المؤلفون: Kaspar, C., Butschke, J., Irmscher, M., Martens, S., Burghartz, J.N.

المصدر: Microelectronic Engineering ; volume 176, page 79-83 ; ISSN 0167-9317

الاتاحة: http://dx.doi.org/10.1016/j.mee.2017.01.034
https://api.elsevier.com/content/article/PII:S0167931717300436?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0167931717300436?httpAccept=text/plain

المؤلفون: Martens, S., Butschke, J., Galler, R., Krüger, M., Sailer, H., Sülzle, M.

المساهمون: Faure, Thomas B., Ackmann, Paul W.

المصدر: SPIE Proceedings ; Photomask Technology 2013 ; ISSN 0277-786X

الاتاحة: http://dx.doi.org/10.1117/12.2030822

المؤلفون: Gramss, J., Galler, R., Neick, V., Stoeckel, A., Weidenmueller, U., Melzer, D., Suelzle, M., Butschke, J., Baetz, U.

Time: 621

Relation: Conference "Photomask Technology" 2009; Photomask Technology 2009; https://publica.fraunhofer.de/handle/publica/365783

الاتاحة: https://publica.fraunhofer.de/handle/publica/365783
https://doi.org/10.1117/12.835880

المؤلفون: Klein, C., Platzgummer, E., Klikovits, J., Piller, W., Loeschner, H., Bejdak, T., Dolezel, P., Kolarik, V., Klingler, W., Letzkus, F., Butschke, J., Irmscher, M., Witt, M., Pilz, W., Jaschinsky, P., Thrum, F., Hohle, C., Kretz, J., Nogatch, J.T., Zepka, A.

Time: 621

Relation: Conference on Alternative Lithographic Technologies 2009; Alternative lithographic technologies. Proceedings. Pt. 1; https://publica.fraunhofer.de/handle/publica/365559

الاتاحة: https://publica.fraunhofer.de/handle/publica/365559
https://doi.org/10.1117/12.813670

المؤلفون: Platzgummer, E., Klein, C., Joechl, P., Loeschner, H., Witt, M., Pilz, W., Butschke, J., Jurisch, M., Letzkus, F., Sailer, H., Irmscher, M.

Time: 621

Relation: Conference "Photomask Technology" 2009; Photomask Technology 2009; https://publica.fraunhofer.de/handle/publica/365690

الاتاحة: https://publica.fraunhofer.de/handle/publica/365690
https://doi.org/10.1117/12.832156

المؤلفون: Klein, C., Platzgummer, E., Loeschner, H., Gross, G., Dolezel, P., Tmej, M., Kolarik, V., Klingler, W., Letzkus, F., Butschke, J., Irmscher, M., Witt, M., Pilz, W.

Time: 621

Relation: Conference "Emerging Lithographic Technologies" 2008; Emerging lithographic technologies XII; https://publica.fraunhofer.de/handle/publica/360167

الاتاحة: https://publica.fraunhofer.de/handle/publica/360167
https://doi.org/10.1117/12.772726

المؤلفون: Pain, L., Icard, B., Tedesco, S., Kampherbeck, B., Gross, G., Klein, C., Loeschner, H., Platzgummer, E., Morgan, R., Manakli, S., Kretz, J., Holhe, C., Choi, K.-H., Thrum, F., Kassel, E., Pilz, W., Keil, K., Butschke, J., Irmscher, M., Letzkus, F., Hudek, P., Paraskevopoulos, A., Ramm, P., Weber, J.

