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1Book
المؤلفون: Meuris, M., Jaeger, B., Steenbergen, J., Bonzom, R., Caymax, M., Houssa, M., Kaczer, B., Leys, F., Martens, K., Opsomer, K., Pourghaderi, A. M., Satta, A., Simoen, E., Terzieva, V., Moorhem, E., Winderickx, G., Loo, R., Clarysse, T., Conard, T., Delabie, A., Hellin, D., Janssens, T., Onsia, B., Sioncke, S., Mertens, P. W., Snow, J., Elshocht, S., Vandervorst, W., Zimmerman, P., Brunco, D., Raskin, G., Letertre, F., Akatsu, T., Billon, T., Heyns, M.
المصدر: Advanced Microelectronics ; Advanced Gate Stacks for High-Mobility Semiconductors ; page 333-340 ; ISBN 9783540714903 9783540714910
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2Academic JournalHigh precision micro-scale Hall Effect characterization method using in-line micro four-point probes
المؤلفون: Petersen, Dirch Hjorth, Hansen, Ole, Lin, Rong, Nielsen, Peter Folmer, Clarysse, T., Goossens, J., Rosseel, E., Vandervorst, W.
المصدر: Petersen , D H , Hansen , O , Lin , R , Nielsen , P F , Clarysse , T , Goossens , J , Rosseel , E & Vandervorst , W 2008 , High precision micro-scale Hall Effect characterization method using in-line micro four-point probes . in Proceeding of "IEEE" . IEEE , pp. 251-256 , 16th IEEE International Conference on Advanced Thermal Processing of Semiconductors , Las Vegas, NV , United States , 30/09/2008 . https://doi.org/10.1109/RTP.2008.4690563
وصف الملف: application/pdf
Relation: https://orbit.dtu.dk/en/publications/8dbb5f9e-8fcc-4c61-95a2-cca7f04d48be; urn:ISBN:978-1-4244-1950-0
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3Academic Journal
المؤلفون: Clarysse, T., BRAMMERTZ, Guy, Vanhaeren, D., Eyben, P., Goossens, J., Clemente, F., MEURIS, Marc, Vandervorst, W., Srnanek, R., Kinder, R., Li, Zhiqiang, Sciana, B., Radziewicz, D.
المساهمون: Sciana, Beata/0000-0001-8771-3545, Brammertz, Guy/0000-0003-1404-7339
مصطلحات موضوعية: GaAs, Carrier profiling, Scanning spreading resistance microscopy
وصف الملف: application/pdf
Relation: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 11 (5-6) , p. 259 -266; http://hdl.handle.net/1942/31662; 266; 5-6; 259; 11; WOS:000271700600023
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4Academic Journal
المؤلفون: Vincent, B., Firrincieli, A., Wang, W. -E., Waldron, N., Franquet, A., Douhard, B., Vandervorst, W., Clarysse, T., BRAMMERTZ, Guy, Loo, R., Dekoster, J., MEURIS, Marc, Caymax, M.
المساهمون: Loo, Roger/0000-0003-3513-6058, Brammertz, Guy/0000-0003-1404-7339
مصطلحات موضوعية: EPITAXIAL-GROWTH
Relation: Journal of the Electrochemical Society, 158 (3) , p. H203 -H207; http://hdl.handle.net/1942/31588; H207; H203; 158; WOS:000286677900066
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5Academic Journal
المؤلفون: Duhayon, N, Eyben, P, Fouchier, M, Clarysse, T, Vandervorst, Wilfried, Álvarez, D, Schoemann, S, Ciappa, M, Stangoni, M, Fichtner, W, Formanek, P, Kittler, M, Raineri, V, Giannazzo, F, Goghero, D, Rosenwaks, Y, Shikler, R, Saraf, S, Sadewasser, S, Barreau, Nicolas, Glatzel, T, Verheijen, MA Marcel, Mentink, SAM, Sprekelsen, M Von, Maltezopoulos, T, Wiesendanger, R, Hellemans, L
المصدر: ISSN:1071-1023.
