المؤلفون: Roos A, van der Ven PFM, Alrohaif H, Kolbel H, Heil L, Della Marina A, Weis J, Assent M, Beck-Wodl S, Barresi R, Topf A, O'Connor K, Sickmann A, Kohlschmidt N, El Gizouli M, Meyer N, Daya N, Grande V, Bois K, Kaiser FJ, Vorgerd M, Schroder C, Schara-Schmidt U, Gangfuss A, Evangelista T, Robisch L, Hentschel A, Gruneboom A, Fuerst DO, Kuechler A, Tzschach A, Depienne C, Lochmuller H

المصدر: Brain, 3 October 2023

Relation: https://eprints.ncl.ac.uk/294343

الاتاحة: https://eprints.ncl.ac.uk/294343

المؤلفون: Bois, K. J., Benally, A., Nowak, P. S., Zoughi, R.

المصدر: Research in Nondestructive Evaluation ; volume 9, issue 4, page 227-238 ; ISSN 0934-9847 1432-2110

الاتاحة: http://dx.doi.org/10.1080/09349849709414476
http://www.tandfonline.com/doi/pdf/10.1080/09349849709414476

المؤلفون: Quint, D., Bois, K.

المصدر: 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) ; page 1073-1079

الاتاحة: http://dx.doi.org/10.1109/ectc.2002.1008235
http://xplorestaging.ieee.org/ielx5/7890/21740/01008235.pdf?arnumber=1008235

المؤلفون: Bachmann, C.M., Donato, T.F., Lamela, G.M., Rhea, W.J., Bettenhausen, M.H., Fusina, R.A., Du Bois, K., Lathrop, R., Geib, J., Porter, J.H., Truitt, B.R.

المصدر: IEEE International Geoscience and Remote Sensing Symposium ; volume 3, page 1661-1663

الاتاحة: http://dx.doi.org/10.1109/igarss.2002.1026213
http://xplorestaging.ieee.org/ielx5/7969/22038/01026213.pdf?arnumber=1026213

المؤلفون: Srinivas, V., Bois, K., Knee, D., Quint, D., Chang, Frank, Verbauwhede, Ingrid

مصطلحات موضوعية: cosic

Relation: IEEE Electrical Performance of Electronic Packaging 2002 pages:15-18; IEEE Electrical Performance of Electronic Packaging 2002 date:October 21-23, 2002; https://lirias.kuleuven.be/handle/123456789/234294; https://www.cosic.esat.kuleuven.be/publications/article-704.pdf

الاتاحة: https://lirias.kuleuven.be/handle/123456789/234294
https://www.cosic.esat.kuleuven.be/publications/article-704.pdf

المؤلفون: A.Z. Subramanian, A. Dhakal, F. Peyskens, S. Selvaraja, R. Baets, P. Neutens, R. Jansen, T. Claes, X. Rottenberg, P. Helin, B. Du Bois, K. Leyssens, S. Severi, P. Deshpande, P. Van Dorpe

المصدر: IEEE Photonics Journal.

URL الوصول: https://explore.openaire.eu/search/publication?articleId=erc_________::1e91bab783066b63b960fb63398b114d

المؤلفون: Bois, K. J.

المصدر: AIP Conference Proceedings ; volume 509, page 1717-1722 ; ISSN 0094-243X

الاتاحة: http://dx.doi.org/10.1063/1.1306239

المؤلفون: Frank, M., Handjojo, L., Qaddoumi, N., Bois, K., Zoughi, R.

المصدر: AIP Conference Proceedings ; page 57-62

الاتاحة: http://dx.doi.org/10.1063/1.1301983

المؤلفون: Bois, K. P. D., Deroin, J., Cochran, K. W.

المصدر: Experimental Biology and Medicine ; volume 81, issue 1, page 230-233 ; ISSN 1535-3702 1535-3699

الاتاحة: http://dx.doi.org/10.3181/00379727-81-19830

المؤلفون: Quint, D., Bois, K.

المصدر: IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005; 2005, p135-138, 4p

المؤلفون: Quint, D., Bois, K.

المصدر: 52nd Electronic Components & Technology Conference 2002. (Cat. No.02CH37345); 2002, p1073-1079, 7p

المؤلفون: Quint, D., Bois, K.

المصدر: Electrical Performance of Electronic Packaging,; 2002, p133-136, 4p

المؤلفون: Quan Qi, Quint, D., Frank, M., Michalka, T., Bois, K.

المصدر: 2001 Proceedings 51st Electronic Components & Technology Conference (Cat. No.01CH37220); 2001, p111-117, 7p

المؤلفون: Gerard, V., Du Bois, K.

المصدر: Marine Biology; 1988, Vol. 97 Issue 4, p575-580, 6p

مصطلحات موضوعية: LAMINARIA saccharina, PHOTOSYNTHESIS, PLANT physiology, PLANT development

مصطلحات جغرافية: NEW York (State)

المؤلفون: Hruban, Zdenek, Schulman, S., Warner, N. E., Du Bois, K. P., Bunnag, S., Bunnag, S. C.

المصدر: JAMA: Journal of the American Medical Association; May 1963, Vol. 184 Issue: 7 p590-593, 4p

المؤلفون: BYERRUM, R U, DU BOIS, K P

المصدر: The Journal of Pharmacology and Experimental Therapeutics; August 1947, Vol. 90 Issue: 4 p321-329, 9p

المؤلفون: Quint, D., Bois, K., Yong Wang

المصدر: 2004 Proceedings 54th Electronic Components & Technology Conference (IEEE Cat. No.04CH37546); 2004, p255-255, 1p

المؤلفون: Bachmann, C.M., Donato, T.F., Lamela, G.M., Rhea, W.J., Bettenhausen, M.H., Fusina, R.A., Du Bois, K., Lathrop, R., Geib, J., Porter, J.H., Truitt, B.R.

المصدر: IEEE International Geoscience & Remote Sensing Symposium; 2002, p1661-1661, 1p

المساهمون: Du Bois, K

المصدر: American Journal of Physiology (U.S.) ; Vol: 181; Other Information: Orig. Receipt Date: 31-DEC-55

وصف الملف: Medium: X; Size: Pages: 513-18

URL الوصول: http://www.osti.gov/scitech/biblio/4383780

المساهمون: Du Bois, K

المصدر: J. Pharmacol. Exptl. Therap. ; Vol: 102; Other Information: Orig. Receipt Date: 31-DEC-51

وصف الملف: Medium: X; Size: Pages: 165-78

URL الوصول: http://www.osti.gov/scitech/biblio/4416071