المؤلفون: SCORZONI, Andrea, De Munari I., Stulens H., D'Haeger V.

المساهمون: Scorzoni, Andrea, De Munari, I., Stulens, H., D'Haeger, V.

مصطلحات موضوعية: Electromigration, high resolution resistometric technique, precipitation-dissolution

Relation: info:eu-repo/semantics/altIdentifier/isbn/1558992944; info:eu-repo/semantics/altIdentifier/wos/WOS:A1995BE31N00069; ispartofbook:MRS Spring Meeting Proceedings, 1995; volume:391; firstpage:513; journal:MRS PROCEEDINGS; http://hdl.handle.net/11391/916321; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-0029505080

الاتاحة: http://hdl.handle.net/11391/916321
https://doi.org/10.1557/PROC-391-513

المؤلفون: D'Haeger, V., de Ceuninck, W., Knuyt, G., de Schepper, L., Stals, L.M.

المصدر: Proceedings of the 7th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis ; page 1695-1698

الاتاحة: http://dx.doi.org/10.1109/esref.1996.888194
http://xplorestaging.ieee.org/ielx5/7119/19180/00888194.pdf?arnumber=888194

المؤلفون: SCORZONI, Andrea, De Munari I., Stulens H., D'Haeger V.

المساهمون: Scorzoni, Andrea, De Munari, I., Stulens, H., D'Haeger, V.

مصطلحات موضوعية: Electromigration, Resistance measurements

Relation: info:eu-repo/semantics/altIdentifier/wos/WOS:A1996UU53200021; volume:79; firstpage:143; lastpage:150; numberofpages:8; journal:JOURNAL OF APPLIED PHYSICS; http://hdl.handle.net/11391/101707; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-0003496181; http://jap.aip.org/resource/1/japiau/v80/i1/p143_s1?isAuthorized=no

الاتاحة: http://hdl.handle.net/11391/101707
https://doi.org/10.1063/1.363552
http://jap.aip.org/resource/1/japiau/v80/i1/p143_s1?isAuthorized=no

المؤلفون: DE CEUNINCK, Ward, DE SCHEPPER, Luc, STALS, Lambert, d' Haeger, V.

Relation: Proceedings of the Materials Research Symposium, San Diego (USA), 9-12 April 1996. p. 133-140.; http://hdl.handle.net/1942/5719; 140; 133

الاتاحة: http://hdl.handle.net/1942/5719

المؤلفون: DE CEUNINCK, Ward, D'Haeger, V, Stulens, Herwig, DE SCHEPPER, Luc, STALS, Lambert

Relation: MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS; Murarka, SP Katz, A Tu, KN Maex, K (Ed.) ADVANCED METALLIZATION FOR DEVICES AND CIRCUITS - SCIENCE, TECHNOLOGY AND MANUFACTURABILITY. p. 663-668.; 1-55899-237-5; http://hdl.handle.net/1942/8139; 668; 663; 337; A1994BB59J00086

الاتاحة: http://hdl.handle.net/1942/8139

المؤلفون: Van Olmen, J., Manca, J.V., De Ceuninck, W., De Schepper, L., D’Haeger, V., Witvrouw, A., Maex, K., Vandevelde, B., Beyne, E., Tielemans, L.

المصدر: Microelectronics Reliability ; volume 39, issue 11, page 1657-1665 ; ISSN 0026-2714

الاتاحة: http://dx.doi.org/10.1016/s0026-2714(99)00168-7
https://api.elsevier.com/content/article/PII:S0026271499001687?httpAccept=text/xml
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المؤلفون: De Ceuninck, Ward, D'Haeger, V, Van Olmen, Jan, Witvrouw, Ann, Maex, Karen, De Schepper, Luc, De Pauw, P, Pergoot, A

Relation: Microelectronics Reliability vol:38 issue:1 pages:87-98; https://lirias.kuleuven.be/handle/123456789/65357

الاتاحة: https://lirias.kuleuven.be/handle/123456789/65357

المؤلفون: Van Olmen, Jan, Manca, Jean, De Ceuninck, Ward, De Schepper, Luc, D'Haeger, V, Witvrouw, Ann, Maex, Karen

Relation: Microelectronics Reliability vol:38 issue:6-8 pages:1009-1014; Proceedings of the 9th European Symposium on Reliability of Electron Devices and Failure Physics (ESREF 98); 5-9 October 1998; C location:Copenhagen, Denmark date:Oct 5-9 1998; https://lirias.kuleuven.be/handle/123456789/64925

الاتاحة: https://lirias.kuleuven.be/handle/123456789/64925

المؤلفون: VAN OLMEN, Jan, MANCA, Jean, DE CEUNINCK, Ward, DE SCHEPPER, Luc, D'Haeger, V, Witvrouw, A, Maex, K

Relation: MICROELECTRONICS AND RELIABILITY, 38(6-8). p. 1009-1013; http://hdl.handle.net/1942/3219; 1013; 6-8; 1009; 38; 000076454300026

الاتاحة: http://hdl.handle.net/1942/3219
https://doi.org/10.1016/S0026-2714(98)00101-2

المؤلفون: MANCA, Jean, CROES, Kristof, DE CEUNINCK, Ward, D'Haeger, V, D'HAEN, Jan, Depauw, P, Tielemans, L, DE SCHEPPER, Luc

Relation: MICROELECTRONICS AND RELIABILITY, 38(4). p. 641-650; http://hdl.handle.net/1942/3198; 650; 641; 38; 000073592200018

الاتاحة: http://hdl.handle.net/1942/3198
https://doi.org/10.1016/S0026-2714(97)00191-1

