المؤلفون: 李源發, 李勝隆, 李正國, 黃吉宏

مصطلحات موضوعية: Cu/Sip複合材料, 熱壓燒結, 電子構裝材料, Cu/Sip composite, hot pressing, A1 additive, electronic packaging

Relation: 技術學刊(Journal of Technology), Vol. 15, No. 4, pp.673-682; http://ir.lib.ntust.edu.tw/handle/987654321/35955; http://ir.lib.ntust.edu.tw/bitstream/987654321/35955/-1/Development of Silicon Reinforced Copper Matrix Composites for Electronic Packaging.pdf

الاتاحة: http://ir.lib.ntust.edu.tw/handle/987654321/35955
http://ir.lib.ntust.edu.tw/bitstream/987654321/35955/-1/Development of Silicon Reinforced Copper Matrix Composites for Electronic Packaging.pdf