المؤلفون: Myriam Assous, Stephane Moreau, Jean Charbonnier, Jörg Siegert, Maxime Argoud, N. David, C. Hartler, Nacima Allouti, Ewald Wachmann, A. Plihon, C. Brunet-Manquat

المصدر: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).

مصطلحات موضوعية: Materials science, Passivation, Silicon, business.industry, chemistry.chemical_element, Electromigration, Reliability (semiconductor), chemistry, Miniaturization, Interposer, Optoelectronics, Wafer, business, Wafer-level packaging

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::20d4d6db4b17f9e310ced5328dfe34dc
https://doi.org/10.1109/eptc.2017.8277576

المؤلفون: O. Le-Briz, R. Franiatte, R. Prieto, Perceval Coudrain, C. Brunet-Manquat, Jean-Philippe Colonna, Y. Hallez, C. Chancel, V. Rat, Didier Campos

المصدر: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

مصطلحات موضوعية: Materials science, Silicon, business.industry, Thermal resistance, chemistry.chemical_element, 02 engineering and technology, Substrate (electronics), 020202 computer hardware & architecture, chemistry, Heat spreader, Thermal, 0202 electrical engineering, electronic engineering, information engineering, Microelectronics, Graphite, Composite material, business, Electronic circuit

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0335869bfd657d3bde92bd42032b318c
https://doi.org/10.1109/therminic.2017.8233830

المؤلفون: Myriam Assous, C. Brunet Manquat, T. Hilt, A. Plihon, C. Hartler, Thierry Mourier, H. Gruber, Jennifer Guillaume, Jean Charbonnier, J. P. Bally, Franz Schrank, A. Hassaine, R. Franiatte, K. Pressel, Jörg Siegert

المصدر: 2016 6th Electronic System-Integration Technology Conference (ESTC).

مصطلحات موضوعية: Engineering, Interconnection, Through-silicon via, business.industry, Transistor, Electrical engineering, H bridge, Line (electrical engineering), law.invention, Electric power system, law, Interposer, Electronic engineering, Power semiconductor device, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::04e305b3f1bb1fc63f086ccda68b759f
https://doi.org/10.1109/estc.2016.7764678

المؤلفون: P. Chausse, C. Brunet-Manquat, Christophe Aumont, A. Jouve, P. Coudrain, Severine Cheramy, Roselyne Segaud, J. P. Colonna, N. Sillon, N. Hotellier, G. Garnier, C. Laviron

المصدر: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:000377-000397

مصطلحات موضوعية: Engineering drawing, Engineering, business.product_category, business.industry, Interface (computing), Electrical engineering, Chart, Power consumption, Face (geometry), Die (manufacturing), Pharmacology (medical), Point (geometry), Wafer, business, Backflow

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4f08b82af02026201407ce1c6fa28b26
https://doi.org/10.4071/2012dpc-ta13

المؤلفون: J. Pruvost, Christophe Aumont, L. Gabette, G. Garnier, A. Jouve, K. Vial, R. Segaud, Perceval Coudrain, Pascal Besson, C. Brunet-Manquat, T. Mourier, T. Magis, C. Laviron, E. Saugier, J.-P. Colonna, Severine Cheramy, Nacima Allouti, P. Chausse, Alexis Farcy, N. Hotellier

المصدر: 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).

مصطلحات موضوعية: Engineering, Reliability (semiconductor), CMOS, business.industry, Ball grid array, Electronic engineering, Electrical engineering, Process (computing), Node (circuits), business, Realization (systems), Die (integrated circuit)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c7d44799115f0efe89935f9a8f8e382d
https://doi.org/10.1109/eptc.2012.6507102

المؤلفون: Severine Cheramy, J. Charbonnier, C. Fuchs, Alexis Farcy, G. Garnier, C. Brunet-Manquat, J. Diaz, O. Hajji, R. Anciant, Pascal Ancey, D. Henry, P. Vincent, Lionel Cadix, N. Sillon, P. Chausse

المصدر: 2011 IEEE International Interconnect Technology Conference.

مصطلحات موضوعية: Materials science, Silicon, chemistry, Process (computing), Electronic engineering, Interposer, High density, chemistry.chemical_element, Radio frequency, Dielectric, Silicon interposer

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8ccea25076976a54b48f9abf04661d22
https://doi.org/10.1109/iitc.2011.5940301

المؤلفون: Alexis Farcy, R. Hida, Paul-Henri Haumesser, N. Sillon, E. Saugier, Jean Charbonnier, M. Neyret, David Henry, R. Anciant, G. Garnier, S. Cheramy, C. Brunet-Manquat, Maxime Rousseau, G. Druais, O. Hajji, Laurent Vandroux, J. Cuzzocrea, P. Chausse

المصدر: 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Materials science, Silicon, Process (engineering), Process development, chemistry.chemical_element, Hardware_PERFORMANCEANDRELIABILITY, Capacitance, Parasitic capacitance, Electrical resistance and conductance, chemistry, Plasma-enhanced chemical vapor deposition, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Wafer-level packaging

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::24dc21817bb7c28e8e8b7ef1ca805ca5
https://doi.org/10.1109/ectc.2010.5490835

المؤلفون: Jean Charbonnier, N. Sillon, Sophie Verrun, E. Saugier, M. Neyret, David Henry, L. Bonnot, Severine Cheramy, C. Brunet-Manquat, G. Garnier, Alexis Farcy, Maxime Rousseau, P. Chausse, Lionel Cadix

المصدر: 2009 11th Electronics Packaging Technology Conference.

