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1Academic Journal
مصطلحات موضوعية: Cu/Sip複合材料, 熱壓燒結, 電子構裝材料, Cu/Sip composite, hot pressing, A1 additive, electronic packaging
Relation: 技術學刊(Journal of Technology), Vol. 15, No. 4, pp.673-682; http://ir.lib.ntust.edu.tw/handle/987654321/35955; http://ir.lib.ntust.edu.tw/bitstream/987654321/35955/-1/Development of Silicon Reinforced Copper Matrix Composites for Electronic Packaging.pdf
الاتاحة: http://ir.lib.ntust.edu.tw/handle/987654321/35955
http://ir.lib.ntust.edu.tw/bitstream/987654321/35955/-1/Development of Silicon Reinforced Copper Matrix Composites for Electronic Packaging.pdf -
2Academic Journal
مصطلحات موضوعية: SiCw晶须, CMAS玻璃陶瓷, 无压烧结, 热压烧结, SiC w whisker, CMAS glass ceramic, Normal sintering, Hot pressing
Relation: 厦门大学学报(自然科学版),1998,(6):88-92; XDZK806.016; http://dspace.xmu.edu.cn/handle/2288/98526
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3Academic Journal
المؤلفون: 王木琴
مصطلحات موضوعية: 粉末治金製程, 2014鋁合金, 真空熱壓燒結, powder metallurgy processing, 2014 aluminum alloy, vacuum hot compact sintering
Relation: 技術學刊(Journal of Technology), Vol. 7, No. 2, pp.141-146; http://ir.lib.ntust.edu.tw/handle/987654321/37556; http://ir.lib.ntust.edu.tw/bitstream/987654321/37556/-1/THE STUDY OF SINTERING AND HEAT TREATMENT OF 2014 ALUMINUM ALLOY.pdf
الاتاحة: http://ir.lib.ntust.edu.tw/handle/987654321/37556
http://ir.lib.ntust.edu.tw/bitstream/987654321/37556/-1/THE STUDY OF SINTERING AND HEAT TREATMENT OF 2014 ALUMINUM ALLOY.pdf -
4Dissertation/ Thesis
المؤلفون: 苏忠亮
المساهمون: 孙志梅
مصطلحات موضوعية: 无压烧结、热压烧结、Cr2AlC、铜基复合材料, pressureless sintering, hot pressing sintering, Cr2AlC, copper matrix composites
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5
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6Academic Journal
المساهمون: 北京大学物理系磁学专业, 北京大学物理系磁学专业 工农兵学员, 工农兵学员
المصدر: 知网
Relation: 磁性材料及器件.1976,(01),3-8.; 1285501; http://hdl.handle.net/20.500.11897/89979
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7Dissertation/ Thesis
المؤلفون: 高桂英
المساهمون: 陈立富
مصطلحات موضوعية: SiCw晶须, CMAS玻璃陶瓷, 微孔挤压, 热压烧结, SiCw whisker, CMAS glass-ceramic, micro-hole extrusion, hot-pressing