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1Academic Journal
المؤلفون: Zhihao Ren, Jikai Xu, Xianhao Le, Chengkuo Lee
المصدر: Micromachines; Volume 12; Issue 8; Pages: 946
مصطلحات موضوعية: heterogeneous integration, wafer bonding, thin-film transfer, System-in-Package (SiP), sensor, 5G, 6G, photonics, power electronics, Internet of Thing (IoT), Artificial Intelligence of Thing (AIoT), wearable electronics
وصف الملف: application/pdf
Relation: https://dx.doi.org/10.3390/mi12080946
الاتاحة: https://doi.org/10.3390/mi12080946
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2
المؤلفون: Jikai Xu, Zhihao Ren, Chengkuo Lee, Xianhao Le
المصدر: Micromachines
Micromachines, Vol 12, Iss 946, p 946 (2021)مصطلحات موضوعية: Materials science, Fabrication, Internet of Thing (IoT), Wafer bonding, photonics, Silicon on insulator, wafer bonding, Nanotechnology, Hardware_PERFORMANCEANDRELIABILITY, Review, wearable electronics, sensor, System-in-Package (SiP), TJ1-1570, Hardware_INTEGRATEDCIRCUITS, Artificial Intelligence of Thing (AIoT), Wafer, Electronics, Mechanical engineering and machinery, Electrical and Electronic Engineering, Thin film, Wearable technology, 6G, business.industry, Mechanical Engineering, power electronics, Control and Systems Engineering, thin-film transfer, Photonics, business, heterogeneous integration, 5G
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3Review
المؤلفون: Ren, Zhihao, Xu, Jikai, Le, Xianhao, Lee, Chengkuo
المساهمون: COLLEGE OF DESIGN AND ENGINEERING, ELECTRICAL AND COMPUTER ENGINEERING
المصدر: Scopus OA2021
مصطلحات موضوعية: 5G, 6G, Artificial intelligence of thing (AIoT), Heterogeneous integration, Internet of thing (IoT), Photonics, Power electronics, Sensor, System-in-package (SiP), Thin-film transfer, Wafer bonding, Wearable electronics
Relation: Ren, Zhihao, Xu, Jikai, Le, Xianhao, Lee, Chengkuo (2021-08-11). Heterogeneous wafer bonding technology and thin-film transfer technology-enabling platform for the next generation applications beyond 5g. Micromachines 12 (8) : 946. ScholarBank@NUS Repository. https://doi.org/10.3390/mi12080946; https://scholarbank.nus.edu.sg/handle/10635/233780
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