المؤلفون: Wang, D.B., Wu, J., Cui, J.P., Wang, Q., Li, T.R., Emori, W., Zhang, S.D., Wang, J.Q.

المساهمون: Chinese Academy of Sciences, Havforskningsinstituttet, National Natural Science Foundation of China

المصدر: Journal of Materials Science & Technology ; volume 140, page 233-248 ; ISSN 1005-0302

الاتاحة: http://dx.doi.org/10.1016/j.jmst.2022.08.039
https://api.elsevier.com/content/article/PII:S1005030222007356?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S1005030222007356?httpAccept=text/plain

المؤلفون: Wang, Q., Wang, D.B., Cui, J.P., Li, T.R., Emori, W., Zhang, S.D., Wang, J.Q.

المساهمون: Havforskningsinstituttet, National Natural Science Foundation of China, Chinese Academy of Sciences

المصدر: Corrosion Science ; volume 223, page 111474 ; ISSN 0010-938X

الاتاحة: http://dx.doi.org/10.1016/j.corsci.2023.111474
https://api.elsevier.com/content/article/PII:S0010938X23005164?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0010938X23005164?httpAccept=text/plain

المؤلفون: Cui, J.P., Gao, Y.H., Wang, Y.Z., Gu, J.Z.

المصدر: Nuclear Physics A ; volume 1017, page 122341 ; ISSN 0375-9474

الاتاحة: http://dx.doi.org/10.1016/j.nuclphysa.2021.122341
https://api.elsevier.com/content/article/PII:S0375947421002062?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0375947421002062?httpAccept=text/plain

المؤلفون: Qi, L.Q.^1,2,3 (AUTHOR), Cui, J.P.^1,2,3 (AUTHOR), Gao, Y.H.^1,2,3 (AUTHOR), Wang, Y.Z.^1,2,3,4,5 (AUTHOR) yanzhaowang09@126.com, Gu, J.Z.^1,5 (AUTHOR) gujianzhong2000@aliyun.com

المصدر: Nuclear Physics A. Oct2024, Vol. 1050, pN.PAG-N.PAG. 1p.

مصطلحات موضوعية: *ANGULAR momentum (Mechanics), *RADIOACTIVITY, *ISOBARIC spin, *ISOTOPES

المؤلفون: Wang, X.F, Duan, Y, Cui, J.P, Zeng, Y.P

مصطلحات موضوعية: 半导体器件

Relation: Wang, X.F; Duan, Y; Cui, J.P; Zeng, Y.P; Zeng, Y.P.Crack free ZnO thick film on sapphire substrate without GaN template grown by MVPE.Wang, X.F; Zeng, Y.P,2012,15(3):277-281; http://ir.semi.ac.cn/handle/172111/24050

الاتاحة: http://ir.semi.ac.cn/handle/172111/24050

المؤلفون: Wu, J., Cui, J.P., Zheng, Q.J., Zhang, S.D., Sun, W.H., Yang, B.J., Wang, J.Q.

المساهمون: National Key Research and Development Program of China, National Natural Science Foundation of China

المصدر: Electrochimica Acta ; volume 319, page 966-980 ; ISSN 0013-4686

الاتاحة: http://dx.doi.org/10.1016/j.electacta.2019.07.058
https://api.elsevier.com/content/article/PII:S0013468619313830?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0013468619313830?httpAccept=text/plain

المؤلفون: Cui, J.P., Xiao, Y., Gao, Y.H., Wang, Y.Z.

المساهمون: National Natural Science Foundation of China, China Scholarship Council, Natural Science Foundation for outstanding Young Scholars of Hebei Province of China

المصدر: Nuclear Physics A ; volume 987, page 99-111 ; ISSN 0375-9474

الاتاحة: http://dx.doi.org/10.1016/j.nuclphysa.2019.04.008
https://api.elsevier.com/content/article/PII:S037594741930079X?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S037594741930079X?httpAccept=text/plain

المؤلفون: Wang, S., Fan, B.C., He, Y.Z., Cui, J.P.

المصدر: Shock Waves ; page 775-780 ; ISBN 9783540851677 9783540851684

الاتاحة: http://dx.doi.org/10.1007/978-3-540-85168-4_125
http://link.springer.com/content/pdf/10.1007/978-3-540-85168-4_125.pdf

المؤلفون: Wang, X.F., Duan, Y., Cui, J.P., Zeng, Y.P.

المصدر: Materials Science in Semiconductor Processing ; volume 15, issue 3, page 277-281 ; ISSN 1369-8001

الاتاحة: http://dx.doi.org/10.1016/j.mssp.2012.02.013
https://api.elsevier.com/content/article/PII:S1369800112000182?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S1369800112000182?httpAccept=text/plain

المؤلفون: Cui, J.P., Sui, M.L., Cui, Y.Y., Li, D.X.

المصدر: Journal of Materials Research ; volume 23, issue 4, page 949-953 ; ISSN 0884-2914 2044-5326

الاتاحة: http://dx.doi.org/10.1557/jmr.2008.0138
https://www.cambridge.org/core/services/aop-cambridge-core/content/view/S0884291400028569

المؤلفون: Cui, J.P., Duan, Y., Wang, X.F., Zeng, Y.P.

المصدر: Microelectronics Journal ; volume 39, issue 12, page 1542-1544 ; ISSN 0026-2692

الاتاحة: http://dx.doi.org/10.1016/j.mejo.2008.03.002
https://api.elsevier.com/content/article/PII:S0026269208001602?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0026269208001602?httpAccept=text/plain

المؤلفون: He, S.Y.¹ (AUTHOR), Jiang, B.B.¹ (AUTHOR) bbjiang12s@imr.ac.cn, Lu, N.¹ (AUTHOR), Chen, C.J.¹ (AUTHOR), Cui, J.P.¹ (AUTHOR), Huang, Z.Y.¹ (AUTHOR), Jin, S.¹ (AUTHOR), Ye, H.Q.^1,2 (AUTHOR), Lu, L.¹ (AUTHOR), Du, K.¹ (AUTHOR) kuidu@imr.ac.cn

المصدر: Acta Materialia. Oct2024, Vol. 278, pN.PAG-N.PAG. 1p.

مصطلحات موضوعية: *FATIGUE cracks, *FRACTURE toughness, *CYCLIC loads, *FRACTURE mechanics, *TWIN boundaries