المؤلفون: Kosanovic, Stefan¹ (AUTHOR) kosanovic@ucla.edu, Sun, Kai² (AUTHOR), Jian, Ashley³ (AUTHOR), Zhai, Xin³ (AUTHOR), Mishra, Umesh⁴ (AUTHOR), Ahmadi, Elaheh^1,3 (AUTHOR)

المصدر: Journal of Applied Physics. 12/21/2024, Vol. 136 Issue 23, p1-9. 9p.

مصطلحات موضوعية: *SEMICONDUCTOR wafer bonding, *OHMIC resistance, *CRYSTAL orientation, *SUBSTRATES (Materials science), *GALLIUM nitride

المؤلفون: Johnson, Nolan

المصدر: SMT007 Magazine. Dec2024, Vol. 39 Issue 12, p10-18. 6p.

مصطلحات موضوعية: *MANUFACTURING processes, POLYMER light emitting diodes, SEMICONDUCTOR wafer bonding, LABS on a chip, GAUSSIAN beams, PULSED power systems, LED displays

المؤلفون: Sharma, Samridh, Arun Chandorkar, Saurabh

المصدر: Journal of Applied Physics; 12/14/2024, Vol. 136 Issue 22, p1-10, 10p

مصطلحات موضوعية: LASER Doppler vibrometer, FLUID flow, SEMICONDUCTOR wafer bonding, MICROELECTROMECHANICAL systems, NOISE measurement

المؤلفون: Zhao, Liang¹ (AUTHOR) l-zhao-4x5@eagle.sophia.ac.jp, Periyanayagam, Gandhi Kallarasan¹ (AUTHOR), Yada, Ryosuke¹ (AUTHOR), Zhang, Junyu¹ (AUTHOR), Kuroi, Mizuo¹ (AUTHOR), Shimomura, Kazuhiko¹ (AUTHOR)

المصدر: Physica Status Solidi. A: Applications & Materials Science. Nov2024, p1. 6p. 13 Illustrations.

مصطلحات موضوعية: *OPTICAL waveguides, *SEMICONDUCTOR wafer bonding, *SUBSTRATES (Materials science), *OPTICAL devices, *QUANTUM wells

المؤلفون: Li, Hanchao¹ (AUTHOR) e210181@e.ntu.edu.sg, Xie, Hanlin² (AUTHOR), Wang, Yue³ (AUTHOR), Yulia, Lekina⁴ (AUTHOR), Ranjan, Kumud⁵ (AUTHOR), Singh, Navab² (AUTHOR), Chung, Surasit² (AUTHOR), Lee, Kenneth E.³ (AUTHOR), Arulkumaran, Subramaniam⁵ (AUTHOR), Ing Ng, Geok^1,2,3 (AUTHOR) EGING@ntu.edu.sg

المصدر: Physica Status Solidi. A: Applications & Materials Science. Nov2024, Vol. 221 Issue 21, p1-6. 6p.

مصطلحات موضوعية: *SEMICONDUCTOR wafer bonding, *GALLIUM nitride, *TRANSISTORS, *SPECTROMETRY, *MODULATION-doped field-effect transistors

المؤلفون: Thiel, Lillian¹ (AUTHOR) lthiel@ucsb.edu, Castro, Joshua E.¹ (AUTHOR), Steiner, Trevor J.² (AUTHOR), Nguyen, Catherine L.³ (AUTHOR), Pechilis, Audrey⁴ (AUTHOR), Duan, Liao⁴ (AUTHOR), Lewis, Nicholas¹ (AUTHOR), Cole, Garrett D.³ (AUTHOR), Bowers, John E.^1,2 (AUTHOR), Moody, Galan¹ (AUTHOR) moody@ucsb.edu

المصدر: Applied Physics Letters. 9/23/2024, Vol. 125 Issue 13, p1-6. 6p.

