المؤلفون: Tongjun Niu, Ke Xu, Chao Shen, Tianyi Sun, Justin Oberst, Carol A. Handwerker, Ganesh Subbarayan, Haiyan Wang, Xinghang Zhang

المصدر: Crystals; Volume 13; Issue 7; Pages: 989

مصطلحات موضوعية: thermal compression bonding, Cu-to-Cu diffusion bonding, in situ compression, nanotwinned metals, advanced packing

وصف الملف: application/pdf

Relation: Crystalline Metals and Alloys; https://dx.doi.org/10.3390/cryst13070989

الاتاحة: https://doi.org/10.3390/cryst13070989