مصطلحات موضوعية: Wire bonding, Materials science, Parasitic capacitance, Chip-scale package, Wafer bonding, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Mechanical engineering, Wafer, Hardware_PERFORMANCEANDRELIABILITY, Chip, Wafer-level packaging, Die (integrated circuit)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::803bc0ea31ca2bebe227eba02b716fc8
https://doi.org/10.1109/eptc.2009.5416490

المؤلفون: M. Neyret, D. Henry, Sophie Verrun, E. Saugier, X. Gagnard, J. Charbonnier, N. Sillon, S. Cheramy, L. Bonnot, C. Brunet-Manquat, P. Chausse

المصدر: 3DIC

مصطلحات موضوعية: Engineering, business.industry, Process (computing), Mechanical engineering, Hardware_PERFORMANCEANDRELIABILITY, Chip, Wafer backgrinding, Embedded Wafer Level Ball Grid Array, Die preparation, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Wafer testing, Wafer, business, Wafer-level packaging

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::696ea27387bf9e82b71c8df425afa0e0
https://doi.org/10.1109/3dic.2009.5306561

المؤلفون: David Henry, B. Aventurier, C. Brunet-Manquat, N. Sillon, F. Jacquet, J. Michailos, Brendan Dunne, N. Hotellier, P. Chausse, R. Anciant, V. Lapras, Jean Charbonnier

المصدر: 2008 10th Electronics Packaging Technology Conference.

مصطلحات موضوعية: Materials science, Silicon, business.industry, Wafer bonding, Electrical engineering, chemistry.chemical_element, CMOS, chemistry, Etching (microfabrication), Optoelectronics, Bumping, Wafer, Electrical measurements, business, Wafer-level packaging

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1c9e22a81024bda9e93eebafb4268099
https://doi.org/10.1109/eptc.2008.4763409

المؤلفون: N. Sillon, N. Bouzaida, F. Jacquet, Jean Charbonnier, G. Enyedi, C. Brunet-Manquat, V. Lapras, David Henry, B. Aventurier

المصدر: 2008 2nd Electronics Systemintegration Technology Conference.

مصطلحات موضوعية: Materials science, Silicon, Hybrid silicon laser, business.industry, chemistry.chemical_element, chemistry, CMOS, Etching (microfabrication), Electronic engineering, Optoelectronics, Bumping, Wafer, business, Lithography, Wafer-level packaging

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c76c4d4eb1de0227d364175c26b75571
https://doi.org/10.1109/estc.2008.4684340

المؤلفون: T. Enot, N. Sillon, X. Baillin, V. Lapras, David Henry, Jean Charbonnier, C. Brunet-Manquat, B. Aventurier, Fabrice Jacquet, M. Neyret

المصدر: 2008 58th Electronic Components and Technology Conference.

مصطلحات موضوعية: Wafer-scale integration, Materials science, Silicon, business.industry, Wafer bonding, chemistry.chemical_element, Hardware_PERFORMANCEANDRELIABILITY, CMOS, chemistry, Etching (microfabrication), Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Bumping, Optoelectronics, Wafer, business, Wafer-level packaging

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d0a4c9680140f2dae67d5456fca8f29d
https://doi.org/10.1109/ectc.2008.4550028

المؤلفون: C. Puget, C. Brunet-Manquat, D. Henry, N. Sillon, D. Belhachemi, G. Ponthenier

المصدر: 2006 1st Electronic Systemintegration Technology Conference.

مصطلحات موضوعية: Engineering, System in package, Reliability (semiconductor), business.industry, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Deep reactive-ion etching, System integration, System on a chip, Signal integrity, business, Throughput (business), Die (integrated circuit)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::972776989c38719455dac63b2b4a5087
https://doi.org/10.1109/estc.2006.280010

المؤلفون: David Henry, D. Belhachemi, C. Lecouvey, C. Brunet-Manquat, N. Sillon, G. Ponthenier, C. Puget, Jean-Charles Souriau, J.L. Vallejo

المصدر: 56th Electronic Components and Technology Conference 2006.

مصطلحات موضوعية: System in package, Engineering, Reliability (semiconductor), business.industry, Miniaturization, Electrical engineering, Electronic engineering, System integration, System on a chip, Signal integrity, business, Throughput (business), Die (integrated circuit)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4c059a310a53f561f53c624cae0f3f62
https://doi.org/10.1109/ectc.2006.1645834