وصف الملف: application/pdf
Relation: http://repository.tue.nl/901758
الاتاحة: http://repository.tue.nl/901758
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6Conference
المؤلفون: Clarysse, T., Konttinen, M., Parmentier, B., Moussa, A., Vandervorst, W., Impellizzeri, G., Privitera, V., Nielsen, P. F., Petersen, D. H., Hansen, O., NAPOLITANI, ENRICO
المساهمون: Clarysse, T., Konttinen, M., Parmentier, B., Moussa, A., Vandervorst, W., Impellizzeri, G., Napolitani, Enrico, Privitera, V., Nielsen, P. F., Petersen, D. H., Hansen, O.
وصف الملف: STAMPA
Relation: info:eu-repo/semantics/altIdentifier/isbn/978-0-7354-1109-8; info:eu-repo/semantics/altIdentifier/wos/WOS:000312160700039; ispartofbook:ION IMPLANTATION TECHNOLOGY 2012; 19th International Conference on Ion Implantation Technology (IIT); volume:1496; firstpage:167; lastpage:170; numberofpages:4; journal:AIP CONFERENCE PROCEEDINGS; http://hdl.handle.net/11577/3171847; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-84874207499; http://scitation.aip.org/content/aip/proceeding/aipcp/10.1063/1.4766516
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7Conference
المؤلفون: Petersen, Dirch Hjorth, Hansen, Ole, Wang, Fei, Østerberg, Frederik Westergaard, Henrichsen, Henrik Hartmann, Bøggild, Peter, Lin, Rong, Nielsen, Peter Folmer, Clarysse, T., Rosseel, E., Vandervorst, W.
المصدر: Petersen , D H , Hansen , O , Wang , F , Østerberg , F W , Henrichsen , H H , Bøggild , P , Lin , R , Nielsen , P F , Clarysse , T , Rosseel , E & Vandervorst , W 2012 , ' Micro Hall effect metrology ' , International Conference on Ion Implantation Technology , Valladolid , Spain , 25/06/2012 - 29/06/2012 .
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8Conference
المؤلفون: Clarysse, T., Moussa, A., Parmentier, B., Eyben, P., Douhard, B., Vandervorst, W., Nielsen, P.F., Lin, Rong, Petersen, Dirch Hjorth, Wang, Fei, Hansen, Ole
المصدر: Clarysse , T , Moussa , A , Parmentier , B , Eyben , P , Douhard , B , Vandervorst , W , Nielsen , P F , Lin , R , Petersen , D H , Wang , F & Hansen , O 2010 , ' Micro probee carrier profiling of Ultra-shallow structures in advanced materials ' , 2010 MRS Spring Meeting & Exhibit , San Francisco, CA , United States , 05/04/2010 - 09/04/2010 .
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9Academic Journal
المؤلفون: Bender, H, Franquet, A, Drijbooms, C, Parmentier, B, Clarysse, T, Vandervorst, W, Kwakman, L
المصدر: Semiconductor Science and Technology ; volume 30, issue 11, page 114015 ; ISSN 0268-1242 1361-6641
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10Conference
المؤلفون: Petersen D, Hansen O, Hansen T, Boggild P, Lin R, Kjaer D, Nielsen P, Clarysse T, Vandervorst W, Rosseel E, Bennett N, Cowern N
المصدر: Proceedings of INSIGHT, 26-29 April 2009
Relation: https://eprints.ncl.ac.uk/8028
الاتاحة: https://eprints.ncl.ac.uk/8028
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11Conference
المؤلفون: Nguyen, N.D., Rosseel, E., Takeuchi, S., Everaert, J.-L., Loo, R., Goossens, J., Moussa, A., Clarysse, T., Caymax, M., Vandervorst, W.
المصدر: 2009 International Semiconductor Device Research Symposium ; page 1-2
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12Conference
المؤلفون: Petersen, Dirch Hjorth, Hansen, Ole, Bøggild, Peter, Lin, R., Nielsen, P.F., Lin, D., Adelmann, C., Alian, A., Merckling, C., Penaud, J., Brammertz, G., Goossens, J., Vandervorst, W., Clarysse, T.
المصدر: Petersen , D H , Hansen , O , Bøggild , P , Lin , R , Nielsen , P F , Lin , D , Adelmann , C , Alian , A , Merckling , C , Penaud , J , Brammertz , G , Goossens , J , Vandervorst , W & Clarysse , T 2009 , ' Electrical characterization of InGaAs ultra-shallow junctions ' , INSIGHT , San-Francisco, USA , 01/01/2009 .