مصطلحات موضوعية: *SEMICONDUCTOR wafer bonding, *PHOTOLITHOGRAPHY, *SIGNAL processing, *QUALITY factor, *RESONATORS

المؤلفون: Zhang, Yuqian¹ (AUTHOR), Sun, Changzheng¹ (AUTHOR) czsun@tsinghua.edu.cn, Xiong, Bing¹ (AUTHOR), Wang, Jian¹ (AUTHOR), Hao, Zhibiao¹ (AUTHOR), Wang, Lai¹ (AUTHOR), Han, Yanjun¹ (AUTHOR), Li, Hongtao¹ (AUTHOR), Luo, Yi¹ (AUTHOR)

المصدر: Applied Physics Letters. 8/26/2024, Vol. 125 Issue 9, p1-7. 7p.

مصطلحات موضوعية: *SEMICONDUCTOR wafer bonding, *PLASMA etching, *QUALITY factor, *OPTICAL materials, *OPTICAL losses

المصدر: Neue Verpackung. 10/22/2024, p34-37. 4p.

مصطلحات موضوعية: *SEMICONDUCTOR industry, SEALING (Technology), SEMICONDUCTOR wafer bonding, ELECTROSTATIC discharges, DENSITY

المؤلفون: Chen, Wan-Ting^1,2 (AUTHOR) 202234052@mail.sdu.edu.cn, Liu, Li¹ (AUTHOR) liulisddx@mail.sdu.edu.cn, Zhao, Jia^1,2 (AUTHOR) zhaojia@sdu.edu.cn, Zhang, Chen^1,2 (AUTHOR) zhaojia@sdu.edu.cn

المصدر: Nanomaterials (2079-4991). Apr2024, Vol. 14 Issue 8, p709. 13p.

مصطلحات موضوعية: *SEMICONDUCTOR wafer bonding, *INTEGRATED circuits, *ADHESIVES, *MAGNETOOPTICS

المؤلفون: Persson, B. N. J.^1,2 (AUTHOR) b.persson@fz-juelich.de, Mate, C. Mathew³ (AUTHOR)

المصدر: European Physical Journal B: Condensed Matter. Apr2024, Vol. 97 Issue 4, p1-13. 13p.

مصطلحات موضوعية: *SEMICONDUCTOR wafer bonding, *SURFACE roughness, *SURFACE topography, *WATER vapor, *HYDROPHILIC surfaces

المؤلفون: Mouriño, Paula, Mercadé, Laura, Sinusía Lozano, Miguel, Resta, Raquel, Griol, Amadeu, Ben Saddik, Karim, Barrigón, Enrique, Fernández‐Garrido, Sergio, García, Basilio Javier, Martínez, Alejandro, Gómez, Víctor J.

المصدر: Advanced Materials Technologies; Dec2024, Vol. 9 Issue 24, p1-10, 10p

مصطلحات موضوعية: INTEGRATED circuits, QUALITY factor, SILICON wafers, GALLIUM phosphide, SEMICONDUCTOR wafer bonding

المؤلفون: Meng, Debin, Li, Liwei, Liao, Bin-Kai, Yi, Xiaoke

المصدر: Applied Physics Letters; 12/16/2024, Vol. 125 Issue 25, p1-6, 6p

مصطلحات موضوعية: KERR electro-optical effect, FOUR-wave mixing, SEMICONDUCTOR wafer bonding, THERMAL stability, HIGH temperatures

المؤلفون: Deng, Ningkang, Qu, Yongfeng, Yuan, Jin, Yuan, Yuan, Hu, Wenbo, Wu, Shengli, Wang, Hongxing

المصدر: Journal of Materials Engineering & Performance; Dec2024, Vol. 33 Issue 24, p14381-14389, 9p

مصطلحات موضوعية: MOLECULAR dynamics, SEMICONDUCTOR wafer bonding, TRANSMISSION electron microscopy, INTERFACE structures, SURFACE temperature

المؤلفون: Feng, Wei¹ (AUTHOR) wei.feng@aist.go.jp, Shimamoto, Haruo¹ (AUTHOR) haruo.shimamoto@aist.go.jp, Kawagoe, Tsuyoshi² (AUTHOR) t.kawagoe@ultramemory.co.jp, Honma, Ichirou² (AUTHOR) i.homma@ultramemory.co.jp, Yamasaki, Masato² (AUTHOR) m.yamasaki@ultramemory.co.jp, Okutsu, Fumitake² (AUTHOR) f.okutsu@ultramemory.co.jp, Masuda, Takatoshi² (AUTHOR) t.masuda@ultramemory.co.jp, Kikuchi, Katsuya¹ (AUTHOR) k-kikuchi@aist.go.jp

المصدر: IEEE Transactions on Semiconductor Manufacturing. Aug2023, Vol. 36 Issue 3, p398-403. 6p.

