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1Conference
المؤلفون: Oralkan, Ömer, Ergün, Arif Sanlı, Cheng, Ching-Hsiang, Johnson, Jeremy A., Karaman, Mustafa, Lee, Thomas H., Khuri-Yakub, Butrus Thomas
مصطلحات موضوعية: 2D capacitive US transducer arrays, 2D CMUT array, Bonding, Capacitive micromachined, Capacitive micromachined ultrasonic transducer, Data acquisition, Dense 2D arrays, Fabrication, Flip chip devices, Flip-chip bonding, Flip-chip devices, Glass fanout chip, Integrated circuit interconnections, Interconnections, Laboratories, Medical imaging, Micromachined ultrasonic transducer arrays, Micromachining, Phased arrays, Photolithography, Polysilicon, Si, Si micromachining processes, Silicon, Silicon wafers, Spatial resolution, Through-wafer via interconnects, Ultrasonic imaging, Ultrasonic transducer arrays, Ultrasonic transducers
وصف الملف: application/pdf
Relation: Proceedings of the IEEE Ultrasonics Symposium; Konferans Öğesi - Uluslararası - Kurum Öğretim Elemanı; Oralkan, O., Ergün, A. S., Cheng, C.-H., Johnson, J. A., Karaman, M., Lee, T. H. & Khuri-Yakub, B. T. (2002). Volumetric imaging using 2D capacitive micromachined ultrasonic transducer arrays (CMUTs): Initial results. Paper presented at the , 2 1083-1086 vol.2. doi:10.1109/ULTSYM.2002.1192483; https://hdl.handle.net/11729/2059; https://dx.doi.org/10.1109/ULTSYM.2002.1192483; 1083; 1086; N/A; WOS:000182111700242; 2-s2.0-0036992266
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2
المؤلفون: A.S. Ergun, Butrus T. Khuri-Yakub, J.A. Johnson, Omer Oralkan, Thomas H. Lee, Ching-Hsiang Cheng, Mustafa Karaman
المساهمون: Işık Üniversitesi, Mühendislik Fakültesi, Elektrik-Elektronik Mühendisliği Bölümü, Işık University, Faculty of Engineering, Department of Electrical-Electronics Engineering, Karaman, Mustafa
المصدر: Scopus-Elsevier
مصطلحات موضوعية: Capacitive sensing, Ultrasonic transducers, Hardware_PERFORMANCEANDRELIABILITY, law.invention, Medical imaging, Si micromachining processes, law, Electronic circuit, Ultrasonic imaging, Volumetric imaging, Electrical engineering, 2D capacitive US transducer arrays, Interconnections, Chip, Surface micromachining, Optoelectronics, Si, Ultrasonic transducer arrays, Glass fanout chip, Integrated circuit interconnections, Capacitive micromachined, Photolithography, Silicon, Materials science, Capacitive micromachined ultrasonic transducer, 2D CMUT array, ComputerApplications_COMPUTERSINOTHERSYSTEMS, Dense 2D arrays, Flip chip devices, Silicon wafers, Fabrication, Capacitive micromachined ultrasonic transducers, Flip-chip bonding, Phased arrays, Hardware_INTEGRATEDCIRCUITS, Wafer, Through-wafer via interconnects, Spatial resolution, Bonding, Flip-chip devices, business.industry, Micromachined ultrasonic transducer arrays, Data acquisition, Micromachining, Volumetric imaging applications, Polysilicon, Ultrasonic sensor, Laboratories, business
وصف الملف: application/pdf