المؤلفون: Jiangcong Chen, Shujuan Zhang, Biwen Li, Pinghu Chen, Hengfeng Li

المصدر: Materials, Vol 17, Iss 19, p 4935 (2024)

مصطلحات موضوعية: RGB LED, non-conductive adhesives, chip–substrate joint, shear strength, light attenuation, reliability analysis, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85

Relation: https://www.mdpi.com/1996-1944/17/19/4935; https://doaj.org/toc/1996-1944; https://doaj.org/article/1b77dbe492244b9eb30a2c75f46030cb

الاتاحة: https://doi.org/10.3390/ma17194935
https://doaj.org/article/1b77dbe492244b9eb30a2c75f46030cb

المؤلفون: Wang, Shanda

مصطلحات موضوعية: 668, Self-Assembled Monolayer, Isotropic Conductive Adhesives, Conduction Mechanism, Failure Mechanism, Electrical Interconnection, Reliability Test, Stability Test, High Moisture, Copper, Epoxy, X-ray Photoelectron Spectroscopy, Scanning Electron Microscopy, Transmission Electron Microscopy

URL الوصول: https://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.820033

المؤلفون: Harris, J. R., Shiffler, D. A., Jensen, K. L., Lewellen, J. W.

المصدر: Journal of Applied Physics; 6/7/2019, Vol. 125 Issue 21, pN.PAG-N.PAG, 12p, 3 Diagrams, 15 Graphs

مصطلحات موضوعية: SCHOTTKY effect, LOGICAL prediction, COMPLEX compounds, CONDUCTIVE adhesives, FIELD emission, ELECTROSTATIC discharges, ELECTRIC field effects, CHARGE transfer

المؤلفون: Jiajia Zou, Mengqiu Huang, Dan Zhao, Fang Chen, Daochang Wang

المصدر: Frontiers in Materials, Vol 10 (2023)

مصطلحات موضوعية: contact dispensing, conductive adhesives, modeling, morphogical structure, droplet deposition, Technology

وصف الملف: electronic resource

Relation: https://www.frontiersin.org/articles/10.3389/fmats.2023.1183747/full; https://doaj.org/toc/2296-8016

URL الوصول: https://doaj.org/article/79707f0b09674a57bbfec7671a706378

المؤلفون: Weber, Julian, Rößler, Torsten

مصطلحات موضوعية: CPV module, electrically conductive adhesives, module technology, PV module, shingle cell

وصف الملف: application/pdf

Relation: Progress in Photovoltaics; https://publica.fraunhofer.de/handle/publica/448182; https://doi.org/10.24406/publica-1770

الاتاحة: https://publica.fraunhofer.de/handle/publica/448182
https://doi.org/10.1002/pip.3699
https://doi.org/10.24406/publica-1770

المؤلفون: He, Yi¹, Li, Jun¹, Tian, Gengxin¹, Liu, Fengman¹, Cao, Liqiang¹

المصدر: IEEE Transactions on Electromagnetic Compatibility. Apr2016, Vol. 58 Issue 2, p442-447. 6p.

مصطلحات موضوعية: *SYSTEM integration, CONDUCTIVE adhesives, MOLDING materials, ELECTROMAGNETIC interference, ELECTROMAGNETIC shielding

المؤلفون: Rößler, Torsten, Kutzleben, Daniel von, Klasen, Nils, Nikitina, Veronika, Baliozian, Puzant, Münzer, Anna, Fokuhl, Esther, Kraft, Achim

مصطلحات موضوعية: CTM, efficiency, electrically conductive adhesives, interconnection, PV module, shingle cell

Relation: Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells 2021; #PLACEHOLDER_PARENT_METADATA_VALUE#; 10th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells 2021. Proceedings; Matrix-Schindel-PV-Modul; https://publica.fraunhofer.de/handle/publica/442374

الاتاحة: https://publica.fraunhofer.de/handle/publica/442374
https://doi.org/10.1063/5.0127455

المؤلفون: Illés, Balázs¹, Krammer, Olivér¹, Géczy, Attila¹, Garami, Tamás¹

المصدر: Soldering & Surface Mount Technology. 2016, Vol. 28 Issue 1, p2-6. 5p.

مصطلحات موضوعية: CONDUCTIVE adhesives, ELECTRICAL conductors, FLEXIBLE printed circuits, IMAGE processing, ELECTRIC conductivity, MICROGRAPHICS

المؤلفون: Mostofizadeh, Milad¹, Parviainen, Anniina¹, Frisk, Laura¹

المصدر: IEEE Transactions on Components, Packaging & Manufacturing Technology. May2015, Vol. 5 Issue 5, p592-598. 7p.

مصطلحات موضوعية: *FAILURE analysis, CONDUCTIVE adhesives, ANISOTROPY, CORROSION & anti-corrosives, POLYMER films

المؤلفون: Zhou, Xingli¹, Wang, Likun¹, Liao, Qingwei¹ liaoqingwei520@yahoo.com, Qin, Lei¹

المصدر: Chemical Physics. Jan2019, Vol. 517, p237-246. 10p.

مصطلحات موضوعية: *WELDABILITY of metals, *CONDUCTIVE adhesives, *PIEZOELECTRIC composites, *MICROSTRUCTURE, *SHEAR strength, *DOPING agents (Chemistry), *ZINC oxide

المؤلفون: Wang, Kui¹, Liu, Mingqiao¹, Song, Changyuan¹, Shen, Lu¹, Chen, Peng^1,2, Xu, Shian³

المصدر: Materials & Design. Jun2018, Vol. 148, p167-176. 10p.

