المؤلفون: A S M Raufur Chowdhury, Monjur Morshed Rabby, Mehzabeen Kabir, Partha Pratim Das, Rabin Bhandari, Rassel Raihan, Dereje Agonafer

المصدر: Materials; Volume 14; Issue 13; Pages: 3565

مصطلحات موضوعية: thermal gap filler material, dynamic mechanical analysis, thermomechanical analysis, differential scanning calorimetry, Fourier transform infrared spectroscopy, broadband dielectric spectroscopy

وصف الملف: application/pdf

Relation: Electronic Materials; https://dx.doi.org/10.3390/ma14133565

الاتاحة: https://doi.org/10.3390/ma14133565

المؤلفون: Pardeep Shahi, Hardik Yashwant Hurnekar, Apurv Deshmukh, Satyam Saini, Pratik Bansode, Rajesh Kasukurthy, Dereje Agonafer

المصدر: Journal of Enhanced Heat Transfer. 30:15-33

مصطلحات موضوعية: Fluid Flow and Transfer Processes, Mechanical Engineering, Condensed Matter Physics

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9fbc1604fdd4a1df5e2b30c08257927d
https://doi.org/10.1615/jenhheattransf.2022044476

المؤلفون: Pardeep Shahi, Apurv Deshmukh, Hardik Yashwant Hurnekar, Satyam Saini, Pratik Bansode, Dereje Agonafer

المصدر: Journal of Enhanced Heat Transfer. 30:35-52

مصطلحات موضوعية: Fluid Flow and Transfer Processes, Mechanical Engineering, Condensed Matter Physics

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8e3dd6d5e1bd495c00527bca197bd867
https://doi.org/10.1615/jenhheattransf.2022044339

المؤلفون: Satyam Saini, Tushar Wagh, Pratik Bansode, Pardeep Shahi, Joseph Herring, Jacob Lamotte-Dawaghreh, Jimil M. Shah, Dereje Agonafer

المصدر: Journal of Enhanced Heat Transfer. 29:15-35

مصطلحات موضوعية: Fluid Flow and Transfer Processes, Mechanical Engineering, Condensed Matter Physics

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c361e9ee274ceec16b7573385196d665
https://doi.org/10.1615/jenhheattransf.2022043805

المؤلفون: Pardeep Shahi, Satyam Saini, Pratik Bansode, Rajesh Kasukurthy, Dereje Agonafer

المصدر: Journal of Enhanced Heat Transfer. 29:27-39

مصطلحات موضوعية: Fluid Flow and Transfer Processes, Mechanical Engineering, Condensed Matter Physics

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f304496f0db31305fae6b55872adf324
https://doi.org/10.1615/jenhheattransf.2022043678

المؤلفون: Pratik Bansode, Gautam Gupta, Mohan Sai Ramalingam, Vivek Nair, Sai Abhideep Pundla, Satyam Saini, Pardeep Shahi, Dereje Agonafer, Metodi Zlatinov, Denver Schaffarzick

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::af42854be83e214a5f7f7a6eaa2cf972
https://doi.org/10.2139/ssrn.4402852

المؤلفون: Prajwal Murthy, Gautam Gupta, Joseph Herring, Jacob Lamotte-Dawaghreh, Krishna Bhavana Sivaraju, Pratik Bansode, Himanshu Modi, Dereje Agonafer, Poornima Mynampati, Mike Sweeney

المصدر: ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3ac1d80a17a629570a196dd248a8977b
https://doi.org/10.1115/ipack2022-97402

المؤلفون: Vibin Shalom Simon, Himanshu Modi, Krishna Bhavana Sivaraju, Pratik Bansode, Satyam Saini, Pardeep Shahi, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer

المصدر: ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0ec83397ff8cd9b95dee13dfd8c3908c
https://doi.org/10.1115/ipack2022-97494

المؤلفون: Himanshu Modi, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Gautam Gupta, Pratik Bansode, Vibin Shalom Simon, Dereje Agonafer

المصدر: ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3bdc26393762589d547ec24c38aae14a
https://doi.org/10.1115/ipack2022-97587

المؤلفون: Rabin Bhandari, Akshay Boovanahally Lakshminarayana, Krishna Bhavana Sivaraju, Pratik Vithoba Bansode, Ephrem Kejela, Dereje Agonafer

المصدر: ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::252e6ee58ce80e40c1fcaf1df6e84009
https://doi.org/10.1115/ipack2022-97423

