المؤلفون: VANDIER, Quentin, FREMONT, Helene, DROUIN, Dominique

المصدر: crossref

مصطلحات موضوعية: Sensors, Moisture, Flip-chip devices, Humidity, Moisture measurement, Carbon nanotubes, Relative humidity sensors, FC-PBGA, Moisture diffusion, Long-term high-humidity storage, Absorption, Ball grid arrays, Desorption, Finite difference methods, Multi-wall carbon nanotubes, Nanosensors, Flip chip plastic ball grid array (FC-PBGA), Relative humidity (RH) sensors, Sciences de l'ingénieur [physics]

Relation: oai:crossref.org:10.1109/tcpmt.2022.3226139; https://oskar-bordeaux.fr/handle/20.500.12278/173185

الاتاحة: https://oskar-bordeaux.fr/handle/20.500.12278/173185
https://hdl.handle.net/20.500.12278/173185
https://doi.org/10.1109/tcpmt.2022.3226139

المؤلفون: Hosseini, S. M., Akbari, Saeed, Shokrieh, Mahmood Mehrdad

المصدر: IEEE Transactions on Components, Packaging, and Manufacturing Technology. 11(5):755-764

مصطلحات موضوعية: Electromagnetic compatibility, Finite element analysis, hole drilling method, Microelectronic packages, Microelectronics, Numerical models, Residual stresses, Strain, Stress measurement, thermal residual stresses, viscoelastic behavior, Ball grid arrays, Boreholes, Dies, Elasticity, Electronics packaging, Fabrication, Infill drilling, Strain gages, Viscoelasticity, Ball grid array packages, Epoxy molding compounds, Incremental hole drilling method, Microelectronic package, Microelectronics packages, Numerical and experimental study, Thermomechanical properties, Viscoelastic properties, Finite element method

وصف الملف: print

URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:ri:diva-53068

المؤلفون: Annovi, Alberto, Cerri, Alessandro, Corona, Pascal, Crescioli, Francesco, Martin, David, Pierre, Eric, Dittmeier, Sebastian, Föhner, Gunnar, Gottschalk, Dirk, Schöning, André, Frontini, Luca, Liberali, Valentino, Stabile, Alberto, Kordas, Kostas, Lari, Tommaso, Monti, Matteo, Motuk, Erdem, Warren, Matt, Vgenopoulos, Andreas

المساهمون: Laboratoire de Physique Nucléaire et de Hautes Énergies (LPNHE (UMR_7585)), Institut National de Physique Nucléaire et de Physique des Particules du CNRS (IN2P3)-Sorbonne Université (SU)-Centre National de la Recherche Scientifique (CNRS), ATLAS

المصدر: 11th International Conference on Modern Circuits and Systems Technologies
https://hal.science/hal-03769165
11th International Conference on Modern Circuits and Systems Technologies, Jun 2022, Bremen, Germany. ⟨10.1109/MOCAST54814.2022.9837600⟩

مصطلحات موضوعية: Associative memory, Power measurement, Microprocessors, Large Hadron Collider, Memory architecture, Metals, Hardware, application specific integrated circuits, ball grid arrays, CMOS memory circuits, content-addressable storage, integrated circuit design, microprocessor chips, nuclear electronics, final chip, ATLAS experiment, high-luminosity large hadron collider, HL-LHC, CMOS technology, metal layers, FCBGA package, digital chip, full-custom CAM cell design, test vectors, in-house testing, laboratory test-benches, related test-boards, AM08 associative memory ASIC design, hardware track trigger system, CERN

جغرافية الموضوع: Bremen, Germany

Relation: hal-03769165; https://hal.science/hal-03769165; INSPIRE: 2140167

الاتاحة: https://hal.science/hal-03769165
https://doi.org/10.1109/MOCAST54814.2022.9837600

المؤلفون: Yi, Sung, Lam, Tatiana M.

المصدر: Microelectronics International: An International Journal, 2012, Vol. 29, Issue 3, pp. 163-171.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/13565361211252926

المؤلفون: Ahmad Ghazie A. Razak, Kazuhiro Nogita, Mohd A. A. Mohd Salleh, Selena Smith, Shiqian Liu, Stuart D. McDonald, Takatoshi Nishimura, Tetsuya Akaiwa, Yueqin Wu

المصدر: Transactions of The Japan Institute of Electronics Packaging. 2017, 10:E17-1

المؤلفون: Xu, Fei, Li, C.R., Jiang, T.M., Zhang, D.P.

