يعرض 1 - 20 نتائج من 175 نتيجة بحث عن '"CNFET"', وقت الاستعلام: 0.81s تنقيح النتائج
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    المصدر: Mathematics; Volume 11; Issue 12; Pages: 2649

    مصطلحات موضوعية: approximate, full adder, CNFET, alpha blending, high speed

    وصف الملف: application/pdf

    Relation: Mathematics and Computer Science; https://dx.doi.org/10.3390/math11122649

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    المصدر: Micromachines; Volume 14; Issue 5; Pages: 1064

    وصف الملف: application/pdf

    Relation: E:Engineering and Technology; https://dx.doi.org/10.3390/mi14051064

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    المساهمون: IMEC (IMEC), Catholic University of Leuven = Katholieke Universiteit Leuven (KU Leuven), Beihang University (BUAA), ShanghaiTech University Shanghai, Smart Integrated Electronic Systems (LIRMM, Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier (LIRMM), Centre National de la Recherche Scientifique (CNRS)-Université de Montpellier (UM)-Centre National de la Recherche Scientifique (CNRS)-Université de Montpellier (UM), University of Glasgow, Rochester Institute of Technology (RIT)

    المصدر: ISSN: 1063-8210 ; IEEE Transactions on Very Large Scale Integration (VLSI) Systems ; https://hal-lirmm.ccsd.cnrs.fr/lirmm-03593103 ; IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2022, 30 (4), pp.440-448. ⟨10.1109/TVLSI.2022.3146064⟩.

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    المساهمون: IMEC (IMEC), Catholic University of Leuven = Katholieke Universiteit Leuven (KU Leuven), Beihang University (BUAA), Shanghai University, Smart Integrated Electronic Systems (LIRMM, Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier (LIRMM), Centre National de la Recherche Scientifique (CNRS)-Université de Montpellier (UM)-Centre National de la Recherche Scientifique (CNRS)-Université de Montpellier (UM), Synopsys Inc., University of Glasgow, Rochester Institute of Technology (RIT)

    المصدر: ISSN: 1063-8210 ; IEEE Transactions on Very Large Scale Integration (VLSI) Systems ; https://hal-lirmm.ccsd.cnrs.fr/lirmm-03593054 ; IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2022, 30 (4), pp.432-439. ⟨10.1109/TVLSI.2022.3146125⟩.

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    Academic Journal

    المساهمون: Electrical and Computer Engineering, Purdue School of Engineering and Technology

    المصدر: Publisher

    وصف الملف: application/pdf

    Relation: Materials Today: Proceedings; https://hdl.handle.net/1805/40515

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