المؤلفون: Weiping Zhang, Chongshen Song, Longbing Cao, L. Wang, F. Xiao, Ji-Yao Wang

المصدر: Microelectronic Engineering. 179:31-36

مصطلحات موضوعية: Materials science, Through-silicon via, Silicon, business.industry, chemistry.chemical_element, 02 engineering and technology, RC time constant, 010402 general chemistry, 021001 nanoscience & nanotechnology, Condensed Matter Physics, 01 natural sciences, Isotropic etching, Atomic and Molecular Physics, and Optics, 0104 chemical sciences, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, chemistry, Etching (microfabrication), Optoelectronics, Wafer, Dry etching, Electrical and Electronic Engineering, Reactive-ion etching, 0210 nano-technology, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6996cc0e224e38768b61fc4e647d4d94
https://doi.org/10.1016/j.mee.2017.04.025

المؤلفون: Mei Yan, Zhiyi Yu, Hao Yu, Jie Lin, Chongshen Song, Zhu Shikai, Xiwei Huang, Xu Liu, Wenqi Zhang, P D Sai Manoj, Yingying Yin

المصدر: IEEE Transactions on Circuits and Systems I: Regular Papers. 64:1432-1443

مصطلحات موضوعية: Interconnection, Multi-core processor, Computer science, business.industry, 020208 electrical & electronic engineering, 02 engineering and technology, Chip, Die (integrated circuit), 020202 computer hardware & architecture, law.invention, Microprocessor, Network on a chip, law, Embedded system, 0202 electrical engineering, electronic engineering, information engineering, Bandwidth (computing), Electrical and Electronic Engineering, business, Throughput (business), Computer hardware

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::eee49e606f18334134a63bee5c2b47a0
https://doi.org/10.1109/tcsi.2016.2647322

المؤلفون: K. Xue, Weiping Zhang, Chongshen Song, S. Yang, U. Lee, H. Xue, Z. Yong, H. Li, Xiangmeng Jing

المصدر: Microelectronic Engineering. 156:50-54

مصطلحات موضوعية: 010302 applied physics, Chemical substance, Materials science, Through-silicon via, business.industry, Nanotechnology, 02 engineering and technology, Chemical vapor deposition, 021001 nanoscience & nanotechnology, Condensed Matter Physics, 01 natural sciences, Aspect ratio (image), Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Atomic layer deposition, Plasma-enhanced chemical vapor deposition, 0103 physical sciences, Optoelectronics, Electrical and Electronic Engineering, 0210 nano-technology, business, Layer (electronics), High-κ dielectric

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8c0e68435a3130e79d8c6ae55fcbee16
https://doi.org/10.1016/j.mee.2015.11.014

المؤلفون: Cheng Xu, Wenqi Zhang, Chongshen Song, Zhongcai Niu, Ui-Hyoung Lee, Jaihyung Won, Jong-yong Bae, Xiangmeng Jing

المصدر: ECS Transactions. 66:183-191

مصطلحات موضوعية: Engineering, business.industry, Annealing (metallurgy), business, Microstructure, Engineering physics, Algorithm

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::85fadbce428c5418d635ff5be30916f0
https://doi.org/10.1149/06604.0183ecst

المؤلفون: Chongshen Song, Meiying Su, Kai Xue, Daniel Guidotti, Fengwei Dai, Daquan Yu, Yijun Liu, Lixi Wan, Xiangmeng Jing

المصدر: Thin Solid Films. 550:259-263

مصطلحات موضوعية: Materials science, Silicon, Metals and Alloys, Analytical chemistry, chemistry.chemical_element, Surfaces and Interfaces, Chemical vapor deposition, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, law.invention, Tetraethyl orthosilicate, Surface coating, chemistry.chemical_compound, chemistry, Chemical engineering, Plasma-enhanced chemical vapor deposition, law, Materials Chemistry, Thin film, Fourier transform infrared spectroscopy, Mercury probe

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c31835511ed7ecf52fa86c8addba620a
https://doi.org/10.1016/j.tsf.2013.11.002