مصطلحات موضوعية: *RANDOM access memory, SEMICONDUCTOR wafer bonding

المؤلفون: Zhang, Jay¹ (AUTHOR) zhangjj@corning.com, Ng, Chee-Hau² (AUTHOR) chee_hau_ng@umc.com, Kouassi, Sebastien³ (AUTHOR) skouassi@psemi.com

المصدر: IEEE Transactions on Semiconductor Manufacturing. Aug2023, Vol. 36 Issue 3, p340-344. 5p.

مصطلحات موضوعية: *ECONOMIES of scale, SURFACE roughness, SEMICONDUCTOR wafer bonding, GLASS coatings, GLASS

المؤلفون: Takeuchi, Kai¹ (AUTHOR) kai.takeuchi@tohoku.ac.jp, Suga, Tadatomo² (AUTHOR), Higurashi, Eiji¹ (AUTHOR)

المصدر: Scientific Reports. 1/13/2024, Vol. 14 Issue 1, p1-8. 8p.

مصطلحات موضوعية: *SEMICONDUCTOR wafer bonding, *ELECTRONIC packaging, *BOND strengths, *ELECTRONIC equipment, *TEMPERATURE

المؤلفون: Ye, Lezhi¹ (AUTHOR) yelezhi@bjut.edu.cn, Song, Xuanjie¹ (AUTHOR) songxj@emails.bjut.edu.cn, Yue, Chang¹ (AUTHOR) 15833860441@163.com

المصدر: Microelectronics International. 2024, Vol. 41 Issue 1, p32-40. 9p.

مصطلحات موضوعية: *SEALING (Technology), *SEMICONDUCTOR wafer bonding, *SEMICONDUCTOR manufacturing, *SEMICONDUCTOR wafers, *SEMICONDUCTOR design, *INTEGRATED circuits

المؤلفون: Khan, Mansoor¹ (AUTHOR) Mansoor.Khan@usn.no, Khan, Talha Masood² (AUTHOR)

المصدر: Microsystem Technologies. Dec2023, Vol. 29 Issue 12, p1729-1737. 9p.

مصطلحات موضوعية: *SEMICONDUCTOR wafer bonding, *ULTRASONIC transducers, *LEAKAGE, *RESONANCE, *GENETIC transduction

المؤلفون: Mohammed, Y. S.^1,2 (AUTHOR), Zhang, Kai² (AUTHOR), Heissler, S.³ (AUTHOR), Baumgart, H.^2,4 (AUTHOR), Elmustafa, A. A.^1,2 (AUTHOR) aelmusta@odu.edu

المصدر: Journal of Applied Physics. 8/14/2020, Vol. 128 Issue 6, p1-7. 7p. 2 Diagrams, 6 Graphs.

مصطلحات موضوعية: *RAMAN spectroscopy, *SEMICONDUCTOR wafer bonding, *NANOMECHANICS, *SURFACE coatings, *SURFACE cracks, *FREE surfaces, *NANOINDENTATION

Alternate Title: Bonding-Surface-Cleaning Technology for Preparing Piezoelectric Single-Crystal Thin-Film Wafer. (English)

المؤلفون: 刘善群, 丁雨憧, 陈哲明, 石自彬, 龙 勇, 邹少红, 庾桂秋, 张 莉

المصدر: Piezoelectrics & Acoustooptics; Oct2024, Vol. 46 Issue 5, p700-728, 5p

مصطلحات موضوعية: DICHROIC filters, SEMICONDUCTOR wafer bonding, HYGIENE, POLLUTANTS, PEROXIDES