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13Conference
المؤلفون: Rosseel E, Vandervorst W, Clarysse T, Goossens J, Moussa A, Lin R, Petersen DH, Nielsen PF, Hansen O, Bennett NS, Cowern NEB
المصدر: 16th IEEE International Conference on Advanced Thermal Processing of Semiconductors (RTP 2008), 30 September to 3 October 2008
وصف الملف: application/pdf
Relation: https://eprints.ncl.ac.uk/40022; https://eprints.ncl.ac.uk/fulltext.aspx?url=40022/5FD58098-C2C2-43D5-BDF4-7AE6CEF36376.pdf&pub_id=40022
الاتاحة: https://eprints.ncl.ac.uk/40022
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14Conference
المؤلفون: Clarysse T, Bogdanowicz J, Goossens J, Moussa A, Rosseel E, Vandervorst W, Petersen DH, Lin R, Nielsen PF, Hansen O, Merklin G, Bennett NS, Cowern NEB
المصدر: Materials Science and Engineering B: Advanced Functional Solid-state Materials. E-MRS 2008 symposium I, Front-End Junction and Contact Formation in Future Silicon/Germanium based Devices, 26-29 May 2008
Relation: https://eprints.ncl.ac.uk/149110
الاتاحة: https://eprints.ncl.ac.uk/149110
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15Conference
المؤلفون: Noda, T., Eyben, P., Vandervorst, W., Vrancken, C., Rosseel, E., Ortolland, C., Clarysse, T., Goossens, J., De Keersgieter, A., Felch, S., Schreutelkamp, R., Absil, P. P., Jurczak, M., De Meyer, K., Biesemans, S., Hoffmann, T. Y.
المصدر: 2008 IEEE International Electron Devices Meeting ; volume vlsi2008, page 1-4
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16Conference
المؤلفون: Duriau, E., Clarysse, T., Hantschel, T., Vandervorst, Wilfried
Relation: 34th International Conference on Micro- and Nano Engineering. location:Athens, Greece date:15-18 September 2008; https://lirias.kuleuven.be/handle/123456789/261546
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17Conference
المؤلفون: Clarysse, T., Bogdanowicz, J., Goossens, J., Moussa, A., Rosseel, E., Vandervorst, Wilfried, Petersen, D., Lin, R., Nielsen, P., Hansen, O., Defranoux, C., Vertikov, A., Gostein, M., Bennett, N., Cowern, N., Faifer, V.
Relation: E-MRS Sprng Meeting Symposium I: Front-End Junction and Contact Formation in Future Silicon/Germanium Based Devices location:Strasbourg, France date:26-30 May 2008; https://lirias.kuleuven.be/handle/123456789/261550
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18Conference
المؤلفون: Clarysse, T., Brammertz, G., Vanhaeren, D., Eyben, P., Goossens, J., Clemente, F., Meuris, M, Vandervorst, Wilfried, Srnanek, R., Kinder, R., Sciana, B., Li, Z., Robinson, D.
Relation: E-MRS Spring Meeeting Symposium J:Beyond Silicon Technolgy: Materials and Devices for Post-Si CMOS. 2008. location:Strasbourg, France date:26-30 May, 2008; https://lirias.kuleuven.be/handle/123456789/261012
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19ConferenceHigh precision micro-scale Hall effect characterization method using in-line micro four-point probes
المؤلفون: Petersen, D., Hansen, O., Lin, R., Nielsen, P., Clarysse, T., Goossens, J., Rosseel, E., Vandervorst, Wilfried
Relation: 16th IEEE International Conference on Advanced Thermal Processing of Semiconductors - RTP 2008 pages:251-256; 16th IEEE International Conference on Advanced Thermal Processing of Semiconductors - RTP 2008 location:Las Vegas, NV, USA date:30 September - 3 October 2008; https://lirias.kuleuven.be/handle/123456789/261547
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20Conference
المؤلفون: Rosseel, E., Vandervorst, Wilfried, Clarysse, T., Goossens, J., Moussa, A., Lin, R., Petersen, D., Nielsen, P., Hansen, O., Bennett, N., Cowern, N.
Relation: 16th IEEE International Conference on Advanced Thermal Processing of Semiconductors - RTP 2008 pages:135-140; 16th IEEE International Conference on Advanced Thermal Processing of Semiconductors - RTP 2008 location:Las Vegas, NV, USA date:30 September - 3 October 2008; https://lirias.kuleuven.be/handle/123456789/261532