المؤلفون: De Ceuninck, W.A, D'Haeger, V, Van Olmen, J, Witvrouw, A, Maex, K, De Schepper, L, De Pauw, P, Pergoot, A

المصدر: Microelectronics Reliability ; volume 38, issue 1, page 87-98 ; ISSN 0026-2714

الاتاحة: http://dx.doi.org/10.1016/s0026-2714(97)00064-4
https://api.elsevier.com/content/article/PII:S0026271497000644?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0026271497000644?httpAccept=text/plain

المؤلفون: DE CEUNINCK, Ward, MANCA, Jean, D'Haeger, V, VAN OLMEN, Jan, DE SCHEPPER, Luc, STALS, Lambert

Relation: MICROELECTRONICS AND RELIABILITY, 37(12). p. 1813-1816; http://hdl.handle.net/1942/3253; 1816; 12; 1813; 37; A1997YJ55000003

الاتاحة: http://hdl.handle.net/1942/3253
https://doi.org/10.1016/S0026-2714(97)00014-0

المؤلفون: D'Haeger, V., De Ceuninck, W., De Schepper, L., Stals, L. M.

المصدر: MRS Proceedings ; volume 428 ; ISSN 0272-9172 1946-4274

الاتاحة: http://dx.doi.org/10.1557/proc-428-133
https://www.cambridge.org/core/services/aop-cambridge-core/content/view/S1946427400279323

المؤلفون: D'Haeger, V., De Ceuninck, W., Knuyt, G., De Schepper, L., Stals, L.M.

المصدر: Microelectronics Reliability ; volume 36, issue 11-12, page 1695-1698 ; ISSN 0026-2714

الاتاحة: http://dx.doi.org/10.1016/0026-2714(96)00176-x
https://api.elsevier.com/content/article/PII:002627149600176X?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:002627149600176X?httpAccept=text/plain

المؤلفون: D'Haeger, V, Stulens, Herwig, DE CEUNINCK, Ward, DE SCHEPPER, Luc, Tielemans, L, Gallopyn, G, Depauw P, STALS, Lambert

مصطلحات موضوعية: ELECTROMIGRATION, RELIABILITY, IN-SITU, RESISTANCE

Relation: QUALITY AND RELIABILITY ENGINEERING INTERNATIONAL, 10(4). p. 309-314; http://hdl.handle.net/1942/8131; 314; 309; 10; A1994PU11700009

الاتاحة: http://hdl.handle.net/1942/8131
https://doi.org/10.1002/qre.4680100410

المؤلفون: De Ceuninck, W., D’Haeger, V., Stulens, H., De Schepper, L., Stals, L.M.

المصدر: MRS Proceedings ; volume 337 ; ISSN 0272-9172 1946-4274

الاتاحة: http://dx.doi.org/10.1557/proc-337-663
https://www.cambridge.org/core/services/aop-cambridge-core/content/view/S1946427400478401

المؤلفون: Vanhecke, B., De Schepper, L., De Ceuninck, W., D'Haeger, V., D'Olieslaegers, M., Beyne, E., Roggen, J., Stals, L.

المصدر: Microelectronics Reliability ; volume 33, issue 8, page 1141-1157 ; ISSN 0026-2714

الاتاحة: http://dx.doi.org/10.1016/0026-2714(93)90344-x
https://api.elsevier.com/content/article/PII:002627149390344X?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:002627149390344X?httpAccept=text/plain

المؤلفون: Vanhecke, B., de Schepper, L., de Ceuninck, W., D'haeger, V., D.'olieslaeger, M., Beyne, E., Stals, L., Roggen, J.

المصدر: Quality and Reliability Engineering International ; volume 8, issue 3, page 253-258 ; ISSN 0748-8017 1099-1638

الاتاحة: http://dx.doi.org/10.1002/qre.4680080314
https://api.wiley.com/onlinelibrary/tdm/v1/articles/10.1002%2Fqre.4680080314
https://onlinelibrary.wiley.com/doi/pdf/10.1002/qre.4680080314

المؤلفون: Manca, J.V., Wondrak, W., Croes, K., De Ceuninck, W., D'Haeger, V., De Schepper, L., Tielemans, L.

المصدر: HITEN 99 Third European Conference on High Temperature Electronics (IEEE Cat No99EX372); 1999, p29-32, 4p

المؤلفون: Mellin, H.-E., Häger, V., Peter, St., Ackermann, R., Vogel, J., Molitor, D., Miersch, W.-D., Thon, W. F., Köhler, A., Altwein, J. E., Kramer, W., Fürstenau, Chr., Burk, K., Jonas, D., Riedasch, G., Kälble, T., Möhring, K., Röhl, L., Schwaiger, R., Neisius, D., Ziegler, M., Walter, M., Pichlmaier, H., Allhoff, E., Franzen, W., Hanke, P., Schmelz, D., Ovelgönne, H.-R., Laible, V., Rassweiler, J., Arlart, O., Kraus, B., Eisenberger, F., Grups, J. W., Wirth, M. P., Heller, V., Frohmüller, H. G. W., Schaefer, M., Jaeger, N., Hofmann, R., Hartung, R., Aulitzky, W., Aulitzky, W. E., Frick, J., Gastl, G., Huber, Ch., Lanske, B., Strohmaier, W. L.

المصدر: Tagung 14.–17. Oktober 1987, Stuttgart ; Verhandlungsbericht der Deutschen Gesellschaft für Urologie ; page 248-277 ; ISSN 0070-413X ; ISBN 9783540190424 9783642834042

الاتاحة: http://dx.doi.org/10.1007/978-3-642-83404-2_21
http://link.springer.com/content/pdf/10.1007/978-3-642-83404-2_21