المؤلفون: Fox, Robert, Augur, Rod, Child, Craig, Zaleski, Mark

Thesis Advisors: Technische Universität Chemnitz

المصدر: AMC 2015 – Advanced Metallization Conference

مصطلحات موضوعية: info:eu-repo/classification/ddc/620, ddc:620, Halbleiterindustrie, Integration, semiconductor manufacturing, process window, back end of line (BEOL), process integration, novel materials

Relation: urn:nbn:de:bsz:ch1-qucosa-206986; qucosa:20503

الاتاحة: https://monarch.qucosa.de/id/qucosa%3A20504
https://monarch.qucosa.de/api/qucosa%3A20504/attachment/ATT-0/
https://monarch.qucosa.de/api/qucosa%3A20504/attachment/ATT-1/

المؤلفون: Afzal, Francis O., Bian, Yusheng, Peng, Bo, Hu, Shuren, Dezfulian, Kevin, Nummy, Karen, Stricker, Andy, Aboketaf, Abdelsalam, Hedges, Crystal, Sowinski, Zoey, Rakowski, Michal, Lee, Won Suk, Augur, Rod, Riggs, Dave, Giewont, Ken, Weiss, Sharon M.

مصطلحات موضوعية: Physics - Applied Physics, Physics - Optics

URL الوصول: http://arxiv.org/abs/2005.03551

المؤلفون: Taha, Ayat, Chandran, Sujith, Viegas, Jaime, Bian, Yusheng, Rakowski, Michal, Augur, Rod, Jacob, Ajey, Dahlem, Marcus

المساهمون: Khalifa University/SRC Center of Excellence on Integrated Photonics

المصدر: IEEE Photonics Journal ; volume 13, issue 4, page 1-6 ; ISSN 1943-0655 1943-0647

الاتاحة: http://dx.doi.org/10.1109/jphot.2021.3099436
http://xplorestaging.ieee.org/ielx7/4563994/9470958/09495107.pdf?arnumber=9495107

المؤلفون: Bian, Yusheng, Hirokawa, Takako, Karra, Vaishnavi, Dasgupta, Arpan, Lee, Won Suk, Aboketaf, Abdelsalam, Afzal, Francis, Sporer, Ryan, Nummy, Karen, Giewont, Ken, Harris, Nickolas C., Baghdadi, Reza, Gupta, Shashank, Donegan, Keith, Houghton, Thomas, Popielarski, Brian, Dezfulian, Kevin K., Todorov, Petar Ivanov, Peng, Bo, Chandran, Sujith, Gheith, Mohamed, Stobert, Ian, Ghosal, Mini Modh, Cho, Jae Kyu, Vakil, Apoorva, Kim, Sunoo, Wu, Zhuo-Jie George, Stricker, Andy, McLean, Kate, Fasano, Benjamin V, Rakowski, Michal, Liu, Qidi, Rauer, Matt, Gallagher, Ryan, Sirdeshmukh, Ranjani, Robson, Norm, Melville, Ian, Augur, Rod, Lee, Jae Gon, Lin, Wenhe, Gifford, George, Fox, Robert, Gupta, Vikas, Yu, Anthony, Pellerin, John, Letavic, Ted

المصدر: 2023 Optical Fiber Communications Conference and Exhibition (OFC)

الاتاحة: http://dx.doi.org/10.23919/ofc49934.2023.10117427
http://xplorestaging.ieee.org/ielx7/10115459/10115461/10117427.pdf?arnumber=10117427

المؤلفون: Bian, Yusheng, Ramachandran, Koushik, Wu, Zhuo-Jie, Hedrick, Brittany, Dezfulian, Kevin K., Houghton, Thomas, Nummy, Karen, Fisher, Daniel, Hirokawa, Takako, Donegan, Keith, Afzal, Francis O, Esopi, Monica, Karra, Vaishnavi, Lee, Won Suk, Sorbara, Massimo, Lubguban, Jorge, Cho, Jae Kyu, Cao, Rongtao, Ding, Hanyi, Chandran, Sujith, Rakowski, Michal, Aboketaf, Abdelsalam, Krishnamurthy, Subramanian, Mills, Scott, Peng, Bo, Pepper, Jeff, Deka, Suruj, Feng, Wen, Rishton, Steven, Boudreau, Marcel, Logan, Dylan, Hickey, Ryan, Gomes, Prova Christina, Murray, Kyle, Dewanjee, Arnab, Riggs, Dave, Robson, Norman, Melville, Ian, Augur, Rod, Fox, Robert, Gupta, Vikas, Yu, Anthony, Giewont, Ken, Pellerin, John, Letavic, Ted