المصدر: Experimental techniques (Westport, Conn.). 40(5):1421-1435

مصطلحات موضوعية: Ball grid arrays, Chains, Electronics packaging, Fatigue damage, Fatigue of materials, Forecasting, Genetic algorithms, Modal analysis, Natural frequencies, Power spectral density, Printed circuit boards, Soldered joints, Spectral density, Surface properties, Vibration analysis, Weibull distribution, Fatigue life prediction, Model updating, PBGA, Random vibrations, Response surface, Finite element method

وصف الملف: print

URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:bth-13079

المؤلفون: Annovi, Alberto, Calderini, Giovanni, Crescioli, Francesco, de Canio, Francesco, Frontini, Luca, Kubota, Takashi, Liberali, Valentino, Luciano, Pierluigi, Palla, Fabrizio, Shojaii, Seyed Ruhollah, Sotiropoulou, Calliope-Louisa, Stabile, Alberto, Traversi, Gianluca

المساهمون: Laboratoire de Physique Nucléaire et de Hautes Énergies (LPNHE (UMR_7585)), Institut National de Physique Nucléaire et de Physique des Particules du CNRS (IN2P3)-Université Paris Diderot - Paris 7 (UPD7)-Sorbonne Université (SU)-Centre National de la Recherche Scientifique (CNRS), ANR-13-BS05-0011,FastTrack,Développement d'un système électronique de reconstruction de traces pour les expériences du grand collisionneur de hadrons.(2013)

المصدر: 6th International Conference on Modern Circuits and Systems Technologies
https://hal.science/hal-01669639
6th International Conference on Modern Circuits and Systems Technologies, May 2017, Thessaloniki, Greece. pp.7937632, ⟨10.1109/MOCAST.2017.7937632⟩

مصطلحات موضوعية: Cams, Clocks, Analytical models, Large Hadron Collider, Circuits and systems, Associative memory, Computer architecture, ball grid arrays, CMOS memory circuits, field programmable gate arrays, low-power electronics, memory architecture, power consumption, low-power associative memory, high-density associative memory, CMOS technology, reduced power consumption, memory cell area density, FPGA, LVDS drivers, AM chip design, ball grid array standalone package, silicon in package, size 28 nm, density, electronics, fabrication, integrated circuit: design, [INFO]Computer Science [cs], [PHYS.PHYS.PHYS-INS-DET]Physics [physics]/Physics [physics]/Instrumentation and Detectors [physics.ins-det]

جغرافية الموضوع: Thessaloniki, Greece

Relation: INSPIRE: 1639116

الاتاحة: https://hal.science/hal-01669639
https://doi.org/10.1109/MOCAST.2017.7937632

المؤلفون: Charles Goldsmith, Da-Yuan. Shih, Donald W. Henderson, Jay Bartelo, Karl Puttlitz, Paul Lauro, Steve R. Cain, Sung K. Kang, Tae K. Hwang, Timothy Gosselin, Won K. Choi

المصدر: MATERIALS TRANSACTIONS. 2004, 45(3):695

المؤلفون: Jin, Shuai, Liu, Dazhao, Wang, Yansheng, Chen, Bichen, Fan, Jun

المصدر: Electrical and Computer Engineering Faculty Research & Creative Works

مصطلحات موضوعية: Ball grid arrays, Cavity resonators, Current density, Electric conductors, Electric impedance, Electronics packaging, Extraction, Frequency modulation, Inductance, Semiconductor device testing, Soldered joints, Cavity method, Equivalent inductance, Finite element method simulation, Modal expansion, Parallel plates, Power Distribution Network Design, Power integrity, Proximity effects, Finite element method, Analytical solution, Application-specified integrated circuit (ASIC) package, Ball grid array (BGA), Equivalent ball inductances, Parallel plate impedance, Electromagnetics and Photonics

Relation: https://scholarsmine.mst.edu/ele_comeng_facwork/3554; https://doi.org/10.1109/TEMC.2017.2782713

الاتاحة: https://scholarsmine.mst.edu/ele_comeng_facwork/3554
https://doi.org/10.1109/TEMC.2017.2782713

المؤلفون: Seyed Ruhollah Shojaii, Takashi Kubota, Francesco Crescioli, Valentino Liberali, Gianluca Traversi, Pierluigi Luciano, Fabrizio Palla, G. Calderini, Calliope Louisa Sotiropoulou, Alberto Annovi, Alberto Stabile, Luca Frontini, Francesco De Canio

المساهمون: Laboratoire de Physique Nucléaire et de Hautes Énergies (LPNHE (UMR_7585)), Institut National de Physique Nucléaire et de Physique des Particules du CNRS (IN2P3)-Université Paris Diderot - Paris 7 (UPD7)-Sorbonne Université (SU)-Centre National de la Recherche Scientifique (CNRS)

المصدر: 6th International Conference on Modern Circuits and Systems Technologies
6th International Conference on Modern Circuits and Systems Technologies, May 2017, Thessaloniki, Greece. pp.7937632, ⟨10.1109/MOCAST.2017.7937632⟩
MOCAST