مصطلحات موضوعية: *CONDUCTIVE adhesives, *MOLECULES, *POLYETHYLENE, *ETHYLENE, *GRAPHENE oxide, *GRAPHITE oxide

المؤلفون: de Oliveira, Cristian S.^1,2 andre.pasa@ufsc.br, Quispe, Luis T.¹, Plá Cid, Cristiani C.¹, Sierra, Jelver A.¹, de Barros, Silvio³, Mello, A.⁴, Pasa, André A.¹

المصدر: Journal of Adhesion. 2018, Vol. 94 Issue 6, p473-485. 13p.

مصطلحات موضوعية: *CONDUCTIVE adhesives, *WASTE recycling, *SURFACE preparation, *MICROELECTRONICS, *AGGLOMERATION (Materials)

Alternate Title: PRIPRAVA IN LASTNOSTI Ni/Ag-Cu KOMPOZITNE PREVODNE PASTE V PRAHU. (Slovenian)

المؤلفون: Fuqi Lian, Xiaolei Su, Yi Liu

المصدر: Materials & Technologies / Materiali in Tehnologije; May/Jun2022, Vol. 56 Issue 3, p245-253, 9p

مصطلحات موضوعية: CERAMICS, ELECTRICAL resistivity, ELECTRIC conductivity, CHEMICAL stability, CONDUCTIVE adhesives, CORROSION resistance

المؤلفون: Yan, Chao¹, Liao, Qingwei¹ liaoqingwei520@yahoo.com, Zhou, Xingli¹, Wang, Likun¹, Zhong, Chao¹, Zhang, Di²

المصدر: Physica B. Jan2018, Vol. 529, p9-15. 7p.

مصطلحات موضوعية: *SILVER nanoparticles, *CONDUCTIVE adhesives, *PIEZOELECTRIC composites, *LOW temperatures, *THERMAL resistance

المؤلفون: Wang, Zehong^1,2, Wang, Wei^1,2, Yu, Dan^1,2,3 yudan@dhu.edu.cn

المصدر: Chemical Engineering Journal. Dec2017, Vol. 330, p146-156. 11p.

مصطلحات موضوعية: *WEARABLE technology, *CONDUCTIVE adhesives, *PRINTING, *POLYURETHANES, *DETECTORS

المؤلفون: Lu, Long-Fei¹ (AUTHOR), Cao, Xian-Jue¹ (AUTHOR), Qi, Shu-Hua¹ (AUTHOR) qishuhua@nwpu.edu.cn

المصدر: Journal of Adhesion Science & Technology. Aug2017, Vol. 31 Issue 16, p1747-1757. 11p. 3 Black and White Photographs, 6 Graphs.

مصطلحات موضوعية: *CONDUCTIVE adhesives, *ACRYLATES, *GUMS & resins, *SILVER-plating, *CARBON fibers

المؤلفون: Ben Ayed, Emna, Ghorbel, Nouha, Kallel, Ali, Putaux, Jean-Luc, Boufi, Sami

المساهمون: Université de Sfax, Laboratoire des Matériaux Composites céramiques et Polymères Université de Sfax (LaMaCoP), Centre de Recherches sur les Macromolécules Végétales (CERMAV), Institut de Chimie - CNRS Chimie (INC-CNRS)-Centre National de la Recherche Scientifique (CNRS)-Université Grenoble Alpes (UGA)

المصدر: ISSN: 1525-7797.

مصطلحات موضوعية: chitin nanocrystals, polyaniline, in-situ polymerization, conductive adhesives, soft electronics, [CHIM.POLY]Chemical Sciences/Polymers

الاتاحة: https://cnrs.hal.science/hal-03809880
https://cnrs.hal.science/hal-03809880v1/document
https://cnrs.hal.science/hal-03809880v1/file/BenAyed_Biomacromolecules_hal.pdf
https://doi.org/10.1021/acs.biomac.2c00635

المؤلفون: Min, Kyung-Eun, Jang, Jae-Won, Kim, Jun-Ki, Yi, Sung, Kim, Cheolhee

المصدر: Mechanical and Materials Engineering Faculty Publications and Presentations

مصطلحات موضوعية: Non-Conductive Adhesives, Mechanical Engineering

وصف الملف: application/pdf

Relation: https://pdxscholar.library.pdx.edu/mengin_fac/425; https://pdxscholar.library.pdx.edu/context/mengin_fac/article/1429/viewcontent/yi_prediction_OA.pdf

الاتاحة: https://pdxscholar.library.pdx.edu/mengin_fac/425
https://doi.org/10.3390/app122312150
https://pdxscholar.library.pdx.edu/context/mengin_fac/article/1429/viewcontent/yi_prediction_OA.pdf

المؤلفون: Muhammad Hassan Malik, Andreas Tsiamis, Hubert Zangl, Alfred Binder, Srinjoy Mitra, Ali Roshanghias

المصدر: Electronics; Volume 11; Issue 6; Pages: 849

مصطلحات موضوعية: ultra-thin-chips, multi-project wafers, hybrid integration, thermoconic flip chip, anisotropic conductive adhesives, flexible electronics, flip chip bonding

وصف الملف: application/pdf

Relation: Microelectronics; https://dx.doi.org/10.3390/electronics11060849

الاتاحة: https://doi.org/10.3390/electronics11060849

المؤلفون: Masahiro INOUE, Takanori FUKUSHIMA, 井上 雅博, 福島 孝典

المصدر: スマートプロセス学会誌 / Journal of Smart Processing. 2022, 11(5):260