المؤلفون: Arvind Sridhar, A. Vincenzi, Martino Ruggiero, David Atienza

المصدر: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 31:23-36

مصطلحات موضوعية: 2D/3D IC, Speedup, cooling, Design space exploration, Computer science, Multiprocessing, Hardware_PERFORMANCEANDRELIABILITY, Integrated circuit, Solid modeling, Parallel computing, Integrated circuit design, MPSoC, system-level design, thermal simulation, law.invention, thermal modeling, graphics processing units, law, Hardware_INTEGRATEDCIRCUITS, compact transient thermal model, Electrical and Electronic Engineering, Massively parallel, Electronic system-level design and verification, neural networks, Computer Graphics and Computer-Aided Design, multi-processor architectures, GPGPUS, Scalability, Software

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e6a321daef317f892f91fb952ac0b986
https://doi.org/10.1109/tcad.2011.2174236