المؤلفون: Bonnassieux, Yvan, Brabec, Christoph J., Cao, Yong, Carmichael, Tricia Breen, Chabinyc, Michael L., Cheng, Kwang Ting, Cho, Gyoujin, Chung, Anjung, Cobb, Corie L., Distler, Andreas, Egelhaaf, Hans Joachim, Grau, Gerd, Guo, Xiaojun, Haghiashtiani, Ghazaleh, Huang, Tsung Ching, Hussain, Muhammad Mustafa, Iniguez, Benjamin, Lee, Taik Min, Li, Ling, Ma, Yuguang, Ma, Dongge, McAlpine, Michael C., Ng, Tse Nga, Österbacka, Ronald, Patel, Shrayesh N., Peng, Junbiao, Peng, Huisheng, Rivnay, Jonathan, Shao, Leilai, Steingart, Daniel, Street, Robert A., Subramanian, Vivek, Torsi, Luisa, Wu, Yunyun

المساهمون: Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division, Electrical and Computer Engineering Program, Integrated Nanotechnology Lab, CNRS, École Polytechnique, IP Paris, Palaiseau, France, Friedrich-Alexander University Erlangen-Nürnberg, Institute of Materials for Electronics and Energy Technology (i-MEET), Martensstr. 7, 91058 Erlangen, Germany, Department of Renewable Energies, Bavarian Center for Applied Energy Research e.V., 91058 Erlangen, Germany, Forschungszentrum Jülich GmbH, Helmholtz Institute Erlangen-Nürnberg for Renewable Energies (HI ERN), Immerwahrstr. 2, 91058 Erlangen, Germany, South China University of Technology, 381 Wushan Road, Tianhe District, Guangzhou, Guangdong Province 510641, People’s Republic of China, Department of Chemistry and Biochemistry, University of Windsor, Windsor, Ontario N9B 3P4, Canada, Materials Department, University of California, Santa Barbara, CA 93016-5050, United States of America, School of Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, Department of Biophysics, Institute of Quantum Biophysics, Sungkyunkwan University, Suwon, Republic of Korea, Korea Flexible & Printed Electronics Association, Seoul, Republic of Korea, Department of Mechanical Engineering, University of Washington, Seattle, WA 98195, United States of America, Bavarian Center for Applied Energy Research e.V., Department of Renewable Energies, Solar Factory of the Future, Fürther Str. 250, 90429 Nürnberg, Germany, Department of Electrical Engineering and Computer Science, York University, Toronto, ON, Canada, Department of Electronic Engineering, Shanghai Jiao Tong University, Shanghai 200240, People’s Republic of China, Department of Mechanical Engineering, University of Minnesota, 111 Church Street SE, Minneapolis, MN 55455, United States of America, Hewlett Packard Laboratory, 820 N. McCarthy Blvd, Milpitas, CA 95035, United States of America, Electrical Engineering and Computer Science, University of California, Berkeley, CA 94720-1770, United States of America, Universitat Rovira i Virgili, Tarragona, Spain, Department of Printed Electronics, Korea Institute of Machinery and Materials (KIMM), 156, Gajeongbuk-Ro, Yuseong-Gu, Daejeon 34103, Republic of Korea, Institute of Microelectronics, Chinese Academy of Sciences, Beitucheng West Road, Chaoyang District, Beijing 100029, People’s Republic of China, University of Chinese Academy of Sciences, Beijing 100049, People’s Republic of China, University of California, Jacobs Hall, 9500 Gilman Drive, San Diego, CA 92093, United States of America, Physics, Faculty of Science and Engineering, Åbo Akademi University, Turku 20500, Finland, Pritzker School of Molecular Engineering, University of Chicago, Chicago, IL 60637, United States of America, Fudan University, 2205 Songhu Road, Shanghai 200438, People’s Republic of China, Department of Biomedical Engineering, Northwestern University, Evanston, IL 60657, United States of America, Department of Electrical and Computer Engineering, University of California, Santa Barbara, CA 93106, United States of America, Department of Earth and Environmental Engineering, Columbia University, New York, NY 10027, United States of America, Department of Chemical Engineering, Columbia University, New York, NY 10027, United States of America, Palo Alto Research Center, 3333 Coyote Hill Road, Palo Alto, CA 94304, United States of America, Institute of Microengineering, École Polytechnique fédérale de Lausanne, Lausanne, Switzerland, Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, United States of America, Dipartimento di Chimica, Università degli Studi di Bari ‘Aldo Moro’, Bari 70125, Italy

وصف الملف: application/pdf

Relation: https://iopscience.iop.org/article/10.1088/2058-8585/abf986; Bonnassieux, Y., Brabec, C. J., Cao, Y., Carmichael, T. B., Chabinyc, M. L., Cheng, K.-T., … Wu, Y. (2021). The 2021 flexible and printed electronics roadmap. Flexible and Printed Electronics, 6(2), 023001. doi:10.1088/2058-8585/abf986; 2-s2.0-85107977151; Flexible and Printed Electronics; 023001; http://hdl.handle.net/10754/669780

الاتاحة: http://hdl.handle.net/10754/669780
https://doi.org/10.1088/2058-8585/abf986

المؤلفون: Chung, Anjung, Choi, Manseek

المصدر: Journal of Applied Business Research (JABR); Vol. 33 No. 5 (2017); 1035-1046 ; 2157-8834 ; 0892-7626

مصطلحات موضوعية: R&D, Business Strategy, Earnings Persistence, Earnings Growth, Firm Value

وصف الملف: application/pdf

Relation: https://clutejournals.com/index.php/JABR/article/view/10025/10130; https://clutejournals.com/index.php/JABR/article/view/10025

الاتاحة: https://clutejournals.com/index.php/JABR/article/view/10025
https://doi.org/10.19030/jabr.v33i5.10025

المؤلفون: Chung, Anjung, Park, Sambock

المصدر: Journal of Applied Business Research (JABR); Vol. 32 No. 6 (2016); 1809-1824 ; 2157-8834 ; 0892-7626

مصطلحات موضوعية: Uncertainty, R&D Expenditure, Earnings Persistence, Earnings Growth, Firm Value

وصف الملف: application/pdf

Relation: https://clutejournals.com/index.php/JABR/article/view/9825/9919; https://clutejournals.com/index.php/JABR/article/view/9825

الاتاحة: https://clutejournals.com/index.php/JABR/article/view/9825
https://doi.org/10.19030/jabr.v32i6.9825