مصطلحات موضوعية: Engineering, 02 engineering and technology, Integrated circuit design, fabrication, silicon in package, reduced power consumption, Circuits and systems, Settore ING-INF/01 - Elettronica, Memory cell, Ball grid array, 0202 electrical engineering, electronic engineering, information engineering, Hardware_INTEGRATEDCIRCUITS, low-power associative memory, ball grid array standalone package, ball grid arrays, [INFO]Computer Science [cs], Analytical models, Computer architecture, [PHYS.PHYS.PHYS-INS-DET]Physics [physics]/Physics [physics]/Instrumentation and Detectors [physics.ins-det], Field-programmable gate array, Cams, FPGA, field programmable gate arrays, Clocks, density, business.industry, memory cell area density, electronics, Associative memory, 020208 electrical & electronic engineering, size 28 nm, power consumption, memory architecture, AM chip design, Content-addressable memory, Chip, CMOS technology, CMOS, Large Hadron Collider, Embedded system, high-density associative memory, integrated circuit: design, CMOS memory circuits, low-power electronics, Signal integrity, business, LVDS drivers, Computer hardware

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::82bd9261eacdac6d760d44212d9fcc4c
https://hal.archives-ouvertes.fr/hal-01669639

المؤلفون: Hosseini, S. M., Akbari, Saeed, Shokrieh, M. M.

المصدر: Microelectronics and reliability. 102

مصطلحات موضوعية: Ball grid array (BGA) package, Finite element modeling, Incremental hole drilling, Residual stress, Strain gauge, Boreholes, Elasticity, Electronics packaging, Finite element method, Glass ceramics, Infill drilling, Microelectronics, Residual stresses, Strain, Strain gages, Ball grid array packages, Composite substrate, Hole drilling, Incremental hole drilling method, Microelectronic package, Microelectronics packages, Strain gauge rosette, Thermomechanical properties, Ball grid arrays

وصف الملف: print

URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:ri:diva-39843

المؤلفون: Brinkfeldt, Klas, Wetter, Göran, Lövberg, Andreas, Tegehall, Per-Erik, Andersson, Dag, Strandberg, Jan, Goncalves, Johnny, Söderlund, Jonas, Kwarnmark, Mikael

المصدر: Journal of Electronic Packaging. 141(3)

مصطلحات موضوعية: Automobile electronic equipment, Automobile manufacture, Ball grid arrays, Condition monitoring, Electric sensing devices, Integrated circuit manufacture, Piezoelectric devices, Piezoelectric transducers, Piezoelectricity, Printed circuit manufacture, Safety engineering, Soldering, Timing circuits, Electronic assemblies, Hardware reliability, Physics of failure models, Piezoelectric sensors, Polyvinylidene fluorides, Printed circuit boards (PCB), Prognostics and health managements, Safety critical applications, Printed circuit boards

وصف الملف: print

URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:ri:diva-39053

المؤلفون: Chen, Bichen, Ouyang, Muqi, Yong, Shaohui, Wang, Yansheng, Wang, Junda, Jin, Shuai, Bai, Yadong, Zhou, Yan, Fan, Jun

المصدر: Electrical and Computer Engineering Faculty Research & Creative Works

مصطلحات موضوعية: Ball grid arrays, Crosstalk, Design of experiments, Electromagnetic compatibility, Electromagnetic shielding, Polychlorinated biphenyls, Channel crosstalk, Crosstalk noise, Crosstalk ratio, Design spaces, Fan Out, Input factors, Manufacturing cost, Physical dimensions, Analysis of variance (ANOVA), DoE, Dog bone fan-out, FFD, ICN, Via-in-pad fan-out, Electrical and Computer Engineering

Relation: https://scholarsmine.mst.edu/ele_comeng_facwork/3531; https://doi.org/10.1109/ISEMC.2017.8077851

الاتاحة: https://scholarsmine.mst.edu/ele_comeng_facwork/3531
https://doi.org/10.1109/ISEMC.2017.8077851

المؤلفون: Ramdan, Dadan, Darianto, Khor, Chu Yee

مصطلحات موضوعية: plastic ball grid arrays (pbga), response surface methodology (rsm), central composite design (ccd), fluid structure interaction

وصف الملف: application/pdf

Relation: http://repository.uma.ac.id/handle/123456789/15293

الاتاحة: http://repository.uma.ac.id/handle/123456789/15293

المؤلفون: Sumimoto, Tetsuhiro, Maruyama, Toshinori, Azuma, Yoshiharu, Goto, Sachiko, Mondou, Munehiro, Furukawa, Noboru, Okada, Saburo

المصدر: Industrial Technology

مصطلحات موضوعية: X-ray imaging, ball grid arrays, inspection, printed circuit manufacture, quality control, surface mount technology

