المؤلفون: Wei-You Hsu, Shih-Chi Yang, You-Yi Lin, Wan-Zhen Hsieh, King-Ning Tu, Wei-Lan Chiu, Hsiang-Hung Chang, Ching-Yu Chiang, Chih Chen

المصدر: Nanomaterials ; Volume 13 ; Issue 17 ; Pages: 2448

مصطلحات موضوعية: synchrotron radiation, X-ray nanodiffraction, thermal strain distribution, Cu/SiO 2 hybrid bonding, nanotwinned Cu

وصف الملف: application/pdf

Relation: Synthesis, Interfaces and Nanostructures; https://dx.doi.org/10.3390/nano13172448

الاتاحة: https://doi.org/10.3390/nano13172448

المؤلفون: Wei-You Hsu, Shih-Chi Yang, You-Yi Lin, Wan-Zhen Hsieh, King-Ning Tu, Wei-Lan Chiu, Hsiang-Hung Chang, Ching-Yu Chiang, Chih Chen

المصدر: Nanomaterials, Vol 13, Iss 2448, p 2448 (2023)

مصطلحات موضوعية: synchrotron radiation, X-ray nanodiffraction, thermal strain distribution, Cu/SiO 2 hybrid bonding, nanotwinned Cu, Chemistry, QD1-999

Relation: https://www.mdpi.com/2079-4991/13/17/2448; https://doaj.org/toc/2079-4991; https://doaj.org/article/29123c55454c49d8833f2e1aa2e5d138

الاتاحة: https://doi.org/10.3390/nano13172448
https://doaj.org/article/29123c55454c49d8833f2e1aa2e5d138

المؤلفون: Jia-Juen Ong, Wei-Lan Chiu, Ou-Hsiang Lee, Chia-Wen Chiang, Hsiang-Hung Chang, Chin-Hung Wang, Kai-Cheng Shie, Shih-Chi Yang, Dinh-Phuc Tran, King-Ning Tu, Chih Chen

المصدر: Materials; Volume 15; Issue 5; Pages: 1888

مصطلحات موضوعية: Cu/SiO 2 hybrid bonding, highly (111)-nanotwinned Cu, low temperature bonding, microelectronic packaging

وصف الملف: application/pdf

Relation: https://dx.doi.org/10.3390/ma15051888

الاتاحة: https://doi.org/10.3390/ma15051888

المؤلفون: Jia-Juen Ong, Wei-Lan Chiu, Ou-Hsiang Lee, Chia-Wen Chiang, Hsiang-Hung Chang, Chin-Hung Wang, Kai-Cheng Shie, Shih-Chi Yang, Dinh-Phuc Tran, King-Ning Tu, Chih Chen

المصدر: Materials, Vol 15, Iss 1888, p 1888 (2022)

مصطلحات موضوعية: Cu/SiO 2 hybrid bonding, highly (111)-nanotwinned Cu, low temperature bonding, microelectronic packaging, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85

Relation: https://www.mdpi.com/1996-1944/15/5/1888; https://doaj.org/toc/1996-1944; https://doaj.org/article/277bad7c4c904d249e62bf45845afc01

الاتاحة: https://doi.org/10.3390/ma15051888
https://doaj.org/article/277bad7c4c904d249e62bf45845afc01