المؤلفون: Ruospo, A., Gavarini, G., de Sio, C., Guerrero, J., Sterpone, L., Reorda, M. Sonza, Sanchez, E., Mariani, R., Aribido, J., Athavale, J.

المصدر: 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE)

الاتاحة: http://dx.doi.org/10.23919/date56975.2023.10136998
http://xplorestaging.ieee.org/ielx7/10136870/10136706/10136998.pdf?arnumber=10136998

المؤلفون: Ruospo, A., Gavarini, G., Porsia, A., Reorda, M. Sonza, Sanchez, E., Mariani, R., Aribido, J., Athavale, J.

المصدر: 2023 IEEE European Test Symposium (ETS)

الاتاحة: http://dx.doi.org/10.1109/ets56758.2023.10174176
http://xplorestaging.ieee.org/ielx7/10173930/10173940/10174176.pdf?arnumber=10174176

المؤلفون: Angione, F., Appello, D., Aribido, J., Athavale, J., Bellarmino, N., Bernardi, P., Cantoro, R., De Sio, C., Foscale, T., Gavarini, G., Guerrero, J., Huch, M., Iaria, G., Kilian, T., Mariani, R., Martone, R., Ruospo, A., Sanchez, E., Schlichtmann, U., Squillero, G., Sonza Reorda, M., Sterpone, L., Tancorre, V., Ugioli, R.

مصطلحات موضوعية: Àrees temàtiques de la UPC::Enginyeria electrònica::Microelectrònica, Microelectronics, Integrated circuits, Spintronics, DNNs reliability, Inter-wafer performance variation estimation, SLT-BI automatic test equipment, Microelectrònica, Circuits integrats, Espintrònica

وصف الملف: 10 p.; application/pdf

Relation: https://ieeexplore.ieee.org/xpl/conhome/9810327/proceeding; Angione, F. [et al.]. SP2 - Test, Reliability and Functional Safety Trends for Automotive System-on-Chip. A: 27th IEEE European Test Symposium (ETS). 2022; http://hdl.handle.net/2117/372166

الاتاحة: http://hdl.handle.net/2117/372166

المؤلفون: Angione, F., Appello, D., Athavale, J., Bellarmino, Nicolò, Bernardi, P., Cantoro, Riccardo, Sio, C. De, Foscale, T., Gavarini, G., Huch, Martin, Iaria, G., Kilian, Tobias, Mariani, R., Martone, Raffaele, Ruospo, A., Sanchez, E., Schlichtmann, Ulf, Squillero, Giovanni, Reorda, Matteo Sonza, Sterpone, Luca, Tancorre, V., Ugioli, R.

مصطلحات موضوعية: info:eu-repo/classification/ddc

Relation: https://mediatum.ub.tum.de/1700248

الاتاحة: https://mediatum.ub.tum.de/1700248

المؤلفون: F. Angione, D. Appello, J. Aribido, J. Athavale, N. Bellarmino, P. Bernardi, R. Cantoro, C. De Sio, T. Foscale, G. Gavarini, J. Guerrero, M. Huch, G. Iaria, T. Kilian, R. Mariani, R. Martone, A. Ruospo, E. Sanchez, U. Schlichtmann, G. Squillero, M. Sonza Reorda, L. Sterpone, V. Tancorre, R. Ugioli

المساهمون: Angione, F., Appello, D., Aribido, J., Athavale, J., Bellarmino, N., Bernardi, P., Cantoro, R., De Sio, C., Foscale, T., Gavarini, G., Guerrero, J., Huch, M., Iaria, G., Kilian, T., Mariani, R., Martone, R., Ruospo, A., Sanchez, E., Schlichtmann, U., Squillero, G., Sonza Reorda, M., Sterpone, L., Tancorre, V., Ugioli, R.

Relation: info:eu-repo/semantics/altIdentifier/isbn/978-1-6654-6706-3; info:eu-repo/semantics/altIdentifier/wos/WOS:000853268100012; ispartofbook:2022 IEEE European Test Symposium (ETS); 2022 IEEE European Test Symposium (ETS); firstpage:1; lastpage:10; numberofpages:10; http://hdl.handle.net/11583/2971400; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85134232808; https://ieeexplore.ieee.org/abstract/document/9810388

الاتاحة: http://hdl.handle.net/11583/2971400
https://doi.org/10.1109/ETS54262.2022.9810388
https://ieeexplore.ieee.org/abstract/document/9810388