المؤلفون: Choi, MiKyeong¹ (AUTHOR) byclh@naver.com, Kim, SeaHwan¹ (AUTHOR), Noh, TaeJoon¹ (AUTHOR), Kang, DongGil¹ (AUTHOR), Jung, SeungBoo¹ (AUTHOR) sbjung@skku.edu

المصدر: Materials (1996-1944). Nov2024, Vol. 17 Issue 22, p5529. 13p.

مصطلحات موضوعية: *FRACTURE strength, *STRAINS & stresses (Mechanics), *RESIDUAL stresses, *SURFACE defects, *SEMICONDUCTOR wafers

المؤلفون: Choi, MiKyeong, Tsai, Julius, Lee, GyeongCheol, Sim, KiDong

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

الاتاحة: http://dx.doi.org/10.1109/ectc51529.2024.00205
http://xplorestaging.ieee.org/ielx8/10564841/10564831/10564856.pdf?arnumber=10564856

المؤلفون: Choi, Mikyeong, Jung, Seung-Boo

المصدر: Journal of the Korean Physical Society ; volume 83, issue 6, page 444-454 ; ISSN 0374-4884 1976-8524

الاتاحة: http://dx.doi.org/10.1007/s40042-023-00881-z
https://link.springer.com/content/pdf/10.1007/s40042-023-00881-z.pdf
https://link.springer.com/article/10.1007/s40042-023-00881-z/fulltext.html

المؤلفون: Choi, MiKyeong, Jung, HyunHye, Oh, KwangSeok, Ryu, DongSu, Lee, SangHyoun, Do, WonChul, Kweon, YoungDo, Kelly, Mike, Park, KyungRok, Khim, JinYoung, Huemoeller, Ron

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

الاتاحة: http://dx.doi.org/10.1109/ectc32862.2020.00211
http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159368.pdf?arnumber=9159368