المؤلفون: Ye, J., Takac, M., Berglund, C.N., Owen, G., Pease, R.F.

المصدر: Precision Engineering ; volume 20, issue 1, page 16-32 ; ISSN 0141-6359

الاتاحة: http://dx.doi.org/10.1016/s0141-6359(97)00005-6
https://api.elsevier.com/content/article/PII:S0141635997000056?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0141635997000056?httpAccept=text/plain

المؤلفون: Weber, C.M., Berglund, C.N.

المصدر: A Unifying Discipline for Melting the Boundaries Technology Management: ; page 18-34

الاتاحة: http://dx.doi.org/10.1109/picmet.2005.1509668
http://xplorestaging.ieee.org/ielx5/10096/32329/01509668.pdf?arnumber=1509668

المؤلفون: Berglund, C.N., Weber, C.M., Castilla, C.

المصدر: The 17th Annual SEMI/IEEE ASMC 2006 Conference ; page 439-445

الاتاحة: http://dx.doi.org/10.1109/asmc.2006.1638798
http://xplorestaging.ieee.org/ielx5/10915/34362/01638798.pdf?arnumber=1638798

المؤلفون: Appleyard, M.M., Berglund, C.N., Peterson, C., Smith, R.W.

المصدر: A Unifying Discipline for Melting the Boundaries Technology Management: ; page 237-243

الاتاحة: http://dx.doi.org/10.1109/picmet.2005.1509696
http://xplorestaging.ieee.org/ielx5/10096/32329/01509696.pdf?arnumber=1509696

المؤلفون: Weber, C., Berglund, C.N., Gabella, P.

المصدر: 2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530) ; page 279-284

الاتاحة: http://dx.doi.org/10.1109/asmc.2004.1309582
http://xplorestaging.ieee.org/ielx5/9154/29060/01309582.pdf?arnumber=1309582

المؤلفون: Ouyang, X., Deeter, T., Berglund, C.N., Pease, R.F.W., McCord, M.A.

المصدر: ICMTS 2000. Proceedings of the 2000 International Conference on Microelectronic Test Structures (Cat. No.00CH37095) ; page 25-31

الاتاحة: http://dx.doi.org/10.1109/icmts.2000.844400
http://xplorestaging.ieee.org/ielx5/6807/18268/00844400.pdf?arnumber=844400

المؤلفون: Berglund, C.N.

المصدر: IEEE Transactions on Semiconductor Manufacturing ; volume 9, issue 3, page 447-454 ; ISSN 0894-6507

الاتاحة: http://dx.doi.org/10.1109/66.536115
http://xplorestaging.ieee.org/ielx3/66/11174/00536115.pdf?arnumber=536115

المؤلفون: Berglund, C.N., Weber, C.M.

المصدر: PICMET '07 - 2007 Portland International Conference on Management of Engineering & Technology; 2007, p2888-2904, 17p

المؤلفون: Berglund, C.N., Harmon, R.R.

المصدر: PICMET '07 - 2007 Portland International Conference on Management of Engineering & Technology; 2007, p1968-1974, 7p

المؤلفون: Berglund, C.N., Weber, C.M., Gabella, P.

المصدر: 2006 Technology Management for the Global Future - PICMET 2006 Conference; 2006, p2353-2371, 19p

المؤلفون: Weber, C.M., Berglund, C.N.

المصدر: Unifying Discipline for Melting the Boundaries Technology Management; 2005, p18-34, 17p

المؤلفون: Ouyang, X., Deeter, T., Berglund, C.N., Pease, R.F.W., McCord, M.A.

المصدر: ICMTS 2000. Proceedings of the 2000 International Conference on Microelectronic Test Structures (Cat. No.00CH37095); 2000, p25-31, 7p

المؤلفون: Yu, K., Chwang, R.J.C., Bohr, M.T., Warkentin, P.A., Stern, S., Berglund, C.N.

المصدر: IEEE Journal of Solid-State Circuits; 1981, Vol. 16 Issue 5, p454-459, 6p

المؤلفون: Jun Ye, Berglund, C.N., Robinson, J., Pease, R.F.W.

المصدر: IEEE Transactions on Semiconductor Manufacturing; 1995, Vol. 8 Issue 3, p319-325, 7p

المؤلفون: Berglund, C.N., Klein, N.

المصدر: Proceedings of the IEEE; 1971, Vol. 59 Issue 7, p1099-1110, 12p

المؤلفون: Berglund, C.N., Boll, H.J.

المصدر: IEEE Transactions on Electron Devices; 1972, Vol. 19 Issue 7, p852-860, 9p

المؤلفون: Berglund, C.N., Walden, R.H.

المصدر: IEEE Transactions on Electron Devices; 1970, Vol. 17 Issue 2, p137-148, 12p

المؤلفون: Berglund, C.N.

المصدر: IEEE Transactions on Electron Devices; 1969, Vol. 16 Issue 5, p432-437, 6p

المؤلفون: Berglund, C.N., Thornber, K.K.

المصدر: IEEE Journal of Solid-State Circuits; 1973, Vol. 8 Issue 2, p108-116, 9p

المؤلفون: Berglund, C.N.

المصدر: IEEE Journal of Solid-State Circuits; 1972, Vol. 7 Issue 2, p180-185, 6p