., Bender H., Paredis K., Di Piazza L., Jesse S., Van Houdt J., van der Heide P.
المساهمون: Celano, U., Gomez, A., Piedimonte, P., Neumayer, S., Collins, L., Popovici, M., Florent, K., Mcmitchell, S. R. C., Favia, P., Drijbooms, C., Bender, H., Paredis, K., Di Piazza, L., Jesse, S., Van Houdt, J., van der Heide, P.
مصطلحات موضوعية: Atomic force microscopy, Band-excitation piezoresponse force microscopy, Binary oxide ferroelectrics, HfO2-based ferroelectrics, Si-doped HfO
وصف الملف: ELETTRONICO
Relation: info:eu-repo/semantics/altIdentifier/pmid/32796703; info:eu-repo/semantics/altIdentifier/wos/WOS:000567275600001; volume:10; issue:8; firstpage:1; lastpage:15; numberofpages:15; journal:NANOMATERIALS; http://hdl.handle.net/11311/1146044; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85090254672
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4Conference
المؤلفون: Bender, H., Drijbooms, C., Radisic, A., Seiler, David G., Diebold, Alain C., McDonald, Robert, Chabli, Amal, Secula, Erik M.
المصدر: AIP Conference Proceedings ; page 274-278 ; ISSN 0094-243X
الاتاحة: http://dx.doi.org/10.1063/1.3657903
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5Academic Journal
المؤلفون: Bender, H, Franquet, A, Drijbooms, C, Parmentier, B, Clarysse, T, Vandervorst, W, Kwakman, L
المصدر: Semiconductor Science and Technology ; volume 30, issue 11, page 114015 ; ISSN 0268-1242 1361-6641
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6Book
المؤلفون: Bender, H, Richard, O, Van Marcke, P, Drijbooms, C
المصدر: Springer Proceedings in Physics ; Microscopy of Semiconducting Materials ; page 397-400 ; ISSN 0930-8989 ; ISBN 9783540319146 9783540319153
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7Academic Journal
المؤلفون: Radisic, A., Lühn, O., Philipsen, H.G.G., El-Mekki, Z., Honore, M., Rodet, S., Armini, S., Drijbooms, C., Bender, H., Ruythooren, W.
المصدر: Microelectronic Engineering ; volume 88, issue 5, page 701-704 ; ISSN 0167-9317
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8Academic Journal
المؤلفون: Bender, H., Drijbooms, C., Van Marcke, P., Geypen, J., Philipsen, H. G. G., Radisic, A.
المصدر: Journal of Materials Science ; volume 47, issue 18, page 6497-6504 ; ISSN 0022-2461 1573-4803
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9Conference
المؤلفون: Bender, H., Van Marcke, P., Drijbooms, C., Roussel, P.
المصدر: The 1998 international conference on characterization and metrology for ULSI technology ; page 863-867
الاتاحة: http://dx.doi.org/10.1063/1.56880
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10Academic Journal
المؤلفون: Volders, H., Tokei, Z., Bender, H., Brijs, B., Caluwaerts, R., Carbonell, L., Conard, T., Drijbooms, C., Franquet, A., Garaud, S., Hoflijk, I., Moussa, A., Sinapi, F., Travaly, Y., Vanhaeren, D., Vereecke, G., Zhao, C., Li, W.-M., Sprey, H., Jonas, Alain M.
المساهمون: UCL - FSA/MAPR - Département des sciences des matériaux et des procédés
المصدر: Microelectronic Engineering, Vol. 84, no. 11, p. 2460-2465 (2007)
Relation: boreal:59512; http://hdl.handle.net/2078.1/59512; urn:ISSN:0167-9317; urn:EISSN:1873-5568
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11Electronic Resource
المؤلفون: UCL - FSA/MAPR - Département des sciences des matériaux et des procédés, Volders, H., Tokei, Z., Bender, H., Brijs, B., Caluwaerts, R., Carbonell, L., Conard, T., Drijbooms, C., Franquet, A., Garaud, S., Hoflijk, I., Moussa, A., Sinapi, F., Travaly, Y., Vanhaeren, D., Vereecke, G., Zhao, C., Li, W.-M., Sprey, H., Jonas, Alain M.
المصدر: Microelectronic Engineering, Vol. 84, no. 11, p. 2460-2465 (2007)
مصطلحات الفهرس: Barrier, Atomic Layer Deposition, Ald, Wnxcy, Wnx, Wcx, info:eu-repo/semantics/article
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12Conference
المؤلفون: Mody, J., Zschatzsch, G., Kolling, S., De Keersgieter, A., Eneman, G., Kambham, A K, Drijbooms, C., Schulze, A., Chiarella, T., Horiguchi, N., Eyben, P., Vandervorst, W.
المصدر: 2012 12th International Workshop on Junction Technology; 1/ 1/2012, p94-99, 6p
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13Conference
المؤلفون: Kauerauf, T., Butera, G., Croes, K., Demuynck, S., Wilson, C.J., Roussel, P., Drijbooms, C., Bender, H., Lofrano, M., Vandevelde, B., To?kei, Z., Groeseneken, G.
المصدر: 2010 IEEE International Reliability Physics Symposium (IRPS); 2010, p712-716, 5p
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14Book
المؤلفون: Cullis, A. G., Hutchison, J. L., Bender, H., Richard, O., Marcke, P., Drijbooms, C.
المصدر: Microscopy of Semiconducting Materials; 2005, p397-400, 4p
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15Academic Journal
المؤلفون: Bender, H., Drijbooms, C., Marcke, P., Geypen, J., Philipsen, H., Radisic, A.
المصدر: Journal of Materials Science; Sep2012, Vol. 47 Issue 18, p6497-6504, 8p
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16Conference
المؤلفون: Mody, J., Zschatzsch, G., Kolling, S., De Keersgieter, A., Eneman, G., Kambham, A K, Drijbooms, C., Schulze, A., Chiarella, T., Horiguchi, N., Hoffmann, T-Y, Eyben, P., Vandervorst, W.
المصدر: 2011 IEEE International Electron Devices Meeting (IEDM); 2011, p1-1, 0p