المؤلفون: Vijay Sontakke, Delsikreo Atchina

المصدر: International Journal of Electrical and Computer Engineering (IJECE), 14(1), (2024-02-01)

مصطلحات موضوعية: Built-in repair analysis, Built-in self-repair, Built-in self-test, Error correcting codes, Memory testing, Yield

Relation: oai:zenodo.org:10457155

الاتاحة: https://doi.org/10.11591/ijece.v14i1.pp140-156

المؤلفون: Hayoung Lee, Hyunggoy Oh, Sungho Kang

المصدر: IEEE Access, Vol 9, Pp 56443-56456 (2021)

مصطلحات موضوعية: Post-silicon debug, error detection, dynamic random-access memory (DRAM) usage, debug time, area overhead, built-in self-repair (BISR), Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/9398706/; https://doaj.org/toc/2169-3536

URL الوصول: https://doaj.org/article/9865f20309de46f193ca144c6cd8a675

المؤلفون: Donghyun Han, Hayoung Lee, Sungho Kang

المصدر: IEEE Access, Vol 9, Pp 76716-76729 (2021)

مصطلحات موضوعية: Built-in redundancy analysis (BIRA), built-in self-repair (BISR), built-in self-test (BIST), memory repair, repair rate, yield improvement, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/9439471/; https://doaj.org/toc/2169-3536

URL الوصول: https://doaj.org/article/eb095466d6924cb1a15480fd52b3797c

المؤلفون: Acharya, Gobinda Prasad, Rani, Muddapu Asha, Kumar, Ganjikunta Ganesh, Poluboyina, Lavanya

المصدر: Indonesian Journal of Electrical Engineering and Computer Science, 26(1), 96-104, (2022-04-01)

مصطلحات موضوعية: Built-in self-test, Fault-map unit, March SS algorithm, Memory built-in self-repair, SRAM, System-on-chip

Relation: oai:zenodo.org:7141295

الاتاحة: https://doi.org/10.11591/ijeecs.v26.i1.pp96-104

المؤلفون: Mohammed Altaf Ahmed, Suleman Alnatheer

المصدر: Micromachines; Volume 13; Issue 6; Pages: 971

مصطلحات موضوعية: built-in self-test, Built-In Self-Repair, Built-In Redundancy Analysis, deep Q-learning, fault injection, system-on-chip, CMOS, Static Random Access Memory

وصف الملف: application/pdf

Relation: E：Engineering and Technology; https://dx.doi.org/10.3390/mi13060971

الاتاحة: https://doi.org/10.3390/mi13060971

المؤلفون: Tianming Ni, Hao Chang, Yao Yao, Xueyun Li, Zhengfeng Huang

المصدر: IEEE Access, Vol 7, Pp 65052-65059 (2019)

مصطلحات موضوعية: 3D memory, built-in self-repair, yield, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/8717999/; https://doaj.org/toc/2169-3536

URL الوصول: https://doaj.org/article/6a30a17e4741464ea0aafafce2949205

المؤلفون: Sinha, Aditi

مصطلحات موضوعية: Computer engineering, Built-in Self-repair, Design for Testability (DFT), Memory Compilers, Physical Design, SRAMs, VLSI

وصف الملف: application/pdf

URL الوصول: https://escholarship.org/uc/item/1q5617kb

المؤلفون: Gergely Hantos, Marc P.Y. Desmulliez, Gergely Simon

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:454-461

مصطلحات موضوعية: Stress (mechanics), Microelectromechanical systems, Materials science, Microphone, Diaphragm (acoustics), Acoustics, Capacitive sensing, Built in self repair, Electrical and Electronic Engineering, Electrostatics, Capacitive microphone, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7555e722a0831600046df74965835ca5
https://doi.org/10.1109/tcpmt.2021.3107225

المؤلفون: Sujana, Ragi¹, Rani, M. Asha²

المصدر: Journal of Innovation in Computer Science and Engineering 2(2):27-31. 2013

المؤلفون: Sujana, Ragi¹, Rani, M. Asha²

المصدر: Journal of Innovation in Electronics and Communication Engineering 2(2):27-31. 2012

المؤلفون: Hyunggoy Oh, Hayoung Lee, Sungho Kang

المصدر: IEEE Access, Vol 9, Pp 56443-56456 (2021)

مصطلحات موضوعية: General Computer Science, Computer science, media_common.quotation_subject, built-in self-repair (BISR), 02 engineering and technology, Maintenance engineering, area overhead, 020204 information systems, error detection, debug time, 0202 electrical engineering, electronic engineering, information engineering, General Materials Science, System on a chip, dynamic random-access memory (DRAM) usage, Observability, media_common, business.industry, General Engineering, Signature (logic), TK1-9971, 020202 computer hardware & architecture, Post-silicon debug, Debugging, Built-in self-test, Embedded system, Electrical engineering. Electronics. Nuclear engineering, business, Error detection and correction, Dram

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::272eff4ac648da8cc96ae3e5434863d6
https://doi.org/10.1109/access.2021.3071517

المؤلفون: V.G. Ryabtsev, S.V. Volobuev

المصدر: Proceedings of Universities. Electronics. 25:339-346

مصطلحات موضوعية: business.industry, Computer science, Embedded system, Built in self repair, business, Chip, Microbiology

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f4728f57a6e7b916ef7d6666e325edb8
https://doi.org/10.24151/1561-5405-2020-25-4-339-346

