المؤلفون: Hirchaou, Y., Bauvent, T., Goes, W., Hylin, E.C., Blaise, P., Li, J., Pillonnet, G., Martinie, S., Triozon, F.

المصدر: 2024 IEEE European Solid-State Electronics Research Conference (ESSERC) ; page 557-560

الاتاحة: http://dx.doi.org/10.1109/esserc62670.2024.10719407
http://xplorestaging.ieee.org/ielx8/10719398/10719399/10719407.pdf?arnumber=10719407