المؤلفون: Chongshen Song, Liqiang Cao, Wenqi Zhang, Hengfu Li, Feng Guangjian

المصدر: 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

مصطلحات موضوعية: Wire bonding, Materials science, Through-silicon via, business.industry, Wafer bonding, Contact resistance, 020206 networking & telecommunications, 02 engineering and technology, Thermocompression bonding, Direct bonding, 021001 nanoscience & nanotechnology, Anodic bonding, 0202 electrical engineering, electronic engineering, information engineering, Electronic engineering, Optoelectronics, Wafer, 0210 nano-technology, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::88845623ae9a509f6f72d14e6dd67050
https://doi.org/10.1109/icept.2016.7583291

المؤلفون: Lei Wang, Zhun Wang, Wenqi Zhang, Yue Yang, Chongshen Song, Liqiang Cao

المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Interconnection, Materials science, Passivation, business.industry, 020208 electrical & electronic engineering, Contact resistance, Nanotechnology, 02 engineering and technology, Die (integrated circuit), Etching (microfabrication), Chemical-mechanical planarization, 0202 electrical engineering, electronic engineering, information engineering, Optoelectronics, Wafer, Dry etching, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c508251e809dfee9b0ee5a5baa159f64
https://doi.org/10.1109/ectc.2016.146

المؤلفون: Zhimin Tan, Chongshen Song, Zheyao Wang, Litian Liu

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 2:23-31

مصطلحات موضوعية: Materials science, Through-silicon via, Copper interconnect, Electronic packaging, Mechanical engineering, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, Copper plating, Electronic engineering, Wafer, Boundary value problem, Electrical and Electronic Engineering, Electroplating, Current density

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ce3d242a5f46711ee704758d3cc23e12
https://doi.org/10.1109/tcpmt.2011.2167681

المؤلفون: Chongshen Song, Litian Liu, Zheyao Wang

المصدر: Microelectronic Engineering. 87:510-513

مصطلحات موضوعية: Fabrication, Materials science, Silicon, business.industry, chemistry.chemical_element, Integrated circuit, Condensed Matter Physics, Copper, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, law.invention, chemistry, law, Copper plating, Optoelectronics, Wafer, Electrical and Electronic Engineering, business, Electroplating, Layer (electronics)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::cc8a685b4fb1f2ca2999d404ed4a6d00
https://doi.org/10.1016/j.mee.2009.06.029

المؤلفون: Qianwen Chen, Zheyao Wang, Jian Cai, Chongshen Song, Litian Liu

المصدر: Microelectronic Engineering. 85:1952-1956

مصطلحات موضوعية: Interconnection, Materials science, business.industry, chemistry.chemical_element, Integrated circuit, Condensed Matter Physics, Copper, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, law.invention, chemistry, law, Copper plating, Deep reactive-ion etching, Optoelectronics, Wafer, Electrical and Electronic Engineering, Reactive-ion etching, business, Electroplating

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::26fbf08963e974b54cada8a189b2cf63
https://doi.org/10.1016/j.mee.2008.05.017

المؤلفون: Feng Guangjian, Kai Xue, Xiangmeng Jing, Hengfu Li, Chongshen Song, Feng Jiang, Wenqi Zhang

المصدر: 2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC).

مصطلحات موضوعية: Engineering, business.industry, Process development, Process (engineering), Key (cryptography), Electronic engineering, Three-dimensional integrated circuit, Bumping, Wafer, business, Process module, Manufacturing engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::cdd385d9299f54108f1a2ffac7e062a5
https://doi.org/10.1109/edssc.2015.7285095

المؤلفون: H. Li, Chongshen Song, U. Lee, S. Yang, W. Zhang, Z. Yong, K. Xue, X. Jing

المصدر: 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).