المصدر: IEEE Journal of Selected Topics in Quantum Electronics ; page 1-19 ; ISSN 1077-260X 1558-4542

الاتاحة: http://dx.doi.org/10.1109/jstqe.2023.3238290
http://xplorestaging.ieee.org/ielx7/2944/4481213/10021968.pdf?arnumber=10021968

المؤلفون: Papadovasilakis, Marios, Chandran, Sujith, Gebregiorgis, Yonas, Bian, Yusheng, Rakowski, Michal, Aboketaf, Abdelsalam, Augur, Rod, Viegas, Jaime

المصدر: Journal of Lightwave Technology; January 2024, Vol. 42 Issue: 1 p258-267, 10p

المؤلفون: Bian, Yusheng, Ramachandran, Koushik, Peng, Bo, Hedrick, Brittany, Mills, Scott, Donegan, Keith, Esopi, Monica, Hirokawa, Takako, Jacob, Ajey, Karra, Vaishnavi, Yasar, Firat, Fasano, Benjamin, Sahin, Asli, Houghton, Thomas, Nummy, Karen, Rundquist, Armand, Vail, Ed, Ding, Hanyi, Dezfulian, Kevin, Wu, Zhuojie, Fisher, Daniel, Pape, Jim, Steffes, Jay, Medina, Louis, Roy, Subharup Gupta, Cox, Harry, Green, Bart, Lubguban, Jorge, Chowdhury, Asif, Lee, Won Suk, Aboketaf, Abdelsalam, Rakowski, Michal, McLean, Kate, Sowinski, Zoey, Kwou, Oh-Jung, Robert, Gabrielle, Sorbara, Massimo, Krishnamurthy, Subramanian, Stricker, Andy, Cho, Jae Kyu, Melville, Ian, Riggs, Dave, Augur, Rod, Robson, Norman, Berger, Daniel, Lee, Luke, Gupta, Vikas, Yu, Anthony, Giewont, Ken, Letavic, Ted

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

الاتاحة: http://dx.doi.org/10.1109/ectc32696.2021.00048
http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501726.pdf?arnumber=9501726

المؤلفون: Bian, Yusheng, Ramachandran, Koushik, Peng, Bo, Hedrick, Brittany, Donegan, Keith, Lubguban, Jorge, Fasano, Benjamin, Rundquist, Armand, Pape, Jim, Sahin, Asli, Houghton, Thomas, Nummy, Karen, Steffes, Jay, Medina, Louis, Roy, Subharup Gupta, Cox, Harry, Green, Bart, Dezfulian, Kevin, Lee, Won Suk, Stricker, Andy, Mclean, Kate, Hu, Shuren, Sowinski, Zoey, Meagher, Colleen, Aboketaf, Abdelsalam, Rakowski, Michal, Randall, Mai, Melville, Ian, Riggs, Dave, Jacob, Ajey, Augur, Rod, Berger, Daniel, Yu, Anthony, Giewont, Ken, Pellerin, John

المصدر: 2020 IEEE Photonics Conference (IPC)

الاتاحة: http://dx.doi.org/10.1109/ipc47351.2020.9252280
http://xplorestaging.ieee.org/ielx7/9252189/9252106/09252280.pdf?arnumber=9252280

المؤلفون: Xu, Dewei, Srivastava, Ravi, Katakamsetty, Ushasree, de la Garza, Ernesto Gene, Kim, Hyung Woo, Augur, Rod, Fox, Robert

المصدر: 2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ; volume 9781, page 121-123

الاتاحة: http://dx.doi.org/10.1109/asmc.2018.8373150
http://xplorestaging.ieee.org/ielx7/8370149/8373135/08373150.pdf?arnumber=8373150

المؤلفون: Beece, Adam, Milojevic, Dragomir, Plas, Geert Van der, Augur, Rod, Sureddin, Michelle, Singh, Jagar, Senapati, Biswanath, Bouche, Guillaume, Alapati, Ramakanth, Stephens, Jason, Lin, Irene, Rashed, Mahbub, Yuan, Lu, Kye, Jongwook, Woo, Youngtag, Wehbi, Ali, Hang, Peter, Ton-that, Van, Kanagala, Vijay, Yu, Donald, Gao, Shan, Samavedam, Srikant

