المؤلفون: G. Tsutsui, S. Song, J. Strane, R. Xie, L. Qin, C. Zhang, D. Schmidt, S. Fan, B. Hong, Y. Jung, C-W. Sohn, I. Hwang, J. Yim, G. H. Son, G. Jo, K-I. Kim, M. Sankarapandian, S. Mochizuki, I. Seshadri, E. Miller, J. Li, J. Demarest, C. Waskiewicz, R. G. Southwick, H. Zhou, R. N. Pujari, P. Nieves, M. Wang, H. Jagannathan, B. Anderson, D. Guo, R. Divakaruni, T. Wu, K-I. Seo, H. Bu

المصدر: 2022 International Electron Devices Meeting (IEDM).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0064f8c338daf52cc73fe7a373b8ea95
https://doi.org/10.1109/iedm45625.2022.10019393

المؤلفون: H. Jagannathan, B. Anderson, C-W. Sohn, G. Tsutsui, J. Strane, R. Xie, S. Fan, K-I. Kim, S. Song, S. Sieg, I. Seshadri, S. Mochizuki, J. Wang, A. Rahman, K-Y. Cheon, I. Hwang, J. Demarest, J. Do, J. Fullam, G. Jo, B. Hong, Y. Jung, M. Kim, S. Kim, R. Lallement, T. Levin, J. Li, E. Miller, P. Montanini, R. Pujari, C. Osborn, M. Sankarapandian, G-H. Son, C. Waskiewicz, H. Wu, J. Yim, A. Young, C. Zhang, A. Varghese, R. Robison, S. Burns, K. Zhao, T. Yamashita, D. Dechene, D. Guo, R. Divakaruni, T. Wu, K-I. Seo, H. Bu

المصدر: 2021 IEEE International Electron Devices Meeting (IEDM).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::63a77295675ddaf85aad9c3d7dd91661
https://doi.org/10.1109/iedm19574.2021.9720561

المؤلفون: C. Y. Kang, J. W. Jang, Js Lee, Chang-Ki Baek, Eui-Young Jeong, Yoon-Ha Jeong, D. Y. Choi, Hyun Chul Sagong, C. W. Sohn

المصدر: Extended Abstracts of the 2012 International Conference on Solid State Devices and Materials.

مصطلحات موضوعية: Stress (mechanics), Materials science, Composite material

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ecbc6bde4ed846a28c74fd2db44c9ff6
https://doi.org/10.7567/ssdm.2012.ps-3-23

المؤلفون: R. H. Baek, Yoon-Ha Jeong, Chang-Ki Baek, Js Lee, C. H. Park, C. W. Sohn, Seung Hwan Lee, M. D. Ko

المصدر: Extended Abstracts of the 2011 International Conference on Solid State Devices and Materials.

مصطلحات موضوعية: Reduction (complexity), Materials science, Silicon, chemistry, Parasitic capacitance, business.industry, Optoelectronics, chemistry.chemical_element, Nanotechnology, business, Silicon nanowires, Layer (electronics), Communication channel

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9b290efa1d58f5bd450a04dd2dd71ffa
https://doi.org/10.7567/ssdm.2011.p-13-2

المؤلفون: Yoon-Ha Jeong, Hyun Chul Sagong, Js Lee, D. Y. Choi, C. Y. Kang, Eui-Young Jeong, C. W. Sohn

المصدر: Extended Abstracts of the 2011 International Conference on Solid State Devices and Materials.

مصطلحات موضوعية: Materials science, business.industry, Optoelectronics, Channel (broadcasting), business, High-κ dielectric, Hot carrier effect

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b33c1b7f9f2d116e2797a20050f69eab
https://doi.org/10.7567/ssdm.2011.p-6-1

المؤلفون: Yoon-Ha Jeong, M. S. Park, Hyun Chul Sagong, C. Y. Kang, K. T. Lee, C. W. Sohn, D. Y. Choi, R. H. Baek

المصدر: Extended Abstracts of the 2010 International Conference on Solid State Devices and Materials.

مصطلحات موضوعية: Materials science, business.industry, Infrasound, Doping, Optoelectronics, Dielectric, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b5b384213f3b093592bee257c1f89351
https://doi.org/10.7567/ssdm.2010.p-3-15

المؤلفون: Michael M. Chen, C. W. Sohn

المصدر: Journal of Heat Transfer. 106:539-542

مصطلحات موضوعية: Materials science, Convective heat transfer, Mechanical Engineering, Thermal resistance, Heat transfer enhancement, Thermodynamics, Heat transfer coefficient, Mechanics, Condensed Matter Physics, Thermal conduction, Physics::Fluid Dynamics, Thermal conductivity, Heat flux, Mechanics of Materials, Heat transfer, General Materials Science

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::001551239ec6e9d8aad2342bd5aee7e0
https://doi.org/10.1115/1.3246712

المؤلفون: C. W. Sohn, Michael M. Chen

المصدر: Journal of Heat Transfer. 103:47-51

مصطلحات موضوعية: Materials science, Turbulence, Mechanical Engineering, Reynolds number, Thermodynamics, Péclet number, Condensed Matter Physics, Thermal diffusivity, Shear rate, symbols.namesake, Thermal conductivity, Mechanics of Materials, symbols, General Materials Science, Two-phase flow, Couette flow

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::da6d9f9be741c95d154abb637d3a599a
https://doi.org/10.1115/1.3244428