المؤلفون: Adel Elsherbini, Kimin Jun, Richard Vreeland, William Brezinski, Haris Khan Niazi, Yi Shi, Qiang Yu, Zhiguo Qian, Jessica Xu, Shawna Liff, Johanna Swan, Jimin Yao, Pilin Liu, Christopher Pelto, Said Rami, Ajay Balankutty, Paul Fischer, Bob Turkot

المصدر: 2021 IEEE International Electron Devices Meeting (IEDM).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0d4572e6e7b34e8b4950c24040f36fd8
https://doi.org/10.1109/iedm19574.2021.9720586

المؤلفون: W. Rachmady, Phan Anh, G. Dewey, P. Nguyen, Matthew V. Metz, Tung I-Cheng, Patrick Morrow, Rajat Kanti Paul, Scott B. Clendenning, Nicole K. Thomas, A. A. Oni, Ryan Keech, Marko Radosavljevic, Huang Cheng-Ying, Alaan Urusa, Manan Mehta, Kang Jun Sung, A. Lilak, Mannebach Ehren, Hui Jae Yoo, Bob Turkot, Kabir Nafees, S. Vishwanath, K. L. Cheong, Richard E. Schenker, B. Krist, Michael K. Harper, Jack Portland Kavalieros

المصدر: 2020 IEEE International Electron Devices Meeting (IEDM).

مصطلحات موضوعية: Moore's law, Materials science, business.industry, media_common.quotation_subject, Transistor, Hardware_PERFORMANCEANDRELIABILITY, law.invention, PMOS logic, CMOS, law, Logic gate, Hardware_INTEGRATEDCIRCUITS, Inverter, Optoelectronics, business, Metal gate, NMOS logic, Hardware_LOGICDESIGN, media_common

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::df2fecb4c1020f6a74997a8120152a6c
https://doi.org/10.1109/iedm13553.2020.9372066

المؤلفون: Anna Lio, S. Carson, Bob Turkot

المصدر: 2017 IEEE International Electron Devices Meeting (IEDM).

مصطلحات موضوعية: Moore's law, 021103 operations research, Computer science, media_common.quotation_subject, Extreme ultraviolet lithography, 020208 electrical & electronic engineering, 0211 other engineering and technologies, 02 engineering and technology, Photoresist, Engineering physics, High volume manufacturing, Resist, Pellicle membrane, 0202 electrical engineering, electronic engineering, information engineering, Lithography, media_common

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::cae36df1a10595ed08a84944dc22e602
https://doi.org/10.1109/iedm.2017.8268390

المؤلفون: James S. Clarke, Ramanan V. Chebiam, Seung Hoon Sung, Chris Jezewski, Bob Turkot, Hui Jae Yoo, Jasmeet S. Chawla, Colin T. Carver, Tronic Tristan A

المصدر: 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).

مصطلحات موضوعية: Interconnection, Materials science, SIMPLE (military communications protocol), Silicon, Process development, business.industry, Nanowire, chemistry.chemical_element, Nanotechnology, Metal, chemistry, Hardware_GENERAL, visual_art, Hardware_INTEGRATEDCIRCUITS, visual_art.visual_art_medium, Optoelectronics, Electrical measurements, Node (circuits), business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d1e366f73852d275b4cdf82017ba0177
https://doi.org/10.1109/iitc-mam.2015.7325633