Time: 621

Relation: Conference "Emerging Lithographic Technologies" 2008; Emerging lithographic technologies XII; https://publica.fraunhofer.de/handle/publica/360201

الاتاحة: https://publica.fraunhofer.de/handle/publica/360201
https://doi.org/10.1117/12.772472

المؤلفون: Loeschner, H., Stengl, G., Buschbeck, H., Chalupka, A., Lammer, G., Platzgummer, E., Vonach, H., Jager, de, P.W.H., Kaesmaier, R., Ehrmann, A., Hirscher, S., Wolter, A., Dietzel, A.H., Berger, R., Grimm, H., Terris, B.D., Bruenger, W.H., Adam, D., Boehm, M., Eichhorn, H., Springer, R., Butschke, J., Letzkus, F., Ruchhoeft, P., Wolfe, J.C., Engelstad, R.L.

المساهمون: Microsystems

المصدر: Emerging Lithographic Technologies VI, Santa Clara, 2002, 595-606
STARTPAGE=595;ENDPAGE=606;TITLE=Emerging Lithographic Technologies VI, Santa Clara, 2002

مصطلحات موضوعية: Materials science, business.industry, Extreme ultraviolet lithography, Ion beam lithography, law.invention, Optics, law, Stencil lithography, X-ray lithography, Photolithography, business, Lithography, Maskless lithography, Next-generation lithography

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b05634122368f198bd303bb9a17cc43d
https://doi.org/10.1117/12.472336

المؤلفون: Koepernik, Corinna, Becker, H. W., Butschke, J., Buttgereit, U., Irmscher, M., Nedelmann, L., Schmidt, F., Teuber, S.

المساهمون: Komuro, Masanori

المصدر: SPIE Proceedings ; Photomask and Next-Generation Lithography Mask Technology XII ; ISSN 0277-786X

الاتاحة: http://dx.doi.org/10.1117/12.617110
http://proceedings.spiedigitallibrary.org/proceeding.aspx?doi=10.1117/12.617110

المؤلفون: Zschieschang, U., Rödel, R., Kraft, U., Takimiya, K., Zaki, T., Letzkus, F., Butschke, J., Richter, H., Burghartz, J., Wei, X., Murmann, B., Klauk, H.

المصدر: 2014 Design, Automation & Test in Europe Conference & Exhibition (DATE)

Relation: http://hdl.handle.net/21.11116/0000-000E-C7C8-0

الاتاحة: http://hdl.handle.net/21.11116/0000-000E-C7C8-0

المؤلفون: Löschner, H., Stengl, G., Buschbeck, H., Chalupka, A., Lammer, G., Platzgummer, E., Vonach, H., Jager, P.W.H. de, Käsmaier, R., Ehrmann, A., Hirscher, S., Wolter, A., Dietzel, A., Berger, R., Grimm, H., Terris, B.D., Brünger, W.H., Adam, D., Böhm, M., Eichhorn, H., Springer, R., Butschke, J., Letzkus, F., Ruchhöft, P., Wolfe, J.C.

Time: 621

Relation: Emerging Lithographic Technologies Conference 2002; Emerging Lithographic Technologies VI. Vol.2; https://publica.fraunhofer.de/handle/publica/341020

الاتاحة: https://publica.fraunhofer.de/handle/publica/341020

المؤلفون: Zschieschang, U., Hofmockel, R., Rödel, R., Kraft, U., Kang, M., Takimiya, K., Zaki, T., Letzkus, F., Butschke, J., Richter, H., Burghartz, J., Klauk, H.

المصدر: Organic Electronics

Relation: http://hdl.handle.net/21.11116/0000-000E-C60B-7

الاتاحة: http://hdl.handle.net/21.11116/0000-000E-C60B-7

المؤلفون: Zaki, T., Ante, F., Zschieschang, U., Butschke, J., Letzkus, F., Richter, H., Klauk, H., Burghartz, J.

المصدر: IEEE Journal of Solid-State Circuits

Relation: http://hdl.handle.net/21.11116/0000-000E-C577-E

الاتاحة: http://hdl.handle.net/21.11116/0000-000E-C577-E

المؤلفون: Borany, J. von, Friedrich, M., Rüb, M., Deboy, G., Butschke, J., Letzkus, F.

