المؤلفون: Ching-Ping Lin, Yuan-Ting Hsiao, Yu-Jen Andy Hsiao, Shu-Jen Chou, Ai-Ping Chen, Ching-I Kuo, Long-Fang Oliver Chen

المصدر: Mitochondrial DNA. Part B. Resources, Vol 4, Iss 2, Pp 2992-2993 (2019)

مصطلحات موضوعية: aquilaria sinensis, thymelaeaceae, agarwood, chloroplast genome, conservation, Genetics, QH426-470

Relation: http://dx.doi.org/10.1080/23802359.2019.1664954; https://doaj.org/toc/2380-2359; https://doaj.org/article/3b3539111cf54917b1c0a0769ede70dd

الاتاحة: https://doi.org/10.1080/23802359.2019.1664954
https://doaj.org/article/3b3539111cf54917b1c0a0769ede70dd

المؤلفون: Carl H. Naylor, Chelsey Dorow, O'brien Kevin P, Kirby Maxey, Arnab Sen Gupta, Andy Hsiao, Tronic Tristan A, Penumatcha Ashish Verma, Scott B. Clendenning, Gosavi Tanay, Matthew V. Metz, Michael Christenson, Sudarat Lee, Robert L. Bristol, Uygar E. Avci, Alaan Urusa, A. A. Oni, Hui Zhu

المصدر: IEEE Transactions on Electron Devices. 68:6592-6598

مصطلحات موضوعية: Materials science, Passivation, business.industry, Transistor, Electronic, Optical and Magnetic Materials, PMOS logic, law.invention, Atomic layer deposition, CMOS, law, MOSFET, Optoelectronics, Electrical and Electronic Engineering, business, NMOS logic, Molecular beam epitaxy

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d41c0f0bcfb98257799a5d37068b6f06
https://doi.org/10.1109/ted.2021.3118659

المؤلفون: Mohamed Sheikh, Tae-Kyu Lee, Andy Hsiao, Karl Loh, Edward Ibe

المصدر: Journal of Surface Mount Technology. 33:7-13

مصطلحات موضوعية: Materials science, Chip-scale package, Conformal coating, Salt spray test, Recrystallization (metallurgy), Wafer, Temperature cycling, Adhesive, Composite material, Corrosion

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3f1ee43aacb06d34721a34880c6f40e0
https://doi.org/10.37665/smt.v33i2.8

المؤلفون: Edward Ibe, Andy Hsiao, Steve Perng, Tae-Kyu Lee, Weidong Xie, Greg Baty, Karl Loh

المصدر: Journal of Surface Mount Technology. 33:22-27

مصطلحات موضوعية: Interconnection, Materials science, Chip-scale package, Fracture mechanics, Temperature cycling, Adhesive, Composite material, Microstructure, Cycling, Electron backscatter diffraction

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1d10209401f981c4bc049084e2acc9d4
https://doi.org/10.37665/smt.v33i2.10

المؤلفون: Mohamed Sheikh, Weidong Xie, Andy Hsiao, Steven Perng, Tae-Kyu Lee

المصدر: Journal of Electronic Materials. 50:699-709

مصطلحات موضوعية: 010302 applied physics, Interconnection, Materials science, Tension (physics), 02 engineering and technology, Temperature cycling, 021001 nanoscience & nanotechnology, Condensed Matter Physics, Compression (physics), 01 natural sciences, Electronic, Optical and Magnetic Materials, Printed circuit board, Ball grid array, Soldering, 0103 physical sciences, Materials Chemistry, Electrical and Electronic Engineering, Composite material, 0210 nano-technology, Joint (geology)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a53de8323fc54d325defec4e92106dca
https://doi.org/10.1007/s11664-020-08409-y

المؤلفون: Andy Hsiao, Soong-Chul Ro, Yulei Fu, Sohel Ahmed

المصدر: Mobile Technologies for Delivering Healthcare in Remote, Rural or Developing Regions ISBN: 9781839530470

مصطلحات موضوعية: Sustainable development, Entrepreneurship, Poverty, Higher education, business.industry, Political science, General partnership, Sustainability, Mobile technology, Public relations, business, mHealth

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6fe3f9efd53df4e301ee6cacec56393e
https://doi.org/10.1049/pbhe024e_ch1

المؤلفون: Michael Hobernicht, Andy Hsiao, Claris Leung, Vanessa Kung, Tugrul U. Daim, Kevin Camp

المصدر: Science, Technology and Innovation Studies ISBN: 9783030583002

مصطلحات موضوعية: Product (business), business.industry, Process (engineering), Manufacturing, New product development, Automotive industry, Market share, Industrial Revolution, business, Aerospace, Industrial organization

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f9c77178d64f1848d1b587bfdc27076a
https://doi.org/10.1007/978-3-030-58301-9_2

المؤلفون: Tae-Kyu Lee, Arman Ahari, Greg Baty, Peng Su, Andy Hsiao

المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Interconnection, Materials science, Silicon, chemistry, Soldering, Ball grid array, chemistry.chemical_element, Mechanical engineering, Temperature cycling, Microstructure, Flip chip, Electron backscatter diffraction

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ece08640f311c5503a1a3844a8f209af
https://doi.org/10.1109/ectc.2019.00171

المؤلفون: Weidong Xie, Steven Perng, Andy Hsiao, Tae-Kyu Lee, Mohamed Sheikh, Edward Ibe, Karl Loh

المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Printed circuit board, Materials science, Chip-scale package, Tension (physics), Ball grid array, Soldering, Conformal coating, Temperature cycling, Composite material, Compression (physics)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::64221292dfc24c49c6f7dd8dd56a5558
https://doi.org/10.1109/ectc.2018.00140