المؤلفون: Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Satyam Saini, Pratik Bansode, Harold Miyamura, Dereje Agonafer, Jeremy Rodriguez

المصدر: ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f438a6ebdee12e2861551b3283e9a3bd
https://doi.org/10.1115/ipack2022-97416

المؤلفون: Vibin Shalom Simon, Lochan Sai Reddy, Pardeep Shahi, Amrutha Valli, Satyam Saini, Himanshu Modi, Pratik Bansode, Dereje Agonafer

المصدر: ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::13d5f7b35c7d540a7f41a54d6d8420ab
https://doi.org/10.1115/ipack2022-97445

المؤلفون: Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Chandraprakash Hinge, Lochan Sai Reddy Cinthaparthy, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Jeremy Rodriguez

المصدر: ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a4f1573e10261c22bd3b8e51512e3ce1
https://doi.org/10.1115/ipack2022-97434

المؤلفون: Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Akiilessh Sivakumar, Akshay Lakshminarayana, Harold Miyamura, Gautam Gupta, Dereje Agonafer, Jeremy Rodriguez

المصدر: ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7ed831ae94d0759b71086603a33bf7d2
https://doi.org/10.1115/ipack2022-97425

المؤلفون: Krishna Bhavana Sivaraju, Pratik Bansode, Gautam Gupta, Jacob Lamotte-Dawaghreh, Satyam Saini, Vibin Simon, Joseph Herring, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer

المصدر: ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4277a4ac4a54f74cf66be206af5e2690
https://doi.org/10.1115/ipack2022-97429

المؤلفون: Joseph Herring, Peter Smith, Jacob Lamotte-Dawaghreh, Pratik Bansode, Satyam Saini, Rabin Bhandari, Dereje Agonafer

المصدر: ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::22a3e3134c1050088cfb25f6162cf9ba
https://doi.org/10.1115/ipack2022-97481

المؤلفون: Dereje Agonafer, Pratik Bansode, Pardeep Shahi, Satyam Saini

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:616-624

مصطلحات موضوعية: Air cooling, Web server, Computer cooling, business.industry, 020209 energy, 02 engineering and technology, DIMM, 021001 nanoscience & nanotechnology, computer.software_genre, Industrial and Manufacturing Engineering, Automotive engineering, Electronic, Optical and Magnetic Materials, Coolant, Server, 0202 electrical engineering, electronic engineering, information engineering, Environmental science, Data center, Central processing unit, Electrical and Electronic Engineering, 0210 nano-technology, business, computer

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::19f15f3e0fb1abdfaeb5b78cf78fbd9b
https://doi.org/10.1109/tcpmt.2021.3067045

المؤلفون: Abel Misrak, Rabin Bhandari, Dereje Agonafer

المصدر: Journal of Electronic Packaging. 145

مصطلحات موضوعية: Mechanics of Materials, Electrical and Electronic Engineering, Computer Science Applications, Electronic, Optical and Magnetic Materials

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5ee950ffaece0327ef9f6bef3a5d832b
https://doi.org/10.1115/1.4054784

المؤلفون: Akshay Lakshminarayana, Milena Vujosevic, Dereje Agonafer, Abel Misrak, Tushar Chauhan, A S M Raufur Chowdhury, Rabin Bhandari, Fahad Mirza, B. Gholami Bazehhour

المصدر: Journal of Microelectronics and Electronic Packaging. 18:21-28

مصطلحات موضوعية: 010302 applied physics, Materials science, Computer Networks and Communications, Nanotechnology, 02 engineering and technology, Mems sensors, 021001 nanoscience & nanotechnology, 01 natural sciences, Die (integrated circuit), Electronic, Optical and Magnetic Materials, 0103 physical sciences, Sample preparation, Electrical and Electronic Engineering, 0210 nano-technology

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b489f8d69d64b5841520cf64271ee8af
https://doi.org/10.4071/imaps.1234982

المؤلفون: Krishna Bhavana Sivaraju, A S M Raufur Chowdhury, Dereje Agonafer, Tushar Chauhan, Rabin Bhandari

المصدر: Journal of Enhanced Heat Transfer. 28:73-90

مصطلحات موضوعية: Fluid Flow and Transfer Processes, Printed circuit board, Materials science, Mechanical Engineering, Immersion (virtual reality), Composite material, Condensed Matter Physics

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::fb8d8d7e8959a734c844919fbf064744
https://doi.org/10.1615/jenhheattransf.2021039486