المؤلفون: Jin-Hua Wang, Y. C. Lee, Po-Chen Lai, S. K. Cheng, Y. S. Lin, Chia-Kuei Hsu, Shu-Shen Yeh, Po-Yao Lin, Ming-Chih Yew, C. H. Chen, Shin-Puu Jeng

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Strain energy release rate, Crack closure, Materials science, law, Delamination, Lamination, Interposer, Bending, Adhesive, Composite material, Finite element method, law.invention

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5aad2a8d1cde9ce59562e0516141a854
https://doi.org/10.1109/ectc32696.2021.00159

المؤلفون: Shin-Puu Jeng, Po-Chen Lai, L. L. Liao, Jin-Hua Wang, Po-Yao Lin, Shu-Shen Yeh, Chia-Kuei Hsu, Ming-Chih Yew, Y. S. Lin, S. K. Cheng, T. Y. Lee, C. H. Chen

المصدر: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

مصطلحات موضوعية: 010302 applied physics, Strain energy release rate, Materials science, 020208 electrical & electronic engineering, Delamination, 02 engineering and technology, Bending, 01 natural sciences, Stress (mechanics), Crack closure, Fracture toughness, Material selection, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Adhesive, Composite material

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::16b731f75868f80bbbb96815acf1ac97
https://doi.org/10.1109/impact50485.2020.9268535

المؤلفون: Po-Yao Chuang, Shin-Puu Jeng, L.-L Liao, Wu Yi-Wen, Szu-Ying Chen, Chia-Kuei Hsu, Hung Shih-Ting, Lin Meng-Liang, Ming-Chih Yew, Tsai Po-Hao, D.-C. Wong, S. K. Cheng, P.-Y. Lai

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: 010302 applied physics, Interconnection, Materials science, 020208 electrical & electronic engineering, Stacking, Base (geometry), Fan-out, 02 engineering and technology, 01 natural sciences, System in package, Reliability (semiconductor), 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Electronic engineering, Interposer, Routing (electronic design automation)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bca53dd4dbbca2648641805680dd97ce
https://doi.org/10.1109/ectc32862.2020.00061

المؤلفون: Po-Chen Lai, Chia-Kuei Hsu, Shu-Shen Yeh, Kuang-Chun Lee, Shin-Puu Jeng, Che-Chia Yang, S. K. Cheng, Jin-Hua Wang, Po-Yao Lin, Dion Tseng, Ming-Chih Yew

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: 010302 applied physics, Materials science, Compression molding, 02 engineering and technology, Molding (process), Dynamic mechanical analysis, 021001 nanoscience & nanotechnology, 01 natural sciences, 0103 physical sciences, Wafer, Integrated circuit packaging, Composite material, 0210 nano-technology, Material properties, Flip chip, Shrinkage

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e7ddecf120305b9e2cbe27cde5d29e4c
https://doi.org/10.1109/ectc32862.2020.00174

المؤلفون: Szu-Ying Chen, C.H. Lin, Chia-Kuei Hsu, Po-Yao Lin, T.M. Lai, Pravin Kavle, C.T. Yu, T. J. Fang, Yi-Hang Lin, Ming-Chih Yew, Kuang-Chun Lee, M.S. Liu, Hsu Feng-Cheng, Shin-Puu Jeng, Ching-Fang Chen

المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Flexibility (engineering), Interconnection, Computer science, 02 engineering and technology, 021001 nanoscience & nanotechnology, Signal, 020202 computer hardware & architecture, Power (physics), System in package, Reliability (semiconductor), 0202 electrical engineering, electronic engineering, information engineering, Interposer, Electronic engineering, 0210 nano-technology, Scaling

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::14e33bf708b54c6dce9a854f02264f38
https://doi.org/10.1109/ectc.2019.00145

المؤلفون: Kuang-Chun Lee, Po-Chen Lai, Chia-Kuei Hsu, Shu-Shen Yeh, Wen-Yi Lin, Ming-Chih Yew, Jin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng, Che-Chia Yang

المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: 010302 applied physics, Modal analysis, Drop (liquid), Fast Fourier transform, Mechanical engineering, 020206 networking & telecommunications, 02 engineering and technology, 01 natural sciences, Finite element method, Drop impact, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Transient response, Impact, Strain gauge

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::32fed20ea8472849e98f86c60b3fa32a
https://doi.org/10.1109/ectc.2019.00238

المؤلفون: Po-Chen Lai, Jin-Hua Wang, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng, Li-Ling Liao, Yu-Sheng Lin, Che-Chia Yang, Chia-Kuei Hsu, Kuang-Chun Lee, Shu-Shen Yeh, Wen-Yi Lin

المصدر: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

مصطلحات موضوعية: 010302 applied physics, Materials science, Electronic packaging, Modulus, 02 engineering and technology, Dynamic mechanical analysis, Molding (process), 021001 nanoscience & nanotechnology, 01 natural sciences, Viscoelasticity, 0103 physical sciences, Dilatometer, Composite material, 0210 nano-technology, Flip chip, Shrinkage

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a0c6680f73b2fd9805e532444b551baf
https://doi.org/10.1109/impact.2018.8625838

المؤلفون: Po-Chen Lai, Shin-Puu Jeng, Che-Chia Yang, Po-Yao Lin, Wen-Yi Lin, Chia-Kuei Hsu, Jin-Hua Wang, Shu-Shen Yeh, Kuang-Chun Lee, Ming-Chih Yew

المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: 010302 applied physics, Materials science, Process modeling, Constitutive equation, 02 engineering and technology, Solid modeling, Dynamic mechanical analysis, 021001 nanoscience & nanotechnology, 01 natural sciences, Viscoelasticity, Reliability (semiconductor), 0103 physical sciences, Composite material, 0210 nano-technology, Flip chip, Shrinkage

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f20bee334ae4e25c33e25665a41f6ffc
https://doi.org/10.1109/ectc.2018.00046

المؤلفون: Po-Yao Lin, Po-Chen Lai, Jin-Hua Wang, Wen-Yi Lin, Chia-Kuei Hsu, Shin-Puu Jeng, Ming-Chih Yew, Kuang-Chun Lee, Shu-Shen Yeh, Che-Chia Yang

المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Strain energy release rate, Materials science, Delamination, Fracture mechanics, 02 engineering and technology, Bending, 01 natural sciences, 010101 applied mathematics, Crack closure, 020303 mechanical engineering & transports, 0203 mechanical engineering, Material selection, Redistribution layer, 0101 mathematics, Composite material, Stress intensity factor

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c90353a71b419a262b41c823723c4381
https://doi.org/10.1109/ectc.2018.00243

المؤلفون: Po-Chen Lai, Jin-Hua Wang, Kuang-Chun Lee, Shu-Shen Yeh, Po-Yao Lin, Che-Chia Yang, Wen-Yi Lin, Ming-Chih Yew, Chia-Kuei Hsu, Shin-Puu Jeng

المصدر: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

مصطلحات موضوعية: Strain energy release rate, chemistry.chemical_classification, Materials science, 020209 energy, 02 engineering and technology, Polymer, Crack closure, Fracture toughness, Material selection, chemistry, 0202 electrical engineering, electronic engineering, information engineering, Wafer, Redistribution layer, Adhesive, Composite material

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::47e7d913b46d5d764d40b33a323179ef
https://doi.org/10.1109/impact.2017.8255953

المؤلفون: Po-Yao Lin, Shin-Puu Jeng, Po-Chen Lai, Chia-Kuei Hsu, Jin-Hua Wang, Che-Chia Yang, Shu-Shen Yeh, Ming-Chih Yew, Wen-Yi Lin, Kuang-Chun Lee

المصدر: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

مصطلحات موضوعية: 010302 applied physics, Process modeling, Materials science, Mechanical engineering, Compression molding, 02 engineering and technology, Dynamic mechanical analysis, Molding (process), 021001 nanoscience & nanotechnology, 01 natural sciences, Finite element method, Viscoelasticity, 0103 physical sciences, Wafer, 0210 nano-technology, Wafer-level packaging

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e16b7f1395a962213641bd811fe43fd7
https://doi.org/10.1109/impact.2017.8255950