المؤلفون: Chee Kan, Lee, Derek, Rebsom, Wei Keat, Loh, Hui Ping, Ng, Kam Wah, Lau

المصدر: 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ; page 1-1

الاتاحة: http://dx.doi.org/10.1109/iemt.2008.5507826
http://xplorestaging.ieee.org/ielx5/5497984/5507772/05507826.pdf?arnumber=5507826

المؤلفون: Wei Keat Loh, Kang Eu Ong, Chee Kan Lee, Ian Chin

المصدر: 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium.

مصطلحات موضوعية: Surface-mount technology, Thermal copper pillar bump, Substrate (building), Materials science, Chip-scale package, Heat spreader, Electronic engineering, Mechanical engineering, Finite element method, Die (integrated circuit), Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::19c539d4076a8d809e712dadb92519cc
https://doi.org/10.1109/iemt.2006.4456453

المؤلفون: Chee Kan Lee, Wei Keat Loh, Kang Eu Ong, Chin, I.

المصدر: 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium; 2006, p185-190, 6p