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المؤلفون: Hon Kwan Wu, Prakash Chauhan, JP Maaninen, Jeff Calow, Yoshiaki Hase, Sergey N. Sokolov, Marisabel Guevara, Cho Mon Kyaw, Parthasarathy Ranganathan, Elisha Indupalli, Ben Gelb, Niranjani Dasharathi, Narayana Penukonda, Yuan Li, Mark S. Wachsler, Roy W. Huffman, In Suk Chong, Fong Lou, Aaron Laursen, Yolanda Ripley, Don Stark, David Alexander Munday, Eric Perkins-Argueta, Amir Salek, Jia Feng, Aki Kuusela, Sathish Sekar, Ramon Macias, Indira Jayaram, Brian Fosco, Daniel Stodolsky, Clinton Wills Smullen, Anna Cheung, Sandeep Bhatia, Ville-Mikko Rautio, Maire Mahony, Kyle Lucke, Devin Persaud, Poonacha Kongetira, Mercedes Tan, Srikanth Muroor, Raghu Balasubramanian, C. Richard Ho, Andrew C. Walton, Jeremy Dorfman, He Dake, Alex Ramirez, David A. Wickeraad, Sara J. Gwin, Robert Springer, Samuel Foss, Alvin Wijaya
المصدر: ASPLOS
مصطلحات موضوعية: Multimedia, business.industry, Computer science, Cloud gaming, 030229 sport sciences, 02 engineering and technology, Transcoding, Video processing, Internet traffic, computer.software_genre, 020202 computer hardware & architecture, 03 medical and health sciences, 0302 clinical medicine, Videoconferencing, Software deployment, 0202 electrical engineering, electronic engineering, information engineering, Data center, Augmented reality, business, computer
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المؤلفون: Chris H. Kim, John Keane, Xiaofei Wang, Devin Persaud
المصدر: IEEE Journal of Solid-State Circuits. 45:817-829
مصطلحات موضوعية: Engineering, business.industry, High voltage, Time-dependent gate oxide breakdown, Hardware_PERFORMANCEANDRELIABILITY, Ring oscillator, Circuit reliability, Reliability (semiconductor), CMOS, Logic gate, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Electrical and Electronic Engineering, business, Hot-carrier injection
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المؤلفون: Devin Persaud, Chris H. Kim, Xiaofei Wang, John Keane
المصدر: 2010 IEEE International Conference on Integrated Circuit Design and Technology.
مصطلحات موضوعية: Reliability (semiconductor), Materials science, Dielectric strength, Logic gate, Electronic engineering, System on a chip, Time-dependent gate oxide breakdown, Chip, Temperature measurement, Hot-carrier injection