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1Report
المؤلفون: Cavalcante, Matheus, Agnesina, Anthony, Riedel, Samuel, Brunion, Moritz, Garcia-Ortiz, Alberto, Milojevic, Dragomir, Catthoor, Francky, Lim, Sung Kyu, Benini, Luca
مصطلحات موضوعية: Computer Science - Hardware Architecture
URL الوصول: http://arxiv.org/abs/2112.01168
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2Academic Journal
المؤلفون: Giacomini Rocha, Leandro M., Naeim, Mohamed, Paim, Guilherme, Brunion, Moritz, Venugopal, Priya, Milojevic, Dragomir, Myers, James, Badaroglu, Mustafa, Verhelst, Marian, Ryckaert, Julien, Biswas, Dwaipayan
المصدر: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits ; volume 10, page 125-134 ; ISSN 2329-9231
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3Conference
المؤلفون: Calvacante, Matheus, Agnesina, Anthony, Riedel, Samuel, Brunion, Moritz, García-Ortiz, Alberto, Milojevic, Dragomir, Catthoor, Francky, Lim, Sung Kyu, Benini, Luca LB
المصدر: In: Proceedings of the 2022
مصطلحات موضوعية: Sciences de l'ingénieur
وصف الملف: 1 full-text file(s): application/octet-stream
Relation: https://dipot.ulb.ac.be/dspace/bitstream/2013/351862/3/9774726; http://hdl.handle.net/2013/ULB-DIPOT:oai:dipot.ulb.ac.be:2013/351862
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4Conference
المؤلفون: Agnesina, Anthony, Brunion, Moritz, García-Ortiz, Alberto, Catthoor, Francky, Milojevic, Dragomir, Komalan, Manu, Cavalcante, Matheus, Riedel, Samuel, id_orcid:0 000-0002-5772-6377, Benini, Luca, id_orcid:0 000-0001-8068-3806
المساهمون: Li, Helen, Augustine, Charles, Kivilcim Coskun, Ayse, Ghosh, Swaroop
المصدر: ISLPED '22: Proceedings of the ACM/IEEE International Symposium on Low Power Electronics and Design
مصطلحات موضوعية: Hier-3D, Physical Design Methodology, Wafer-level Bonding, Faceto-Face (F2F) Bonded 3D ICs
وصف الملف: application/application/pdf
Relation: info:eu-repo/semantics/altIdentifier/isbn/978-1-4503-9354-6; http://hdl.handle.net/20.500.11850/567773; urn:isbn:978-1-4503-9354-6
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5Conference
المؤلفون: Das, Sudipta, Riedel, Samuel, id_orcid:0 000-0002-5772-6377, Bertuletti, Marco, id_orcid:0 000-0001-7576-0803, Benini, Luca, id_orcid:0 000-0001-8068-3806, Brunion, Moritz, Ryckaert, Julien, Myers, James, Biswas, Dwaipayan, Milojevic, Dragomir
المصدر: 2024 IEEE International Symposium on Circuits and Systems (ISCAS)
مصطلحات موضوعية: STCO, 3D-IC, system architecture, interconnect architecture, 3D partitioning, logic-on-logic, memory-on-logic
Relation: info:eu-repo/semantics/altIdentifier/isbn/979-8-3503-3099-1; info:eu-repo/semantics/altIdentifier/isbn/979-8-3503-3100-4; info:eu-repo/semantics/altIdentifier/wos/001268541104058; http://hdl.handle.net/20.500.11850/695352
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6Conference
المؤلفون: Zhou, Yun, Song, S.C., Kükner, Halil, Sisto, Giuliano, Yang, Sheng, Farokhnejad, Anita, Naeim, Mohamed, Brunion, Moritz, Lin, Ji-Yung, Zografos, Odysseas, Weckx, Pieter, Ekbote, Shashank, Stevens-Yu, Nick, Greenlaw, David, Molloy, Steve, Hellings, Geert, Ryckaert, Julien
المصدر: 2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ; page 1-2
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7Periodical
المصدر: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems; September 2024, Vol. 43 Issue: 9 p2741-2754, 14p
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8Academic Journal
المؤلفون: Bethur, Nesara Eranna, Agnesina, Anthony, Brunion, Moritz, Garcia-Ortiz, Alberto, Catthoor, Francky, Milojevic, Dragomir, Komalan, Manu, Cavalcante, Matheus, id_orcid:0 000-0001-9199-1708, Riedel, Samuel, id_orcid:0 000-0002-5772-6377, Benini, Luca, id_orcid:0 000-0001-8068-3806, Lim, Sung Kyu
المصدر: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 43 (7)
مصطلحات موضوعية: Bonded 3-D ICs, face-to-face (F2F), hier-3D, physical design methodology, wafer-level bonding
Relation: info:eu-repo/semantics/altIdentifier/wos/001253147600011; http://hdl.handle.net/20.500.11850/681677
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9Academic Journal
المؤلفون: Agnesina, Anthony, Brunion, Moritz, Kim, Jinwoo, García-Ortiz, Alberto, Milojevic, Dragomir, Catthoor, Francky, Perumkunnil, Manu, Lim, Sung Kyu
المصدر: Proceedings - International Symposium on Low Power Electronics and Design, 2021-July
مصطلحات موضوعية: Généralités
وصف الملف: 1 full-text file(s): application/octet-stream
Relation: uri/info:doi/10.1109/ISLPED52811.2021.9502475; uri/info:scp/85114383138; https://dipot.ulb.ac.be/dspace/bitstream/2013/351824/3/9502475; http://hdl.handle.net/2013/ULB-DIPOT:oai:dipot.ulb.ac.be:2013/351824
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10Conference
المصدر: Proceedings of the 2023 International Symposium on Physical Design
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11Academic Journal
المؤلفون: Agnesina, Anthony, Brunion, Moritz, Kim, Jinwoo, Garcia-Ortiz, Alberto, Milojevic, Dragomir, Catthoor, Francky, Mirabelli, Gioele, Komalan, Manu, Lim, Sung Kyu
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology ; volume 13, issue 3, page 300-314 ; ISSN 2156-3950 2156-3985
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12Conference
المؤلفون: Cavalcante, Matheus, Agnesina, Anthony, Riedel, Samuel, Brunion, Moritz, Garcia-Ortiz, Alberto, Milojevic, Dragomir, Catthoor, Francky, Lim, Sung Kyu, Benini, Luca
المصدر: 2022 Design, Automation & Test in Europe Conference & Exhibition (DATE)
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13Periodical
المؤلفون: Venkateswarlu, Sankatali, Mishra, Subrat, Oprins, Herman, Vermeersch, Bjorn, Brunion, Moritz, Han, Jun-Han, Stan, Mircea R., Biswas, Dwaipayan, Weckx, Pieter, Catthoor, Francky
المصدر: IEEE Transactions on Very Large Scale Integration Systems; December 2023, Vol. 31 Issue: 12 p1896-1904, 9p
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14Academic Journal
المؤلفون: Venkateswarlu, Sankatali, Mishra, Subrat, Oprins, Herman, Vermeersch, Bjorn, Brunion, Moritz, Han, Jun-Han, Stan, Mircea R., Weckx, Pieter, Catthoor, Francky
المصدر: IEEE Transactions on Very Large Scale Integration (VLSI) Systems ; volume 30, issue 11, page 1668-1676 ; ISSN 1063-8210 1557-9999