يعرض 1 - 7 نتائج من 7 نتيجة بحث عن '"Reliability qualification"', وقت الاستعلام: 0.35s تنقيح النتائج
  1. 1
    Conference
    History of IEC Qualification Standards (Presentation)

    المساهمون: Wohlgemuth, John

    المصدر: Conference: Presented at the International PV Module Quality Assurance Forum, 15 July 2011, San Francisco, California; Other Information: NREL (National Renewable Energy Laboratory)

    وصف الملف: Medium: ED; Size: 443 KB

    URL الوصول: http://www.osti.gov/scitech/servlets/purl/1021810

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  2. 2
    Dissertation/ Thesis
    Evaluation and qualification of the reliability of components and electronic assembly processes for medical applications ; Evaluation et qualification de la fiabilité des composants et des procédés d’assemblages électroniques pour applications médicales

    المؤلفون: Indmeskine, Fatima-Ezahra

    المساهمون: Laboratoire Angevin de Recherche en Ingénierie des Systèmes (LARIS), Université d'Angers (UA), Université d'Angers, Abdessamad Kobi, Laurent Saintis

    المصدر: https://theses.hal.science/tel-04918270 ; Electronique. Université d'Angers, 2024. Français. ⟨NNT : 2024ANGE0029⟩.

    مصطلحات موضوعية: Reliability qualification, Experimental design, Accelerated testing, Electronic component, Active implantable medical device (AMID), Failure physics, Fides, Qualification de fiabilité, Dispositif médical implantable actif (DMIA), Physique de défaillance, [SPI.TRON]Engineering Sciences [physics]/Electronics

    Relation: NNT: 2024ANGE0029

    الاتاحة: https://theses.hal.science/tel-04918270
    https://theses.hal.science/tel-04918270v1/document
    https://theses.hal.science/tel-04918270v1/file/INDMESKINE.pdf

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  3. 3
    Academic Journal
    Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method

    المؤلفون: Cheng Qian, Jiajie Fan, Jiayi Fang, Chaohua Yu, Yi Ren, Xuejun Fan, Guoqi Zhang

    المصدر: Materials; Volume 10; Issue 10; Pages: 1181

    مصطلحات موضوعية: light-emitting diode, chip scale package, accelerated aging, step stress test, reliability qualification

    وصف الملف: application/pdf

    Relation: https://dx.doi.org/10.3390/ma10101181

    الاتاحة: https://doi.org/10.3390/ma10101181

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  4. 4
    Photometric and colorimetric assessment of LED chip scale packages by using a step-stress accelerated degradation test (SSADT) method

    المؤلفون: Chaohua Yu, Cheng Qian, Yi Ren, Xuejun Fan, Jiajie Fan, Jiayi Fang, Guoqi Zhang

    المصدر: Materials, 10(10)
    Materials
    Materials; Volume 10; Issue 10; Pages: 1181
    Materials, Vol 10, Iss 10, p 1181 (2017)

    مصطلحات موضوعية: Materials science, Thermal resistance, Nuclear engineering, Reliability qualification, 02 engineering and technology, Color temperature, 01 natural sciences, lcsh:Technology, Article, law.invention, Reliability (semiconductor), law, Light-emitting diode, 0103 physical sciences, Electronic engineering, General Materials Science, lcsh:Microscopy, lcsh:QC120-168.85, Step stress test, 010302 applied physics, lcsh:QH201-278.5, lcsh:T, light-emitting diode, chip scale package, accelerated aging, step stress test, reliability qualification, Test method, 021001 nanoscience & nanotechnology, Accelerated aging, lcsh:TA1-2040, Lumen maintenance, Chip scale package, Degradation (geology), lcsh:Descriptive and experimental mechanics, lcsh:Electrical engineering. Electronics. Nuclear engineering, 0210 nano-technology, lcsh:Engineering (General). Civil engineering (General), lcsh:TK1-9971

    وصف الملف: application/pdf

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f67abcba82e8b152a64a58f78e78f0e0
    http://resolver.tudelft.nl/uuid:70bdeffb-22dd-4b9f-bf7c-4a8a24ed902c

    View record in OpenAIRE

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  5. 5
    Utilization of advanced microelectronics in space applications

    المؤلفون: Kayali, S.

    مصطلحات موضوعية: microelectronics reliability qualification radiation effects

    وصف الملف: 4690334 bytes; application/pdf

    Relation: Non-volatile Memory Technology Symposium 2002; Honolulu, HI, USA; 02-2793; http://hdl.handle.net/2014/10684

    الاتاحة: http://hdl.handle.net/2014/10684

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  6. 6
    MEMS Reliability for Space Applications by Elimination of Potential Failure Modes Through Testing and Analysis

    المؤلفون: Man, K.

    مصطلحات موضوعية: MEMS devices reliability qualification failure mode test analysis modeling space environment mitigation

    وصف الملف: 1203251 bytes; application/pdf

    Relation: SPIE, Micromachining and Microfabrication Meeting; Santa Clara, California, USA; 99-1629; http://hdl.handle.net/2014/18163

    الاتاحة: http://hdl.handle.net/2014/18163

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  7. 7
    Electronic Resource
    Photometric and colorimetric assessment of LED chip scale packages by using a step-stress accelerated degradation test (SSADT) method

    المؤلفون: Qian, Cheng (author), Fan, Jiajie (author), Fang, Jiayi (author), Yu, Chaohua (author), Ren, Y. (author), Fan, Xuejun (author), Zhang, Kouchi (author)

    مصطلحات الفهرس: Accelerated aging, Chip scale package, Light-emitting diode, Reliability qualification, Step stress test, journal article

    URL: http://resolver.tudelft.nl/uuid:70bdeffb-22dd-4b9f-bf7c-4a8a24ed902c
    http://www.scopus.com/inward/record.url?scp=85032876691&partnerID=8YFLogxK
    http://resolver.tudelft.nl/uuid:70bdeffb-22dd-4b9f-bf7c-4a8a24ed902c
    http://www.scopus.com/inward/record.url?scp=85032876691&partnerID=8YFLogxK
    Materials--1996-1944--2a0ac4c2-b5aa-42cf-8cde-af414a2a130d

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