المصدر: Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms ; volume 237, issue 1-2, page 62-67 ; ISSN 0168-583X

الاتاحة: http://dx.doi.org/10.1016/j.nimb.2005.04.078
https://api.elsevier.com/content/article/PII:S0168583X0500604X?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0168583X0500604X?httpAccept=text/plain

المؤلفون: Loeschner, H., Stengl, G., Buschbeck, H., Chalupka, A., Lammer, G., Platzgummer, E., Vonach, H., Jager, de, P.W.H., Kaesmaier, R., Ehrmann, A., Hirscher, S., Wolter, A., Dietzel, A.H., Berger, R., Grimm, H., Terris, B.D., Bruenger, W.H., Gross, G., Fortagne, O., Adam, D., Boehm, M., Eichhorn, H., Springer, R., Butschke, J., Letzkus, F., Ruchhoeft, P., Wolfe, J.C.

المصدر: Loeschner , H , Stengl , G , Buschbeck , H , Chalupka , A , Lammer , G , Platzgummer , E , Vonach , H , Jager, de , P W H , Kaesmaier , R , Ehrmann , A , Hirscher , S , Wolter , A , Dietzel , A H , Berger , R , Grimm , H , Terris , B D , Bruenger , W H , Gross , G , Fortagne , O , Adam , D , Boehm , M , Eichhorn , H , Springer , R , Butschke ....

الاتاحة: https://research.tue.nl/en/publications/2580e19c-8566-4ce0-9cc7-b4f21c54496e
https://doi.org/10.1117/1.1528946

المؤلفون: Letzkus, F., Butschke, J., Irmscher, M., Reuter, C., Springer, R., Eder, S., Loschner, H., Eberhardt, R., Mohaupt, M., Ehrmann, A., Mathuni, J., Panzer, B., Struck, T.

Time: 620, 621

Relation: Microelectronic engineering; https://publica.fraunhofer.de/handle/publica/198954

الاتاحة: https://publica.fraunhofer.de/handle/publica/198954
https://doi.org/10.1016/S0167-9317(01)00518-4

المؤلفون: Borany, J., Friedrich, M., Rüb, M., Deboy, G., Butschke, J., Letzkus, F.

المصدر: Nuclear Instruments and Methods in Physics Research B 237(2005), 62-67

مصطلحات الفهرس: Power devices, Si doping, Ultra-high energy ion implantation, nuclear reactions, info:eu-repo/semantics/publishedVersion, doc-type:article, Text

URL: https://www.hzdr.de/publications/Publ-6724-2
info:eu-repo/semantics/altIdentifier/purl/https://www.hzdr.de/publications/Publ-6724-2

المؤلفون: Borany, J., Friedrich, M., Rüb, M., Deboy, G., Butschke, J., Letzkus, F.

المصدر: 15th Intern. Conference on Ion Implantation Technology 2004, 24.-29.10.2004, Taipeh, PR China (Taiwan)

مصطلحات الفهرس: Power devices, Si doping, Ultra-high energy ion implantation, nuclear reactions, info:eu-repo/semantics/publishedVersion, doc-type:lecture, Text

URL: https://www.hzdr.de/publications/Publ-6724-1
info:eu-repo/semantics/altIdentifier/purl/https://www.hzdr.de/publications/Publ-6724-1

المؤلفون: Zaki, T., Butschke, J., Letzkus, F., Richter, H., Burghartz, J.N., Ante, F., Zschieschang, U., Klauk, H.

المصدر: 2011 Semiconductor Conference Dresden (SCD); 2011, p1-4, 4p

المؤلفون: Klein, C., Platzgummer, E., Loeschner, H., Gross, G., Dolezel, P., Tmej, M., Kolarik, V., Klingler, W., Letzkus, F., Butschke, J., Irmscher, M., Witt, M., Pilz, W.

المصدر: Proceedings of SPIE; Nov2008, Issue 1, p69211O-69211O-8, 8p