المؤلفون: Haji-Sheikh, A., Ghalambor, S., Agonafer, D.

المصدر: Inverse Problems in Science and Engineering ; volume 20, issue 6, page 841-855 ; ISSN 1741-5977 1741-5985

الاتاحة: http://dx.doi.org/10.1080/17415977.2011.653564
https://www.tandfonline.com/doi/pdf/10.1080/17415977.2011.653564

المؤلفون: Raman, Thiagarajan, Mirza, F., Agonafer, D., Lawrence, K.

المصدر: 29th IEEE Semiconductor Thermal Measurement and Management Symposium ; volume 8, page 130-136

الاتاحة: http://dx.doi.org/10.1109/semi-therm.2013.6526817
http://xplorestaging.ieee.org/ielx7/6520965/6526787/06526817.pdf?arnumber=6526817

المؤلفون: Hossain, M.M., Yongje Lee, Akhter, R., Agonafer, D., Pekin, S., Dishongh, T.

المصدر: Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium ; page 222-229

الاتاحة: http://dx.doi.org/10.1109/stherm.2006.1625232
http://xplorestaging.ieee.org/ielx5/10819/34115/01625232.pdf?arnumber=1625232

المؤلفون: Fasoro, A.A., Popa, D.O., Beardsley, H., Sin, J., Agonafer, D., Stephanou, H.E., Deeds, M.A.

المصدر: Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. ; volume 8, page 1365-1370

الاتاحة: http://dx.doi.org/10.1109/itherm.2006.1645504
http://xplorestaging.ieee.org/ielx5/10950/34484/01645504.pdf?arnumber=1645504

المؤلفون: Hossain, M.M., Zahedi, F., Agonafer, D., Viswanadham, P., Dunford, S.O.

المصدر: Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. ; page 1038-1048

الاتاحة: http://dx.doi.org/10.1109/itherm.2006.1645459
http://xplorestaging.ieee.org/ielx5/10950/34484/01645459.pdf?arnumber=1645459

المؤلفون: Dewan-Sandur, B.P., Kaisare, A., Agonafer, D., Amon, C., Pekin, S., Dishongh, T.

المصدر: 56th Electronic Components and Technology Conference 2006 ; volume 21, page 1963-1968

الاتاحة: http://dx.doi.org/10.1109/ectc.2006.1645929
http://xplorestaging.ieee.org/ielx5/10951/34490/01645929.pdf?arnumber=1645929

المؤلفون: Kole, A., Jeongsik Sin, Woo Ho Lee, Dan Popa, Agonafer, D., Stephanou, H.

المصدر: Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. ; page 1324-1329

الاتاحة: http://dx.doi.org/10.1109/itherm.2006.1645498
http://xplorestaging.ieee.org/ielx5/10950/34484/01645498.pdf?arnumber=1645498

المؤلفون: Kaisare, A., Agonafer, D., Haji-shiekh, A., Chrysler, G., Mahajan, R.

المصدر: Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium ; page 108-115

الاتاحة: http://dx.doi.org/10.1109/stherm.2006.1625214
http://xplorestaging.ieee.org/ielx5/10819/34115/01625214.pdf?arnumber=1625214

المؤلفون: Akhter, R., Sandur, B.P.D., Hossain, M., Kaisare, A., Agonafer, D., Lawrence, K., Dishongh, T.

المصدر: 24th Digital Avionics Systems Conference ; volume 2, page 9.C.1-1-9.C.1-14

الاتاحة: http://dx.doi.org/10.1109/dasc.2005.1563484
http://xplorestaging.ieee.org/ielx5/10454/33180/01563484.pdf?arnumber=1563484

المؤلفون: Asheghi, M., Agonafer, D.

المصدر: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) ; page 728-728

الاتاحة: http://dx.doi.org/10.1109/itherm.2004.1318376
http://xplorestaging.ieee.org/ielx5/9211/29212/01318376.pdf?arnumber=1318376

المؤلفون: Karajgikar, S., Lakhkar, N., Agonafer, D., Schmidt, R.

المصدر: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) ; volume 52, page 232-236

الاتاحة: http://dx.doi.org/10.1109/itherm.2004.1319179
http://xplorestaging.ieee.org/ielx5/9211/29232/01319179.pdf?arnumber=1319179

المؤلفون: Borovic, B., Lewis, F.L., Hossain, M.M., Agonafer, D., Kolesar, E.S.

المصدر: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) ; page 541-548

الاتاحة: http://dx.doi.org/10.1109/itherm.2004.1318331
http://xplorestaging.ieee.org/ielx5/9211/29212/01318331.pdf?arnumber=1318331

المؤلفون: Hossain, M.M., Agonafer, D., Viswanadham, P., Reinikainen, T.

المصدر: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543)

الاتاحة: http://dx.doi.org/10.1109/itherm.2004.1318305
http://xplorestaging.ieee.org/ielx5/9211/29212/01318305.pdf?arnumber=1318305

المؤلفون: Halvi, A.S., Ahn, W., Agonafer, D., Novotny, S.

المصدر: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543)

الاتاحة: http://dx.doi.org/10.1109/itherm.2004.1318352
http://xplorestaging.ieee.org/ielx5/9211/29212/01318352.pdf?arnumber=1318352

المؤلفون: Agwu Nnanna, A.G., Haji-Sheikh, A., Agonafer, D.

المصدر: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) ; page 292-297

الاتاحة: http://dx.doi.org/10.1109/itherm.2002.1012470
http://xplorestaging.ieee.org/ielx5/7908/21811/01012470.pdf?arnumber=1012470

المؤلفون: Kulkarni, A., Mulay, V., Agonafer, D., Schmidt, T.

المصدر: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) ; volume 102 130, page 403-407

الاتاحة: http://dx.doi.org/10.1109/itherm.2002.1012484
http://xplorestaging.ieee.org/ielx5/7908/21811/01012484.pdf?arnumber=1012484

المؤلفون: Agonafer, D., Furkay, S.

المصدر: InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88 ; page 85

الاتاحة: http://dx.doi.org/10.1109/itherm.1988.28682
http://xplorestaging.ieee.org/ielx2/742/1166/00028682.pdf?arnumber=28682

المؤلفون: Agonafer, D., Furkay, S.

المصدر: Sixth Annual IEEE Proceedings Semiconductor Thermal and Temperature Measurement Symposium ; page 103

الاتاحة: http://dx.doi.org/10.1109/stherm.1990.68498
http://xplorestaging.ieee.org/ielx2/103/2434/00068498.pdf?arnumber=68498

المؤلفون: Ghalambor, S., Agonafer, D., Haji-Sheikh, A.

المصدر: International Journal of Heat and Mass Transfer ; volume 55, issue 25-26, page 7434-7443 ; ISSN 0017-9310

الاتاحة: http://dx.doi.org/10.1016/j.ijheatmasstransfer.2012.07.030
https://api.elsevier.com/content/article/PII:S0017931012005662?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0017931012005662?httpAccept=text/plain

المؤلفون: Yeom, J, Agonafer, D D, Han, J-H, Shannon, M A

المصدر: Journal of Micromechanics and Microengineering ; volume 19, issue 6, page 065025 ; ISSN 0960-1317 1361-6439

الاتاحة: http://dx.doi.org/10.1088/0960-1317/19/6/065025