مصطلحات موضوعية: Materials science, Through-silicon via, business.industry, Plasma-enhanced chemical vapor deposition, Electronic engineering, Interposer, Optoelectronics, Microelectronics, Breakdown voltage, Process window, business, Capacitance, Layer (electronics)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3b7df6bbaa40fee3591dbd206e0a745e
https://doi.org/10.1109/iitc-mam.2015.7325653

المؤلفون: Daquan Yu, Xiaoyang Liu, Ran He, Xiangmeng Jing, Chongshen Song, Fengwei Dai, Yu Sun, Lixi Wan

المصدر: 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) ; page 360-363

الاتاحة: http://dx.doi.org/10.1109/eptc.2012.6507108
http://xplorestaging.ieee.org/ielx7/6504698/6507037/06507108.pdf?arnumber=6507108

المؤلفون: Jing Zhou, Daquan Yu, Ran He, Feng WeiDai, Xueping Guo, Chongshen Song, HuiJuan Wang, Guidotti, Daniel, Liqiang Cao, Lixi Wan

المصدر: 2011 IEEE 13th Electronics Packaging Technology Conference ; page 686-690

الاتاحة: http://dx.doi.org/10.1109/eptc.2011.6184505
http://xplorestaging.ieee.org/ielx5/6178148/6184374/06184505.pdf?arnumber=6184505

المؤلفون: Chongshen Song, Dongkai Shangguan, Wenqi Zhang

المصدر: 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).

مصطلحات موضوعية: Interconnection, Wire bonding, Die preparation, Materials science, business.industry, Wafer bonding, Anodic bonding, Electronic engineering, Optoelectronics, Wafer, Thermocompression bonding, business, Wafer backgrinding

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8a80aa85d6c7a4421f7e0692995462d1
https://doi.org/10.1109/ltb-3d.2014.6886143

المؤلفون: Daquan Yu, Hongwen He, Dongkai Shangguan, Wenqi Zhang, Meiying Su, Xiangmeng Jing, Liang Ji, Cheng Xu, Chongshen Song, Kai Xue, Liqiang Cao

المصدر: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Materials science, Silicon, chemistry, Annealing (metallurgy), law, Microscopy, Electronic engineering, chemistry.chemical_element, Integrated circuit, Composite material, Finite element method, law.invention

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::62901eaa7611a54b7c5fe03d5464628f
https://doi.org/10.1109/ectc.2014.6897429

المؤلفون: Chongshen Song, Zhun Wang, Daquan Yu, Lei Wang, Wenqi Zhang

المصدر: 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).

مصطلحات موضوعية: Fabrication, Plasma etching, Materials science, Passivation, Electronic engineering, Process (computing), Interposer, Polishing, Integrated circuit packaging, Engineering physics, Silicon interposer

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::dbd9089c03744959a948a78bf362681d
https://doi.org/10.1109/eptc.2013.6745813

المؤلفون: Daquan Yu, Chongshen Song, Fengwei Dai, Xiangmeng Jing, Jing Zhou, Xiaomeng Wu, Hongwen He, He Ma

المصدر: 2013 14th International Conference on Electronic Packaging Technology.

مصطلحات موضوعية: Modeling and simulation, Materials science, business.product_category, Thermal conductivity, Computer simulation, Thermal, Electronic engineering, Die (manufacturing), Thermal grease, Junction temperature, Integrated circuit packaging, Composite material, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8ce2833d1c192888cb7c1e526ddabfca
https://doi.org/10.1109/icept.2013.6756520

المؤلفون: Huijuan Wang, Daquan Yu, Tianmin Du, Chongshen Song, Yang Song, Pan Jie, Fengwei Dai, Wu Peng, Jing Zhou, He Huimin, Lixi Wan, Liqiang Cao, Daniel Guidotti, Qiu Delong

المصدر: 2013 14th International Conference on Electronic Packaging Technology.

مصطلحات موضوعية: Materials science, Reliability (semiconductor), Through-silicon via, Chip-scale package, Circuit design, Interposer, Electronic engineering, Three-dimensional integrated circuit, Integrated circuit packaging, Integrated circuit layout

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::153729da59c424fdbb291fc28004dad8
https://doi.org/10.1109/icept.2013.6756417

المؤلفون: Chongshen Song, Wenqi Zhang, Lei Wang, Cheng Xu, Hongwen He

المصدر: 2013 14th International Conference on Electronic Packaging Technology.

مصطلحات موضوعية: White light interferometry, Fabrication, Materials science, Annealing (metallurgy), business.industry, Chemical-mechanical planarization, Electronic engineering, Interposer, Optoelectronics, Wafer, Extrusion, Integrated circuit packaging, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0d2a446079d29e1229d0d0908d742268
https://doi.org/10.1109/icept.2013.6756578