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1Conference
المؤلفون: Zhang, J., Denning, D., Braeckelmann, G., Venkatraman, R., Fiordalice, R., Weitzman, E.
المصدر: Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102) ; page 163-165
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2Conference
المؤلفون: Braeckelmann, G., Venkatraman, R., Capasso, C., Herrick, M.
المصدر: Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407)
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3Conference
المؤلفون: Braeckelmann, G., Manger, D., Seo, S.C., Beasor, S., Nifsten, S., Kaloyeros, A.E.
المصدر: European Workshop Materials for Advanced Metallization, ; page 27-29
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4Academic Journal
المؤلفون: Humbert, A., Regnier, C., Braeckelmann, G., Basso, M.-T., Ferreira, P.
المصدر: Materials Science and Engineering: B ; volume 114-115, page 209-213 ; ISSN 0921-5107
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5Conference
المؤلفون: Gonchond, J.-P., Wyon, C., Cacho, F., Braeckelmann, G., Rolland, G., Kwakman, L. F. Tz., Tsach, Y., Agnihotri, D. K., Formica, J. P.
المصدر: AIP Conference Proceedings; 2005, Vol. 788 Issue 1, p182-186, 5p
مصطلحات موضوعية: SILICIDES, THIN films, SEMICONDUCTORS, OPTICAL diffraction, NICKEL, PHYSICAL sciences
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6Conference
المؤلفون: Braeckelmann, G., Venkatraman, R., Capasso, C., Herrick, M.
المصدر: Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407); 2000, p236-238, 3p
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7Conference
المؤلفون: Zhang, J., Denning, D., Braeckelmann, G., Venkatraman, R., Fiordalice, R., Weitzman, E.
المصدر: Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat No98EX102); 1998, p163-165, 3p
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8Conference
المؤلفون: Denning, D., Braeckelmann, G., Zhang, J., Fiordalice, B., Venkatramen, R.
المصدر: 1998 Symposium on VLSI Technology Digest of Technical Papers (Cat No98CH36216); 1998, p22-23, 2p