يعرض 1 - 20 نتائج من 34 نتيجة بحث عن '"3D devices"', وقت الاستعلام: 0.52s تنقيح النتائج
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    Academic Journal
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    Academic Journal

    المؤلفون: Ahmed, Muhammed Hassen

    المصدر: International Journal of New Practices in Management and Engineering; Vol. 11 No. 1S (2022): Special Issue: Advances in Lithography (Short Communication); 13 - 15 ; 2250-0839

    مصطلحات موضوعية: photolithography, 3D devices, masking, chemical vapor deposition

    وصف الملف: application/pdf

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    Academic Journal
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    Academic Journal
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    Academic Journal
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    Academic Journal
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    Academic Journal

    المساهمون: Universidade Estadual Paulista (UNESP)

    وصف الملف: 122-125

    Relation: Microelectronic Engineering; 0,604; http://dx.doi.org/10.1016/j.mee.2015.04.047; Microelectronic Engineering, v. 147, p. 122-125.; http://hdl.handle.net/11449/177340; 2-s2.0-84928490927; 2-s2.0-84928490927.pdf

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    Dissertation/ Thesis
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    Academic Journal

    المؤلفون: Hiroaki NISHIYAMA, 西山 宏昭

    المصدر: 精密工学会誌 / Journal of the Japan Society for Precision Engineering. 2015, 81(8):718

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    Conference

    المساهمون: School of Materials Science and Engineering, 2015 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Temasek Laboratories

    مصطلحات موضوعية: Engineering::Materials, Decapsulation, 3D Devices

    وصف الملف: application/pdf

    Relation: Kor, K. H. B., Liu, Q., Siah, Y. W., & Gan, C. L. (2015). Decapsulation of 3D multi-die stacked package. 2015 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, 465-468. doi:10.1109/IPFA.2015.7224433; https://hdl.handle.net/10356/143489; 2-s2.0-84949744570; 465; 468

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    المؤلفون: Y.W. Siah, H. B. Kor, Chee Lip Gan, Qing Liu

    المساهمون: School of Materials Science and Engineering, 2015 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Temasek Laboratories

    المصدر: 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits.

    وصف الملف: application/pdf

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    Academic Journal
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    Academic Journal
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    Dissertation/ Thesis

    المؤلفون: Kwag, Hye Rin

    المساهمون: Romer, Lewis H, Gracias, David H, Bevan, Michael A, Cui, Honggang, Katz, Howard E

    وصف الملف: application/pdf

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    المؤلفون: Salvador Cambronero, Iván

    المساهمون: Mellado Arteche, Martin, Mellado Arteche, Martín, Universitat Politècnica de València. Departamento de Ingeniería de Sistemas y Automática - Departament d'Enginyeria de Sistemes i Automàtica