المصدر: In: International Microelectronics Assembly and Packaging Society (IMAPS) 48th Conference

مصطلحات موضوعية: Sciences de l'ingénieur, Heterogeneous 3DIC, Cost modelling

وصف الملف: No full-text files

Relation: http://hdl.handle.net/2013/ULB-DIPOT:oai:dipot.ulb.ac.be:2013/225911

الاتاحة: http://hdl.handle.net/2013/ULB-DIPOT:oai:dipot.ulb.ac.be:2013/225911

المؤلفون: Chandran, Sujith, Dahlem, Marcus, Bian, Yusheng, Moreira, Paulo, Jacob, Ajey P., Rakowski, Michal, Stricker, Andy, Nummy, Karen, Meagher, Colleen, Peng, Bo, Thomas, Abu, Hu, Shuren, Petykiewicz, Jan, Sowinski, Zoey, Lee, Won Suk, Augur, Rod, Riggs, Dave, Letavic, Ted, Yu, Anthony, Giewont, Ken, Pellerin, John, Viegas, Jaime

المصدر: Optics Letters; November 2020, Vol. 45 Issue: 22 p6230-6233, 4p

المؤلفون: Technische Universität Chemnitz, Fox, Robert, Augur, Rod, Child, Craig, Zaleski, Mark

المصدر: AMC 2015 – Advanced Metallization Conference

مصطلحات الفهرس: info:eu-repo/classification/ddc/620, ddc:620, Halbleiterindustrie; Integration, semiconductor manufacturing, process window, back end of line (BEOL), process integration, novel materials, doc-type:conferenceObject, info:eu-repo/semantics/conferenceObject, doc-type:Text

URL: urn:nbn:de:bsz:ch1-qucosa-206986
qucosa:20503

المؤلفون: Michael, Nancy L., Kim, Choong-Un, Gillespie, Paul, Augur, Rod

المصدر: Journal of Electronic Materials ; volume 32, issue 10, page 988-993 ; ISSN 0361-5235 1543-186X

الاتاحة: http://dx.doi.org/10.1007/s11664-003-0080-8
http://link.springer.com/content/pdf/10.1007/s11664-003-0080-8.pdf
http://link.springer.com/article/10.1007/s11664-003-0080-8/fulltext.html
http://link.springer.com/content/pdf/10.1007/s11664-003-0080-8

المؤلفون: Kim, Choong-Un, Park, Jaeyong, Michael, Nancy, Gillespie, Paul, Augur, Rod

المصدر: Journal of Electronic Materials ; volume 32, issue 10, page 982-987 ; ISSN 0361-5235 1543-186X

الاتاحة: http://dx.doi.org/10.1007/s11664-003-0079-1
http://link.springer.com/content/pdf/10.1007/s11664-003-0079-1.pdf
http://link.springer.com/article/10.1007/s11664-003-0079-1/fulltext.html
http://link.springer.com/content/pdf/10.1007/s11664-003-0079-1

المؤلفون: Lee, Ki-Don, Lu, Xia, Ogawa, Ennis T., Matsuhashi, Hideki, Blaschke, Volker A., Augur, Rod, Ho, Paul S.

المصدر: MRS Proceedings ; volume 716 ; ISSN 0272-9172 1946-4274

الاتاحة: http://dx.doi.org/10.1557/proc-716-b12.9
https://www.cambridge.org/core/services/aop-cambridge-core/content/view/S1946427400124492

المؤلفون: Kim, Choong-Un, Michael, N. L., Jiang, Qing-Tang, Augur, Rod

المصدر: Review of Scientific Instruments ; volume 72, issue 10, page 3962-3967 ; ISSN 0034-6748 1089-7623

الاتاحة: http://dx.doi.org/10.1063/1.1400153
https://pubs.aip.org/aip/rsi/article-pdf/72/10/3962/19059738/3962_1_online.pdf

المؤلفون: Cheng, Lili, Kakita, Shinichiro, Fox, Robert, Motoyama, Emiko, Lee, Jusang, Azad, Nabil, Hart, Gregory, Ham, Sun, Sharma, Ankur, Beaudoin, Felix, Wenyi, Galor, Gene, Ernesto, Garza, de la, Babighian, Pietro, Wang, Tao, Yang, Xiaoming, Augur, Rod, Jung, Teck

المصدر: ECS Transactions; August 2017, Vol. 80 Issue: 4 p233-237, 5p