يعرض 1 - 20 نتائج من 867 نتيجة بحث عن '"Collaert, N"', وقت الاستعلام: 0.62s تنقيح النتائج
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    المساهمون: UCL - SST/ICTM/ELEN - Pôle en ingénierie électrique

    المصدر: ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC)

    Relation: info:eu-repo/grantAgreement/FNRS/FRIA/; boreal:250702; http://hdl.handle.net/2078.1/250702

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    Academic Journal

    المساهمون: National Chung-Shan Institute of Science and Technology, Ministry of Science and Technology, Taiwan, Ministry of Education

    المصدر: AIP Advances ; volume 11, issue 1 ; ISSN 2158-3226

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    Academic Journal

    المساهمون: Equipe Electronique - Laboratoire GREYC - UMR6072, Groupe de Recherche en Informatique, Image et Instrumentation de Caen (GREYC), Université de Caen Normandie (UNICAEN), Normandie Université (NU)-Normandie Université (NU)-École Nationale Supérieure d'Ingénieurs de Caen (ENSICAEN), Normandie Université (NU)-Centre National de la Recherche Scientifique (CNRS)-Université de Caen Normandie (UNICAEN), Normandie Université (NU)-Centre National de la Recherche Scientifique (CNRS), IMEC (IMEC), Catholic University of Leuven = Katholieke Universiteit Leuven (KU Leuven)

    المصدر: ISSN: 0038-1101 ; Solid-State Electronics ; https://hal.science/hal-02475438 ; Solid-State Electronics, 2020, pp.107771. ⟨10.1016/j.sse.2020.107771⟩.

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    Conference

    المساهمون: Universidade Estadual Paulista (UNESP)

    مصطلحات موضوعية: FinFET, germanium, p-type, STI last

    Relation: 2018 33rd Symposium On Microelectronics Technology And Devices (sbmicro); 2018 33rd Symposium On Microelectronics Technology And Devices (sbmicro). New York: Ieee, 4 p., 2018.; http://hdl.handle.net/11449/184137; WOS:000451195800028; 0496909595465696; orcid:0000-0002-0886-7798

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    Conference

    المساهمون: Universidade Estadual Paulista (UNESP)

    مصطلحات موضوعية: Analog Parameters, III-V materials, Temperature, TFET

    وصف الملف: 1-3

    Relation: 2017 IEEE SOI-3D-Subthreshold Microelectronics Unified Conference, S3S 2017; http://dx.doi.org/10.1109/S3S.2017.8309256; 2017 IEEE SOI-3D-Subthreshold Microelectronics Unified Conference, S3S 2017, v. 2018-March, p. 1-3.; http://hdl.handle.net/11449/171055; 2-s2.0-85047727174