المؤلفون: Meena, Shweta

المصدر: Asian Journal of Engineering and Applied Technology; Vol. 2 No. 1 (2013): January-June 2013; 21-27 ; 2249-068X ; 10.51983/ajeat-2013.2.1

مصطلحات موضوعية: Memory built-in self test (MBIST), Built-in redundancy analysis (BIRA), Writing0/ writing1 algorithm, Built-in self repair

وصف الملف: application/pdf

Relation: https://ojs.trp.org.in/index.php/ajeat/article/view/646/3276; https://ojs.trp.org.in/index.php/ajeat/article/view/646

الاتاحة: https://ojs.trp.org.in/index.php/ajeat/article/view/646
https://doi.org/10.51983/ajeat-2013.2.1.646

المؤلفون: Marc P.Y. Desmulliez, Gergely Hantos

المصدر: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).

مصطلحات موضوعية: Microelectromechanical systems, Computer science, Microphone, Acoustics, Capacitive sensing, 020208 electrical & electronic engineering, 010401 analytical chemistry, Measure (physics), 02 engineering and technology, 01 natural sciences, 0104 chemical sciences, Built-in self-test, Snapback, ComputerSystemsOrganization_MISCELLANEOUS, 0202 electrical engineering, electronic engineering, information engineering, Built in self repair, Voltage

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::362b3e0e33fe7dbc1adb41571dec5453
https://doi.org/10.1109/estc48849.2020.9229745

المؤلفون: Surajit Kumar Roy, Chandan Giri, Dilip Kumar Maity

المصدر: 2020 IEEE International Test Conference India.

مصطلحات موضوعية: Computer science, 020208 electrical & electronic engineering, Overhead (engineering), Hardware_PERFORMANCEANDRELIABILITY, 02 engineering and technology, Integrated circuit, Electromigration, 020202 computer hardware & architecture, Reliability engineering, law.invention, Reliability (semiconductor), Power consumption, law, Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, Built in self repair, Latency (engineering), Critical path method

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e0d3b6b01eecc61ecdde274829a172bf
https://doi.org/10.1109/itcindia49857.2020.9171797

المؤلفون: Hao Chang, Xueyun Li, Tianming Ni, Zhengfeng Huang, Yao Yao

المصدر: IEEE Access, Vol 7, Pp 65052-65059 (2019)

مصطلحات موضوعية: General Computer Science, Computer science, General Engineering, 3D memory, built-in self-repair, Parallel computing, yield, Row and column spaces, Redundancy (engineering), General Materials Science, lcsh:Electrical engineering. Electronics. Nuclear engineering, Cluster analysis, lcsh:TK1-9971, 3d memory

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f264895d6c6425283762176f11111384
https://doi.org/10.1109/access.2019.2917195

المؤلفون: Lu, S.-K., Yu, S.-C., Hsu, C.-L., Sun, C.-T., Hashizume, M., Yotsuyanagi, H.

مصطلحات موضوعية: Built-in self-repair (BISR), dependability, error-correction code (ECC), fault-aware, flash memory

وصف الملف: 108 bytes; text/html

Relation: IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Volume 28, Issue 3, Page: 634 - 645; http://ir.lib.ntust.edu.tw/handle/987654321/82066; http://ir.lib.ntust.edu.tw/bitstream/987654321/82066/1/index.html

الاتاحة: http://ir.lib.ntust.edu.tw/handle/987654321/82066
https://doi.org/10.1109/TVLSI.2019.2957830
http://ir.lib.ntust.edu.tw/bitstream/987654321/82066/1/index.html

المؤلفون: L.A. Shchigorev

المصدر: NANO- I MIKROSISTEMNAYA TEHNIKA. 20:98-106

مصطلحات موضوعية: Control and Systems Engineering, Computer science, Built in self repair, Electrical and Electronic Engineering, Reliability engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::41b8fe737216bfb17f25f9b60b4725d1
https://doi.org/10.17587/nmst.20.98-106

المؤلفون: RC Module, L.A. Shchigorev

المصدر: Problems of advanced micro- and nanoelectronic systems development. :123-129

مصطلحات موضوعية: Structure (mathematical logic), Development (topology), Computer architecture, Computer science, Built in self repair, Static random-access memory

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c5781efa9aded974942753639a8391c9
https://doi.org/10.31114/2078-7707-2018-2-123-129

المؤلفون: BENSO, Alfredo, DI CARLO, STEFANO, DI NATALE, Giorgio, PRINETTO, Paolo Ernesto

المساهمون: Benso, Alfredo, DI CARLO, Stefano, DI NATALE, Giorgio, Prinetto, Paolo Ernesto

مصطلحات موضوعية: DIGITAL SYSTEM DESIGN TEST AND VERIFICATION, Digital filter, Digital signal processing chip, Finite impulse response filter, built-in self-test (BIST), built.-in self-repair (BISR)

وصف الملف: STAMPA

Relation: info:eu-repo/semantics/altIdentifier/wos/WOS:000182688100009; volume:20; issue:3; firstpage:50; lastpage:57; numberofpages:8; journal:IEEE DESIGN & TEST OF COMPUTERS; http://hdl.handle.net/11583/1499804; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-0038044543; http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=1198686

الاتاحة: http://hdl.handle.net/11583/1499804
https://doi.org/10.1109/MDT.2003.1198686
http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=1198686