Relation: https://ousar.lib.okayama-u.ac.jp/files/public/3/32919/20160528025251946418/fulltext.pdf; https://ousar.lib.okayama-u.ac.jp/32919

الاتاحة: https://ousar.lib.okayama-u.ac.jp/files/public/3/32919/20160528025251946418/fulltext.pdf
https://ousar.lib.okayama-u.ac.jp/32919

المؤلفون: Sumimoto, Tetsuhiro, Maruyama, Toshinori, Azuma, Yoshiharu, Goto, Sachiko, Mondou, Munehiro, Furukawa, Noboru, Okada, Saburo

المصدر: Instrumentation and Measurement Technology Conference

مصطلحات موضوعية: X-ray imaging, ball grid arrays, image processing, inspection, printed circuit manufacture, quality control, surface mount technology

Relation: https://ousar.lib.okayama-u.ac.jp/files/public/3/32915/2016052802582357196/fulltext.pdf; https://ousar.lib.okayama-u.ac.jp/32915

الاتاحة: https://ousar.lib.okayama-u.ac.jp/files/public/3/32915/2016052802582357196/fulltext.pdf
https://ousar.lib.okayama-u.ac.jp/32915

المؤلفون: Ko, Baekseok, Kim, Joowon, Ryoo, Jaemin, Hwang, Chulsoon, Kwon, Chankeun, Kim, Soowon

المصدر: Electrical and Computer Engineering Faculty Research & Creative Works

مصطلحات موضوعية: Ball Grid Arrays, Budget Control, Design, Electric Power Transmission, Noise Pollution, Resonant Circuits, System-On-Chip, Electrical and Computer Engineering

Relation: https://scholarsmine.mst.edu/ele_comeng_facwork/2363; https://doi.org/10.1049/iet-cds.2015.0285

الاتاحة: https://scholarsmine.mst.edu/ele_comeng_facwork/2363
https://doi.org/10.1049/iet-cds.2015.0285

المؤلفون: Zheng, Liqiang, Mathewson, Alan, O'Flynn, Brendan, Hayes, Michael, Ó Mathúna, S. Cian

مصطلحات موضوعية: Ball grid arrays, Flip-chip devices, Integrated circuit interconnections, Radiofrequency integrated circuits, Transceivers, RF performance analysis, Antenna connector, Bare die flip-chip, Impedance mismatch, Interconnect technology, Passive components, Return loss, Wireless sensor node modelling, Wireless sensor networks, Flip chip technology

وصف الملف: application/pdf

Relation: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP); Zheng, Liqiang; Mathewson, Alan; O'Flynn, Brendan; Hayes, Michael; Ó Mathúna, S. Cian (2010) Statistical method of modeling and optimization for wireless sensor nodes with different interconnect technologies and substrates. In: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP). Xi'an, China, 16-18 Aug. 2010.; 865; 860; http://hdl.handle.net/10468/482

الاتاحة: http://hdl.handle.net/10468/482
https://doi.org/10.1109/ICEPT.2010.5582406

المؤلفون: N. Furukawa, Saburo Okada, Tetsuhiro Sumimoto, M. Mondou, Yoshiharu Azuma, Sachiko Goto, Toshinori Maruyama

المصدر: Instrumentation and Measurement Technology Conference. 2:1131-1136

مصطلحات موضوعية: Production line, Surface-mount technology, Engineering, business.industry, X-ray imaging, Process (computing), Mechanical engineering, Image processing, surface mount technology, image processing, Ball grid array, Soldering, printed circuit manufacture, Electronic engineering, ball grid arrays, Integrated circuit packaging, inspection, quality control, business, Electronic circuit

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cddac3a1da4ea31b93683a9b5722b002
https://ousar.lib.okayama-u.ac.jp/32915

المؤلفون: ALONGE, Francesco, D'IPPOLITO, Filippo, RAIMONDI, Francesco Maria, AIELLO, Vincenzo

المساهمون: ALONGE F, DIPPOLITO F, RAIMONDI F M, AIELLO V

مصطلحات موضوعية: Ball Grid Arrays (BGA), Control parameter, Open loop control algorithms, Settore ING-INF/04 - Automatica

Relation: info:eu-repo/semantics/altIdentifier/isbn/078039402X; info:eu-repo/semantics/altIdentifier/wos/WOS:000296356600023; ispartofbook:Proceedings of 10th IEEE International Conference on Emerging Technologies and Factory Automation; 10TH IEEE INTERNATIONAL CONFERENCE ON EMERGING TECHNOLOGIES AND FACTORY AUTOMATION, ETFA ’05; volume:2005; firstpage:171; lastpage:178; numberofpages:8; http://hdl.handle.net/10447/27942

الاتاحة: http://hdl.handle.net/10447/27942
https://doi.org/10.1109/ETFA.2005.1612677